EPCOS B57431V2683+062 Temperature measurement smd ntc thermistors with nickel barrier termination Datasheet

Temperature Measurement
B574**
SMD NTC Thermistors with Nickel Barrier Termination, Size 0805
Applications
V 4**
1,3 max.*)
1,25±0,15
■ Temperature measurement and compensation in
0,5±0,25
2,0±0,2
– mobile phone applications
(e.g. battery pack, TCXO, LCD)
– data systems
– automotive electronics
Features
■ Multilayer SMD NTC with inner electrodes
■ Ni barrier termination (AgNiSn)
■ High accuracy: ± 5 % in resistance,
Termination
B value tolerance down to ± 1,5 % available
on request
■ Excellent long-term ageing stability in
high-temperature and high-humidity environment
■ Superior resistance stability during soldering
(change <1 %)
TNT0421-1-E
* Slimline version 0,9 max.
* available upon request
Dimensions in mm
Approx. weight 13 mg
Options
Alternative resistance ratings, resistance tol. < 5 % and B value tol. < 3 % available on request
Delivery mode
Blister tape, 180-mm reel, PU: 3000 pcs (standard); 330-mm reel, PU: 12000 pcs (on request)
Climatic category (IEC 60068-1)
Max. power at 25 °C (on PCB)
Resistance tolerance
Rated temperature
B value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
P251)
∆R N/R N
TN
∆B/B
δth1)
τc1)
Cth1)
55/125/56
210
± 5 %, ± 10 %
25
±3%
approx. 3,5
approx. 10,0
approx. 35,0
mW
°C
mW/K
s
mJ/K
No. of R/T
characteristic
B 25/50
K
K
K
47
8501
3470
3540
3550
B57411V2470+062
100
8501
3470
3540
3550
B57411V2101+062
150
8501
3470
3540
3550
B57411V2151+062
220
8501
3470
3540
3550
B57411V2221+062
330
8501
3470
3540
3550
B57411V2331+062
R 25
Ω
B25/85
1) Depends on mounting situation
53
05/02
B 25/100
Ordering code
Temperature Measurement
B574**
SMD NTC Thermistors with Nickel Barrier Termination, Size 0805
R 25
B25/85
B 25/100
V 4**
Ordering code
No. of R/T
characteristic
B 25/50
K
K
K
470
8502
3940
3980
4000
680
8502
3940
3980
4000
B57421V2681+062
1,0 k
8502
3940
3980
4000
B57421V2102+062
1,5 k
8502
3940
3980
4000
B57421V2152+062
8502
3940
3980
4000
B57421V2103+062
2,2 k
8503
4390
4470
4500
B57431V2222+062
3,3 k
8503
4390
4470
4500
B57431V2332+062
4,7 k
8503
4390
4470
4500
B57431V2472+062
6,8 k
8503
4390
4470
4500
B57431V2682+062
10 k
8503
4390
4470
4500
B57431V2103+062
15 k
8503
4390
4470
4500
B57431V2153+062
22 k
8503
4390
4470
4500
B57431V2223+062
33 k
8503
4390
4470
4500
B57431V2333+062
47 k
8503
4390
4470
4500
B57431V2473+062
68 k
8503
4390
4470
4500
B57431V2683+062
100 k
8503
4390
4470
4500
B57431V2104+062
Ω
10 k
+: J for ∆RN/RN = ± 5 %
K for ∆RN/RN = ± 10 %
54
05/02
B57421V2471+062
Temperature Measurement
B574**
SMD NTC Thermistors with Nickel Barrier Termination, Size 0805
V 4**
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Standard
Test conditions
∆R25/R 25
(typical)
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ± 2) °C
t: 1000 h
<2%
Storage in damp
heat, steady state
IEC
60068-2-3
JIS C 0022
Temperature of air: (40 ± 2) °C
Relative humidity of air:
(93 +2/–3) %
Duration: 56 days
<2%
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: – 55 °C < 2 %
Upper test temperature: 125 °C
Number of cycles: 100
Solderability
<2%
Pmax: 210 mW
T: (65 ± 2) °C
t: 1000 h
Endurance
IEC
60068-2-58
JIS C 0054
Solderability:
(215 ± 3) °C / (3 ± 0,3) s
(235 ± 5) °C / (2 ± 0,2) s
95 % of
terminations
wetted
Resistance to soldering heat:
(260 ± 5) °C / (10 ± 1) s
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
55
Remarks
05/02
<1%
Herausgegeben von EPCOS AG
Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND
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(
 EPCOS AG 2002. Vervielfältigung, Veröffentlichung, Verbreitung und Verwertung dieser Broschüre und ihres Inhalts ohne ausdrückliche Genehmigung der EPCOS AG nicht gestattet.
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Published by EPCOS AG
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++49 89 636 09, FAX (0 89) 636-2 26 89
(
 EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
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