EPCOS B37941X5103K070 Multilayer ceramic capacitor Datasheet

Multilayer ceramic capacitors
Chip, MLSC, X7R
Series/Type:
Chip
Date:
February 2009
The following products presented in this data sheet are being withdrawn.
Substitute Products: See www.epcos.com/withdrawal_mlcc
Ordering Code
B37941X5333K060
B37941X5333K070
B37941X5473K060
Substitute Product
Date of
Withdrawal
2009-06-26
2009-06-26
2009-06-26
Deadline Last
Orders
2010-06-30
2010-06-30
2010-06-30
Last Shipments
2010-12-31
2010-12-31
2010-12-31
© EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Ordering Code
B37941X5473K070
B37941X5683K062
B37941X5683K072
B37941X5104K062
B37941X5104K072
B37941X1102K060
B37941X1102K070
B37941X1152K060
B37941X1152K070
B37941X1222K060
B37941X1222K070
B37941X1332K060
B37941X1332K070
B37941X1472K060
B37941X1472K070
B37941X1682K060
B37941X1682K070
B37941X1103K060
B37941X1103K070
B37941X1153K060
B37941X1153K070
B37941X1223K060
B37941X1223K070
B37931X5152K060
B37931X5152K070
B37931X5222K060
B37931X5222K070
B37931X5332K060
B37931X5332K070
B37931X5472K060
B37931X5472K070
B37931X5682K060
B37931X5682K070
B37931X5103K060
B37931X5103K070
B37931X1102K060
B37931X1102K070
Substitute Product
Date of
Withdrawal
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
Deadline Last
Orders
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
Last Shipments
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
For further information please contact your nearest EPCOS sales office, which will also support
you in selecting a suitable substitute. The addresses of our worldwide sales network are
presented at www.epcos.com/sales.
Multilayer ceramic capacitors
Chip
MLSC; X7R
General
The MLSC was developed for typical applications with a direct connection to the battery or generator in the automobile, as it satisfies the requirements of the automobile manufacturers for a series connection of two capacitors for battery applications in a single component.
It not only represents the only real alternative to the series connection of discrete capacitors, but
also offers advantages over these and other possible solutions, which contain only a single capacitor.
Compared with a series circuit made up of conventional ceramic capacitors, it allows the number
of components to be reduced. This reduces the space requirement on the circuit board and shortens the placement time. Because fewer components are used, the failure probability is additionally reduced.
The MLSC is based on proven MLCC technology, but has a more rugged design. This technology
offers highest reliability (ppb rate) on the basis of long field experience. Both undamaged and typically cracked MLSCs are characterized by a high breakdown voltage and high ESD and pulse
strength.
It may be used at temperatures of up to 150 °C with consideration of a voltage derating and with
brief temperature peaks of up to 175 °C without electrical stressing.
The MLSC is also manufactured to the specifications of the ppb level assurance system, and a
bending strength of 2 mm is assured on the basis of the rigorous piezoelectric method.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 16
Multilayer ceramic capacitors
MLSC; X7R
Ordering code system
B37941
X
1
103
Type and size
Chip size (inch/mm) = Temperature characteristic X7R:
0603/1608 B37931
0805/2012 B37941
Internal coding
"X" indicates MLSC type
Rated voltage
5 (Code) 50 VDC
1 (Code) 100 VDC
Capacitance, coded (example)
103 10 103 pF = 10 nF
104 10 104 pF = 100 nF
223 22 103 pF = 22 nF
Capacitance tolerance
K ±10% (standard)
Internal coding
Packaging
60 cardboard tape, 180-mm reel
62 blister tape, 180-mm reel
70 cardboard tape, 330-mm reel
72 blister tape, 330-mm reel
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 16
K
0
60
Multilayer ceramic capacitors
MLSC; X7R
Features
Two series-connected ceramic capacitors in a
single component
The MLSC thus satisfies the requirements of the
automobile manufacturers for applications on the
battery / generator (e.g. clamp 30 or clamp 15)
in a single component.
Reduction of the effects of a
bending fracture
placement fracture
solder-shock crack
thanks to a lower probability of a short circuit.
Evaluation criteria: Insulation resistance >10 k after the following treatment
bending until crack
humidity tests (85 °C/85% RH, rated voltage), 14 days
The breakdown voltage of MLSCs in the case of a typical bending crack is still greater than
five times the rated voltage.
Both undamaged and cracked MLSCs are capable of fulfilling the requirements to
ISO 7637 for 12 V automotive power systems, including load-dump and jump-start
requirements (24 V/1 h and 36 V/1 h).
Based on AEC-Q200 Rev-C
Applications
Automobile electronics
for direct connection to the car battery or generator
at positions with “stranding potential”
as RF filters in small motors (e.g. electrically operated windows)
Power electronics (e.g. DC/DC converters)
Smoothing capacitors (e.g. on the rechargeable battery in mobile equipment)
Cautions
A short circuit cannot be completely excluded. The use of MLSCs does not therefore result in
100% fail-safe operation, but in the event of a crack the probability of a short circuit can be
greatly reduced.
In the event of an untypical (bending) crack formation (e. g. double-sided crack or extreme
mounting crack) and other mechanical or thermal damage to the capacitor, the capacitor may
have a low ohmic state.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 16
Multilayer ceramic capacitors
MLSC; X7R
Termination
Nickel barrier terminations (Ni) for lead-free soldering
Options
Alternative capacitance values and tolerances available on request
Delivery mode
Cardboard and blister tape (blister tape for chip thickness ≥1.2 ±0.1 mm),
180-mm and 330-mm reel available
Electrical data
Temperature characteristic
Max. relative capacitance change
Climatic category
Standard
Dielectric
Rated voltage1)
Test voltage
Capacitance range
Dissipation factor
Insulation resistance2)
Insulation resistance2)
Time constant2)
Time constant2)
Operating temperature range
Ageing3)
X7R
within 55 ... +125 °C ∆C/C ±15
(IEC 60068-1)
55/125/56
EIA
Class 2
VR
50, 100
Vtest 2.5 VR/5 s
CR
1 nF ... 100 nF (E6)
(limit value)
tan δ < 25 10-3
(at +25 °C)
Rins
> 105
(at +125 °C)
Rins
> 104
(at +25 °C)
τ
> 1000
(at +125 °C)
τ
> 100
Top
55 ... +125
yes
1) Note: No operation on AC line.
2) For CR >10 nF the time constant τ = C Rins is given.
3) Refer to chapter "General technical information", "Ageing".
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 16
%
VDC
VDC
MΩ
MΩ
s
s
°C
Multilayer ceramic capacitors
MLSC; X7R
Capacitance tolerances
Code letter
K (standard)
Tolerance
±10%
Dimensional drawing
Dimensions (mm)
Case size
l
w
th
k
(inch)
(mm)
0603
1608
1.60 ±0.15
0.80 ±0.10
0.80 ±0.10
0.10 - 0.40
0805
2012
2.00 ±0.20
1.25 ±0.15
1.35 max.
0.13 - 0.75
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 16
Multilayer ceramic capacitors
MLSC; X7R
Recommended solder pad
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
0603/1608
0805/2012
Type
single chip
single chip
A
0.60 ... 0.70
0.60 ... 0.70
C
1.80 ... 2.20
2.20 ... 2.60
D
0.60 ... 0.80
0.80 ... 1.10
C
2.20 ... 2.80
2.80 ... 3.20
D
0.60 ... 0.80
0.80 ... 1.10
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
0603/1608
0805/2012
Type
single chip
single chip
A
0.80 ... 0.90
0.90 ... 1.00
Termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 16
Multilayer ceramic capacitors
MLSC; X7R
Product range for MLSC chip capacitors, X7R
Size
inch (l x w)
mm (l x w)
0603
1608
Type
CR \ VR (VDC)
0805
2012
B37931X
50
B37941X
100
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
22 nF
33 nF
47 nF
68 nF
100 nF
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 16
50
100
Multilayer ceramic capacitors
MLSC; X7R
Ordering codes and packing for MLSC, X7R, 50 VDC, nickel barrier terminations
Chip
thickness
mm
Cardboard
tape,
∅180-mm
reel
** 60
pcs./reel
Cardboard
tape,
∅330-mm
reel
** 70
pcs./reel
Case size 0603, 50 VDC
1.5 nF B37931X5152K0**
2.2 nF B37931X5222K0**
3.3 nF B37931X5332K0**
4.7 nF B37931X5472K0**
6.8 nF B37931X5682K0**
10 nF
B37931X5103K0**
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
4000
4000
4000
4000
4000
4000
16000
16000
16000
16000
16000
16000
Case size 0805, 50 VDC
33 nF
B37941X5333K0**
47 nF
B37941X5473K0**
68 nF
B37941X5683K0**
100 nF B37941X5104K0**
0.8 ±0.1
0.8 ±0.1
1.2 ±0.1
1.2 ±0.1
4000
4000
16000
16000
CR
Ordering code
Blister tape, Blister tape,
∅180-mm ∅330-mm
reel
reel
** 62
pcs./reel
** 72
pcs./reel
3000
3000
12000
12000
Ordering codes and packing for MLSC, X7R, 100 VDC, nickel barrier terminations
Chip thickness
mm
Cardboard tape,
∅180-mm reel
** 60
pcs./reel
Case size 0603, 100 VDC
1.0 nF B37931X1102K0**
0.8 ±0.1
4000
16000
Case size 0805, 100 VDC
1.0 nF B37941X1102K0**
1.5 nF B37941X1152K0**
2.2 nF B37941X1222K0**
3.3 nF B37941X1332K0**
4.7 nF B37941X1472K0**
6.8 nF B37941X1682K0**
10 nF
B37941X1103K0**
15 nF
B37941X1153K0**
22 nF
B37941X1223K0**
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
4000
4000
4000
4000
4000
4000
4000
4000
4000
16000
16000
16000
16000
16000
16000
16000
16000
16000
CR
Ordering code
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 16
Cardboard tape,
∅330-mm reel
** 70
pcs./reel
Multilayer ceramic capacitors
MLSC; X7R
Typical characteristics1)
Capacitance change ∆C/C25 versus
temperature T
Capacitance change ∆C/C0 versus
superimposed DC voltage V
Impedance |Z| versus
frequency f for case size 0603
Impedance |Z| versus
frequency f for case size 0805
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 16
Multilayer ceramic capacitors
MLSC; X7R
Typical characteristics1)
Dissipation factor tan δ versus temperature T
Insulation resistance Rins versus temperature T
Capacitance change ∆C/C1 versus time t
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 16
Multilayer ceramic capacitors
MLSC; X7R
Cautions and warnings
How to select ceramic capacitors
Remember the following when selecting ceramic capacitors:
1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on
AEC-Q200 Rev-C.
2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp
15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors
should be connected in series. Alternatively a ceramic capacitor with integrated series circuits
should be used in order to reduce the possibility of a short circuit caused by a fracture. The
MLSC from EPCOS contains such a series circuit in a single component.
3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter
“Effects on mechanical, thermal and electrical stress”, section 1.4).
4. Additional stress factors such as continuous operating voltage or application-specific derating
must be taken into account in the selection of components (refer to chapter “Reliability”).
Recommendations for the circuit board design
1. Components with an optimized geometrical design are preferable where permitted by the
application.
2. Use at least FR4 circuit board material.
3. Geometrically optimized circuit boards are preferable, especially those that cannot be
deformed.
4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a
circuit board. High bending forces may be exerted there when boards are separated and
during further processing of a board (e.g. when incorporating it in a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit
board.
6. Screw connections should not be used to fix a board or connect several boards. Components
should not be placed near screw holes. If screw connections are unavoidable, they should be
cushioned, for instance using rubber pads.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 16
Multilayer ceramic capacitors
MLSC; X7R
Recommendations for processing
1. Ensure correct positioning of a ceramic capacitor on the solder pad.
2. Be careful when using casting, injection-molded and molding compounds and cleaning
agents. They can damage a capacitor.
3. Support a circuit board and reduce placement forces.
4. Do not straighten a board (manually) if it is distorted by soldering.
5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or
breaking).
6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or
snap-in components) because of the danger of bending and fracture.
7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that
components are not damaged.
8. Avoid excessive force when plugging a connector into a device soldered onto a board.
9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is
permissible for them (see chapter “Soldering directions”).
10. When soldering, select the softest solder profile possible (heating time, peak temperature,
cooling time) to avoid thermal stress and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement.
13. Ceramic capacitors with external silver-palladium terminations are intended for conductive
adhesion - they are not suited for lead-free soldering processes.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 16
Multilayer ceramic capacitors
MLSC; X7R
Symbols and terms
Symbol
English
German
A
Area
Fläche
C
C0
C1
CR
C20
C25
∆C
Capacitance
Initial (original) capacitance
Capacitance value after one hour's use
Rated capacitance
Capacitance at 20 °C
Capacitance at 25 °C
Capacitance change
Kapazität
Anfangskapazität
Kapazitätswert nach einer Stunde
Nennkapazität
Kapazität bei 20 °C
Kapazität bei 25 °C
Kapazitätsänderung
D
Bending displacement
Durchbiegung
Ea
ESR
Activation energy
Equivalent series resistance
Aktivierungsenergie
Ersatzserienwiderstand
F
f
fmeas
fres
Force
Frequency
Measuring frequency
Self-resonant frequency
Kraft
Frequenz
Messfrequenz
Eigenresonanzfrequenz
Itest
Test current
Prüfstrom
k
Ageing constant
Alterungskonstante
L
Inductance
Induktivität
N
Quantity (integer values)
Anzahl (ganzzahliger Wert)
Ploss
Power dissipation or loss
Verlustleistung
Qel
Q
Electrical charge
Quality
Elektrische Ladung
Güte
Rins
RP
RS
Insulation resistance
Parallel resistance
Series resistance (circuit resistance)
Isolationswiderstand
Parallelwiderstand
Serienwiderstand
SV
Rate of rise of a voltage pulse
Flankensteilheit eines Spannungsimpulses
T
Tmeas
Top
Tref
Ttest
t
tr
ttest
tan δ
Temperature
Measuring temperature
Operating temperature
Reference temperature
Test temperature
Time
Rise time of a voltage pulse
Test duration
Dissipation factor
Temperatur
Messtemperatur
Betriebstemperatur
Bezugstemperatur
Prüftemperatur
Zeit
Anstiegszeit eines Spannungsimpulses
Prüfdauer
Verlustfaktor
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 16
Multilayer ceramic capacitors
MLSC; X7R
Symbol
English
German
V
V0
Voltage
Initial (original) voltage (basic voltage
level)
Measuring voltage
Rated voltage
Amplitude of a voltage pulse
Measuring (root-mean-square or
effective) AC voltage
Test voltage
Spannung
Anfangsspannung
(Spannungsgrundpegel)
Messspannung
Nennspannung
Hub des Spannungsimpulses
Effektivspannung
|Z|
Magnitude of impedance (AC
resistance)
Betrag der Impedanz
(Wechselstromwiderstand)
α
Temperature coefficient
Temperaturkoeffizient
ε0
εr
Absolute dielectric constant
Relative dielectric constant
Absolute Dielektrizitätskonstante
Relative Dielektrizitätskonstante
λ
Failure rate
Ausfallrate
τ
Time constant
Zeitkonstante
Vmeas
VR
VS
VRMS
Vtest
Prüfspannung
Abbreviations / Notes
Symbol
English
German
Lead spacing (in mm)
Rastermaß (in mm)
Surface-mounted devices
Oberflächenmontierbares Bauelement
*
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummerncodes, type designations etc.
code oder für die Typenbezeichnung.
+
To be replaced by a letter.
Platzhalter für einen Buchstaben.
All dimensions are given in mm.
Alle Maße sind in mm angegeben.
The commas used in numerical values
denote decimal points.
Verwendete Kommas in Zahlenwerten
bezeichnen Dezimalpunkte.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 16
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP,
MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Page 16 of 16
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