EPCOS B72530E1140S262 Ceramic transient voltage suppressor Datasheet

Ceramic transient voltage suppressors
SMD multilayer varistor, E series
Series/Type:
Ordering code:
CT1210S14BAUTOG
B72530E1140S262
Date:
Version:
2012-05-04
1
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Identification/Classification 1
(header 1 + top left header bar):
Ceramic transient voltage suppressors
Identification/Classification 2
(header 2 + bottom left header bar):
SMD multilayer varistor, E series
Ordering code: (top right header bar)
B72530E1140S262
Series/Type: (top right header bar)
CT1210S14BAUTOG
Preliminary data (optional):
(if necessary)
Department:
PPD ML PD
Date:
2012-05-04
Version:
1
Prepared by:
Dr. Mandoky-Lovas
Release signed by:
Dr. Dernovsek
Release signed QS:
Hr. Schlauer
Modifications/Remarks:
New datasheet for E series
 EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Description
The E series multilayer ceramic varistors has been developed to protect automotive
electronic circuits against transient overvoltages, such as electrostatic discharges and surge
currents.
Features
 Reliable ESD protection up to 30 kV acc. to IEC 61000-4-2
 High energy absorption capability
 Low leakage current
 No temperature derating up to 150 °C
 High life time robustness
 Stable protection level
 RoHS-compatible, lead-free
 Qualified based on AEC-Q200
 PSpice simulation models available
Designation system
CT
1210
S...B
14
AUTO
G
Chip with three-layer-termination (Ag/Ni/Sn)
Dimensions of the device 12 x 10 (length x width in 1/100 inch)
Special tolerance B of the varistor voltage
Maximum RMS operating voltage
Suited for AUTOmotive application
Taped version, cardboard tape, 7" reel (3000 pcs./ reel)
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 2 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Electrical data
Max. operating voltage
RMS voltage
VRMS
= 14 V
DC voltage
VDC
= 16 V
Varistor voltage (@ 1 mA, 25 °C)
Maximum clamping voltage (@ 2.5 A)
Max. leakage current (@ 16 V, 25 °C)
VV
= 22.0 … 27.0 V
Vclamp,max = 40 V
Ileak,max = 5 µA
Typical leakage current (@ 14 V, 25 °C)
Maximum average power dissipation
Maximum surge current (8/20 µs)
Maximum energy absorption (2 ms)
Ileak
Pdiss,max
Isurge,max
Wmax
= <2.5 µA
= 10 mW
= 1 x 400 A
= 1600 mJ
Load dump
Jump-start
WLD
Vjump
= 10 x 3 J
= 24.5V, 5 min.
Capacitance (@ 1 kHz, 1 V, 25 °C; typical)
Response time
Ctyp
<0.5 ns
= 2.0 nF
Operating temperature
Storage temperature (mounted parts)
–55 ... +150 °C
–55 ... +150 °C
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 3 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
V/I characteristics
Derating curves
10
3
A
i max
i max
t
2
1x
10
2
5
10
2
3 10
4
5
1
10
10
10 10
6
 10
5
10
r
0
5
10
-1
10
5
100
5
1000
5 µs
10000
tr
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 4 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Temperature derating
The specified ratings for Imax, Isurge,max and Pdiss,max are valid up to 150 °C.
For operation above 150 °C we recommend the below derating.
Dimensional drawing
h
w
k
MLV0031-M
Dimensions in mm
Case size
l
w
h
k
1210
3.2 ±0.3
2.5 ±0.25
1.7 max
0.25 … 0.75
Recommended solder pad layout
Dimensions in mm
Case size
A
B
C
1210
2.80
1.20
2.10
B
C
A
MLV0034-P
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 5 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Recommended soldering profiles
Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature
Sn-Pb eutectic assembly
Pb-free assembly
Preheat and soak
- Temperature min
Tsmin
100 °C
150 °C
- Temperature max
Tsmax
150 °C
200 °C
- Time
tsmin to tsmax
60 … 120 s
60 … 180 s
Average ramp-up rate
Tsmax to Tp
3 °C/s max.
3 °C/s max.
Liquidous temperature
TL
183 °C
217 °C
Time at liquidous
tL
60 … 150 s
Peak package body temperature
1)
Tp
Time (tp)3) within 5 °C of specified
classification temperature (Tc)
Average ramp-down rate
Time 25 °C to peak temperature
1)
60 … 150 s
2)
Tp to Tsmax
2)
220 °C … 235 °C
245 °C … 260 °C
20 s3)
30 s3)
6 °C/s max.
6 °C/s max.
maximum 6 min
maximum 8 min
Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2)
Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3)
Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 6 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Wave soldering temperature profile
Temperature characteristic at component terminal with dual-wave soldering
300
Normal curve
Limit curves
10 s
˚C
Temperature
250
235 ˚C ... 260 ˚C
2nd wave
200
1st wave
5 K/s
2 K/s
approx. 200 K/s
150
100 ˚C ... 130 ˚C
100
50
2 K/s
Forced
cooling
0
0
50
100
150
200
s
250
Time
KKE0144-J-E
Soldering guidelines
The usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
Storage condition
 As far as possible, the components should be soldered within 12 months after delivery from
EPCOS.
 Storage temperature: −25 up to +45 °C.
 Relative humidity: <75% annual average, <95% on max. 30 days in a year.
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 7 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Taping and packaging
Tape and reel packing according to IEC 60286-3
Tape material: Blister
Section A-A
A
P0
D0
P2
F
Cover tape
W
E
T
K0
A0
T2
D1
P1
A
G
B0
Direction of unreeling
KKE0053-C-E
Dimensions and tolerances
Definition
Symbol
Dimension
Tolerance
[mm]
[mm]
Compartment width
A0
2.8
±0.2
Compartment length
B0
3.5
±0.2
Compartment height
K0
1.8
max.
Sprocket hole diameter
D0
1.5
+0.1/-0
Compartment hole diameter
D1
1.0
min.
Sprocket hole pitch
P0
4.0
±0.1 1)
Distance center hole to center compartment
P2
2.0
±0.05
Pitch of the component compartments
P1
4.0
±0.1
Tape width
Distance edge to center of hole
Distance center hole to center compartment
Distance compartment to edge
Overall thickness
W
E
F
G
T2
8.0
1.75
3.5
0.75
2.5
±0.3
±0.1
±0.05
min.
max.
Thickness tape
T
0.3
max.
1)
±0.2 mm over 10 sprocket holes.
Package: 8-mm tape
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 8 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Packing
Packing material: Plastic
Reel dimensions
40 min.
empty cavities
A
Direction of unreeling
Tape end (trailer)
Leader
W1
13±0.2
25 min.
empty cavities
_0
ø60 +2
W2
300 mm
cover tape
KKE0058-I
Dinition
Symbol
Reel diameter
Dimension
Tolerance
[mm]
[mm]
A
180
+0/-3
Reel width (inside)
W1
8.4
+1.5/-0
Reel width (outside)
W2
14.4
max.
Packing unit: 3000 pcs./ reel
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 9 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG
Cautions and warnings
General
Some parts of this publication contain statements about the suitability of our ceramic transient voltage
suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI filters, SMD disk
varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types)) for certain areas of
application, including recommendations about incorporation/design-in of these products into customer
applications. The statements are based on our knowledge of typical requirements often made of our
CTVS devices in the particular areas. We nevertheless expressly point out that such statements
cannot be regarded as binding statements about the suitability of our CTVS components for a
particular customer application. As a rule, EPCOS is either unfamiliar with individual customer
applications or less familiar with them than the customers themselves. For these reasons, it is always
incumbent on the customer to check and decide whether the CTVS devices with the properties
described in the product specification are suitable for use in a particular customer application.

Do not use EPCOS CTVS components for purposes not identified in our specifications,
application notes and data books.

Ensure the suitability of a CTVS in particular by testing it for reliability during design-in.
Always evaluate a CTVS component under worst-case conditions.

Pay special attention to the reliability of CTVS devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes

Always connect a CTVS in parallel with the electronic circuit to be protected.

Consider maximum rated power dissipation if a CTVS has insufficient time to cool down
between a number of pulses occurring within a specified isolated time period. Ensure that
electrical characteristics do not degrade.

Consider derating at higher operating temperatures. Choose the highest voltage class
compatible with derating at higher temperatures.

Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will
burst.

If steep surge current edges are to be expected, make sure your design is as low-inductance
as possible.

In some cases the malfunctioning of passive electronic components or failure before the end
of their service life cannot be completely ruled out in the current state of the art, even if they
are operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery
line applications such as clamp 30), ensure by suitable design of the application or other
measures (e.g. installation of protective circuitry or redundancy) that no injury or damage is
sustained by third parties in the event of such a malfunction or failure. Only use CTVS
components from the AUTO series in safety-relevant applications.
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 10 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series

B72530E1140S262
CT1210S14BAUTOG
Specified values only apply to CTVS components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures like
thermal fuses.
Storage

Only store CTVS in their original packaging. Do not open the package before storage.

Storage conditions in original packaging: temperature −25 to +45°C, relative humidity ≤75%
annual average, maximum 95%, dew precipitation is inadmissible.

Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CTVS may stick together, causing problems during
mounting.

Avoid contamination of the CTVS surface during storage, handling and processing.

Avoid storing CTVS devices in harmful environments where they are exposed to corrosive
gases for example (SOx, Cl).

Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.

Solder CTVS components after shipment from EPCOS within the time specified:
o
CTVS with Ni barrier termination, 12 months
o
CTVS with AgPd termination, 6 months
o
SHCV and CU series, 24 months
Handling

Do not drop CTVS components and allow them to be chipped.

Do not touch CTVS with your bare hands - gloves are recommended.

Avoid contamination of the CTVS surface during handling.
Mounting

When CTVS devices are encapsulated with sealing material or overmolded with plastic
material, be sure to observe the precautions in “Mounting instructions”, “Sealing, potting and
overmolding”.

Make sure an electrode is not scratched before, during or after the mounting process.

Make sure contacts and housings used for assembly with CTVS components are clean before
mounting.
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 11 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG

The surface temperature of an operating CTVS can be higher. Ensure that adjacent
components are placed at a sufficient distance from a CTVS to allow proper cooling.

Avoid contamination of the CTVS surface during processing.

Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.
Soldering

Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.

Use resin-type or non-activated flux.

Bear in mind that insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Conductive adhesive gluing

Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive
adhesive gluing.
Operation

Use CTVS only within the specified operating temperature range.

Use CTVS only within specified voltage and current ranges.

Environmental conditions must not harm a CTVS. Only use them in normal atmospheric
conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited.

Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS
(e.g. through plug terminals).

Avoid dewing and condensation.

EPCOS CTVS components are mainly designed for encased applications. Under all
circumstances avoid exposure to:
o
direct sunlight
o
rain or condensation
o
steam, saline spray
o
corrosive gases
o
atmosphere with reduced oxygen content
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 12 of 14
Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72530E1140S262
CT1210S14BAUTOG

EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where
static power dissipation is required.

Multilayer varistors (MLVs) are designed for ESD protection and transient suppression.
CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and
EMI protection only.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
2012-05-04
Page 13 of 14
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap,
DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC,
PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD,
SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks
registered or pending in Europe and in other countries. Further information will be found on the
Internet at www.epcos.com/trademarks.
Page 14 of 14
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