Rohm BA6906F Single-phase full-wave motor driver for fan motor Datasheet

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STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
Single-Phase Full-Wave Motor Driver for Fan Motor
TYPE
BA6906F
FEATURES
Soft switched drive
〇ABSOLUTE MAXIMUM RATINGS
Symbol
Limit
Unit
Supply voltage
Vcc
15
V
Power dissipation
Pd
780*
mW
Topr
-40~+100
℃
Parameter
Operating temperature
Storage temperature
Output current
Tstg
-55~+150
℃
Iomax
0.7**
A
Output voltage
VOUT
15
V
AL signal output current
IAL
15
mA
AL signal output voltage
VAL
15
V
Tjmax
150
Junction temperature
*
To use at temperature above Ta=25℃ reduce 6.24mW/℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
** This value is not to be over Pd.
℃
〇OPERATING CONDITIONS
Parameter
Symbol
Operating supply voltage range
Vcc
Limit
3.0~14.0
Unit
V
Hall input voltage range
VH
0~Vcc-2.0
V
*This product is not designed for production against radioactive rays.
*This document may be strategic data subject to COCOM regulations.
REV. D
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〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V)
Icc
Min.
1.5
Limit
Typ.
3.4
Max.
8.7
ILDC
1.50
2.75
ILDD
0.24
rCD
Parameter
Symbol
Circuit current
Charge current of capacitor
for lock detection
Discharge current of capacitor for
lock detection
Charge-discharge current ratio of
capacitor for lock detection
Clamp voltage of capacitor
for lock detection
Comparison voltage of capacitor
for lock detection
Output voltage L
Output voltage H
FG terminal voltage L
FG terminal leak current
Hall input offset voltage
Hall input-output gain
Unit
Conditions
mA
At output OFF
4.50
μA
VLD=1.1V
0.48
0.90
μA
VLD=1.1V
4.2
5.7
9.5
-
VLDCL
1.14
1.80
2.47
V
VLDCP
0.47
0.76
1.06
V
VOL
VOH
VALL
IALL
Hofs
GHO
3.9
-10
320
0.2
4.1
0.3
0
500
0.3
0.5
50
10
680
V
V
V
μA
mV
-
rCD=ILDC/ILDD
Io=200mA
Io=-200mA
IAL=5mA
VAL=15V
〇PACKAGE OUTLINES
5.0±0.2
6906
1
1.5±0.1
0.11
5
0.3Min.
6.2±0.3
4.4±0.2
8
4
Lot No.
0.15±0.1
0.1
1.27
0.4±0.1
SOP 8(UNIT:mm)
〇BLOCK DIAGRAM
〇Terminal name
OUT2
GND
Pin No.
8
1
REG
AL
2
LOCK
DETECTION
AND
AUTO
RESTART
1
2
3
4
5
6
7
8
OUT1
7
LD
H-
3
6
Control
+
-
Vcc
4
+
-
TSD
HALL
AMP
-
+
H+
5
REV. D
Terminal
name
OUT2
AL
LD
Vcc
H+
HOUT1
GND
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〇CAUTIONS
1) Absolute maximum ratings
There is possibility of destruction in using beyond the absolute maximum rating. In case of destruction,
a failure mode can not be defined (short mode or open mode). Therefore when special mode is
envisaged where absolute maximum rating may be exceeded, please take a physical safety measure
such as fuse.
2) Reverse connection of power supply connector
Reverse connection of power supply connector may break IC. Take a measure against reverse
connection destruction such as inserting a diode between power supply and Vcc terminal.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure
such as placing a capacitor between power supply and GND for routing regenerated current, and fully
ensure that the capacitor characteristics have no problem before determine a capacitor value
4) GND potential
Ensure that the potential of GND terminal is the minimum potential in any operating condition. Also
ensure that all terminals except GND terminal do not fall below GND voltage including transient
characteristics. However, it is possible that the motor output terminal may deflect below GND because
of influence by back electromotive force of motor. Malfunction may possibly occur depending on use
condition, environment, and property of individual motor. Please make fully confirmation that no
problem is found on operation of IC.
5) Thermal design
Consider the power dissipation under actual use condition and apply thermal design with sufficient
margin.
6) Mounting failures
In attaching IC to printed board, pay enough attention to the direction and dislocation of IC. Mounting
failures may break IC. In addition, destruction is also possible when circuit is shorted by foreign
substance brought between outputs or between output and power supply - GND.
7) Operation in strong electromagnetic field
Use in strong electromagnetic field may cause malfunction, please be careful.
8) ASO
Please consider that the output Tr does not exceed the absolute maximum rating and ASO.
9) Thermal shut down circuit
This IC has thermal shut down (TSD) circuit. Operation temperature is 175℃(typ.) and has a hysteresis
width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal
becomes an open state. TSD circuit is simply for the purpose of intercepting IC from overheating, and
not for protecting and assuring IC. Therefore do not continue to use IC thereafter with this circuit
operating and do not use IC assuming the operation of this circuit.
10) Inspection with a set board
When connecting a capacitor to a pin with low impedance in inspection on a set board, stress may
possibly be applied to IC, therefore be sure to apply discharging in each process. In attaching to and
detaching from jigs in inspection process, be sure to turn off power before connecting, and turn off
power before removing IC. In addition, apply grounding to assembling process as a measure of
anti-static electricity, and use full caution in transporting and storing.
11) GND wiring pattern
When there are small signal GND and large current GND, separate the large current GND pattern from
small signal GND pattern. It is recommended to apply one-point grounding at the reference point of the
set in order that resistance of wiring pattern and large current do not cause change of voltage of small
signal GND. Please be cautious not to fluctuate the wiring pattern of GND of external mounted parts.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for
some cause, it is possible that the current charged in the capacitor may flow into the output resulting in
destruction. Keep the capacitor between output and GND below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above
Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of
IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction
as well as destruction in the last. Do not use in a manner where parasitic element is actuated.
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Appendix
Notes
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Appendix-Rev4.0
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