PHILIPS BAP64Q Quad pin diode attenuator Datasheet

BAP64Q
Quad PIN diode attenuator
Rev. 1 — 7 October 2010
Product data sheet
1. Product profile
1.1 General description
Quad PIN diode in a SOT753 package.
1.2 Features and benefits
„
„
„
„
„
„
„
4 PIN diodes in a SOT753 package
300 kHz to 4 GHz
High linearity
Low insertion loss
reduction in part count
Low diode capacitance
Low diode forward resistance
1.3 Applications
„ RF attenuators
„ Broadband system applications
„ General purpose Voltage Controlled Attenuators for high linearity applications
2. Pinning information
Table 1.
Discrete pinning
Pin
Description
1
RF in
2
series bias
3
RF out
4
shunt 1 bias
5
shunt 2 bias
Simplified outline
5
1
4
2
Graphic symbol
5
4
3
1
2
3
sym143
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
BAP64Q
Description
SC-74A plastic surface-mounted package; 5 leads
Version
SOT753
BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
4. Marking
Table 3.
Marking
Type number
Marking code
BAP64Q
A1
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
VR
reverse voltage
Conditions
[1]
-
100
V
IF
forward current
[1]
-
100
mA
[1]
-
125
mW
Tsp = 90 °C
Ptot
total power dissipation
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−65
+150
°C
[1]
single diode.
6. Thermal characteristics
Table 5.
BAP64Q
Product data sheet
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-sp)
thermal resistance from junction to solder point
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
Typ
Unit
350
K/W
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
7. Characteristics
Table 6.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
Max Unit
Per diode
VF
forward voltage
IF = 50 mA
-
0.95
1.1
V
IR
reverse current
VR = 20 V
-
-
1
μA
VR = 100 V
-
-
10
μA
diode capacitance
Cd
VR = 0 V
-
0.52
-
pF
VR = 1 V
-
0.37
-
pF
VR = 20 V
-
0.23
0.35 pF
diode forward resistance f = 100 MHz; see Figure 2
rD
τL
[1]
f = 1 MHz; see Figure 1
charge carrier life time
IF = 0.5 mA
[1]
-
20
40
Ω
IF = 1 mA
[1]
-
10
20
Ω
IF = 10 mA
[1]
-
2
3.8
Ω
IF = 100 mA
[1]
-
0.7
1.35 Ω
-
1.55
-
when switched from
IF = 10 mA to IR = 6 mA;
RL = 100 Ω;
measured at IR = 3 mA
μs
Guaranteed on AQL basis: inspection level S4, AQL 1.0.
001aam721
500
Cd
(fF)
001aam722
102
rD
(Ω)
400
10
300
200
1
100
0
0
4
8
12
20
16
10−1
10−1
1
VR (V)
f = 1 MHz; Tj = 25 °C.
Fig 1.
Product data sheet
IF (mA)
102
f = 100 MHz; Tj = 25 °C.
Diode capacitance as a function of reverse
voltage; typical values.
BAP64Q
10
Fig 2.
Diode forward resistance as a function of
forward current; typical values.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
8. Application information
8.1 Application circuit
C1
R1
Vctrl
RFin/out C2
2
3
1
C3 RFin/out
BAP64Q
4
5
R2
R3
C4
C5
VCC
Fig 3.
Wideband Quad PIN diode Π attenuator circuit
Table 7.
BAP64Q
Product data sheet
001aam723
List of components used for the typical application
Component
Description
C1, C2, C3, C4, C5
chip capacitor
10 nF
R1, R2, R3
chip resistor
1000 Ω
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
Value
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
8.2 Quad PIN pi attenuator characteristics
Table 8.
Typical performance for BAP64Q quad PIN diode Π attenuator
VCC = 0.75 V; Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Test Conditions
Typ
Units
Vctrl = 10 V; f = 1 GHz
1.8
dB
Lins
insertion loss
RLin
input return loss
Vctrl = 0 V; f = 1 GHz
18
dB
α
attenuation
Vctrl = 0 V; f = 1 GHz
38
dB
IP3i
input third-order intercept point
f = 0.1 GHz
Vctrl = 2 V
32
dBm
Vctrl = 10 V
42
dBm
Vctrl = 2 V
40
dBm
Vctrl = 10 V
41
dBm
Vctrl = 2 V
40
dBm
Vctrl = 10 V
37
dBm
Vctrl = 2 V
38
dBm
Vctrl = 10 V
39
dBm
f = 0.9 GHz
f = 1.8 GHz
f = 2.1 GHz
001aam724
0
Lins
(dB)
(7)
(6)
(5)
(4)
(3)
−20
−40
(2)
−60
−80
(1)
10
102
103
104
f (MHz)
VCC = 0.75 V; Tamb = 25 °C.
(1) Vctrl = 0 V
(2) Vctrl = 0.5 V
(3) Vctrl = 1 V
(4) Vctrl = 2 V
(5) Vctrl = 3 V
(6) Vctrl = 5 V
(7) Vctrl = 10 V
Fig 4.
BAP64Q
Product data sheet
Insertion loss as function of frequency; typical values
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Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
001aam725
0
001aam726
80
(1)
α
(dB)
RLin
(dB)
(2)
−10
60
−20
40
(1)
(2)
(3)
(4)
(5)
(6)
−30
−40
10
102
103
(3)
(4)
20
0
10−1
104
1
102
10
Vctrl (V)
f (MHz)
VCC = 0.75 V; Tamb = 25 °C.
VCC = 0.75 V; Tamb = 25 °C.
(1) Vctrl = 0 V
(1) f = 10 MHz
(2) Vctrl = 1 V
(2) f = 100 MHz
(3) Vctrl = 2 V
(3) f = 1000 MHz
(4) Vctrl = 3 V
(4) f = 3000 MHz
(5) Vctrl = 5 V
(6) Vctrl = 10 V
Fig 5.
Return loss as function of frequency;
typical values
BAP64Q
Product data sheet
Fig 6.
Attenuation as function of control voltage;
typical values
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Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
001aam727
102
001aam728
102
(1)
α
(dB)
(1)
α
(dB)
(2)
(2)
10
10
(3)
(3)
(4)
(4)
(5)
(5)
(6)
(6)
1
−40
0
40
1
−40
80
Tamb (°C)
VCC = 0.75 V; f = 100 MHz.
(1) Vctrl = 0 V
(2) Vctrl = 1 V
(2) Vctrl = 1 V
(3) Vctrl = 2 V
(3) Vctrl = 2 V
(4) Vctrl = 3 V
(4) Vctrl = 3 V
(5) Vctrl = 5 V
(5) Vctrl = 5 V
(6) Vctrl = 10 V
(6) Vctrl = 10 V
Attenuation as function of temperature;
typical values
BAP64Q
Product data sheet
40
80
Tamb (°C)
VCC = 0.75 V; f = 1000 MHz.
(1) Vctrl = 0 V
Fig 7.
0
Fig 8.
Attenuation as function of temperature;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
001aam729
102
α
(dB)
001aam730
102
α
(dB)
(1)
(1)
(2)
(2)
10
10
(3)
(3)
(4)
(4)
(5)
(5)
(6)
(6)
1
−40
0
40
1
−40
80
Tamb (°C)
VCC = 0.75 V; f = 2000 MHz.
0
80
Tamb (°C)
VCC = 0.75 V; f = 3000 MHz.
(1) Vctrl = 0 V
(1) Vctrl = 0 V
(2) Vctrl = 1 V
(2) Vctrl = 1 V
(3) Vctrl = 2 V
(3) Vctrl = 2 V
(4) Vctrl = 3 V
(4) Vctrl = 3 V
(5) Vctrl = 5 V
(5) Vctrl = 5 V
(6) Vctrl = 10 V
(6) Vctrl = 10 V
Fig 9.
40
Attenuation as function of temperature;
typical values
Fig 10. Attenuation as function of temperature;
typical values
001aam731
50
IP3i
(dBm)
40
(1)
(2)
(3)
(4)
30
20
10
0
0
4
8
12
16
20
Vctrl (V)
VCC = 0.75 V; Tamb = 25 °C.
(1) f = 100 MHz
(2) f = 900 MHz
(3) f = 1800 MHz
(4) f = 2100 MHz
Fig 11. Input third-order intercept point as control voltage; typical values
BAP64Q
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
9. Package outline
Plastic surface-mounted package; 5 leads
SOT753
D
E
B
y
A
X
HE
5
v M A
4
Q
A
A1
c
1
2
3
Lp
detail X
bp
e
w M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.100
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
SOT753
JEDEC
JEITA
SC-74A
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
06-03-16
Fig 12. Package outline SOT753
BAP64Q
Product data sheet
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Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
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Quad PIN diode attenuator
10. Abbreviations
Table 9.
Abbreviations
Acronym
Description
AQL
Acceptable Quality Level
PIN
P-type, Intrinsic, N-type
RF
Radio Frequency
S4
Special inspection level 4
11. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAP64Q v.1
20101007
Product data sheet
-
-
BAP64Q
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BAP64Q
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
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BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAP64Q
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 7 October 2010
© NXP B.V. 2010. All rights reserved.
12 of 13
BAP64Q
NXP Semiconductors
Quad PIN diode attenuator
14. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
8.1
8.2
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4
Quad PIN pi attenuator characteristics . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 October 2010
Document identifier: BAP64Q
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