Infineon BAS3010S-02LRH Low vf schottky diode Datasheet

BAS3010S-02LRH
Low VF Schottky Diode
• Reverse voltage: 30 V
• Forward current: 1 A
• Low forward voltage and smallest package
form factor (1.0 x 0.6 x < 4 mm) for
mobile phone battery charger application
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
BAS3010S-02LRH
1
2
Type
BAS3010S-02LRH
Package
TSLP-2-17
Configuration
single
Marking
1T
Maximum Ratings at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Value
Unit
Diode reverse voltage1)
VR
30
V
Forward current1), TS ≤ 114 °C
IF
1
A
Non-repetitive peak surge forward current
I FSM
4
(tp≤ 10 ms)
150
Junction temperature
Tj
Operating temperature range
T op
-55 ...150
Storage temperature
T stg
-65 ...150
Thermal Resistance
Junction - soldering point2)
RthJS
≤ 60
°C
K/W
1For
TA > 25 °C the derating of VR and I F has to be considered
2For calculation of R
thJA please refer to Application Note Thermal Resistance
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BAS3010S-02LRH
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
min.
typ. max.
DC Characteristics
Reverse current1)
IR
VR = 10 V
-
-
30
VR = 30 V
-
-
300
Forward voltage1)
IF = 1 mA
-
200
250
IF = 100 mA
-
340
390
IF = 700 mA
-
500
570
IF = 1000 mA
-
570
650
-
10
15
CT
µA
mV
VF
AC Characteristics
Diode capacitance
Unit
pF
VR = 5 V, f = 1 MHz
1Pulsed
test: tp = 300 µs; D = 0.01
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BAS3010S-02LRH
Diode capacitance CT = ƒ (VR)
Reverse current IR = ƒ (TA)
f = 1MHz
VR = Parameter
10 -2
35
A
pF
10 -3
IR
CT
25
20
10 -4
15
10
30 V
20 V
10 V
5V
10 -5
5
0
0
5
10
15
20
V
10 -6
0
30
25
50
75
°C
100
VR
150
TA
Reverse current IR = ƒ(VR)
TA = Parameter
Forward Voltage VF = ƒ (TA)
IF = Parameter
10A-2
0.65
V
TA = + 125°C
10 -3
IF = 1A
10 -5
VF
IR
10
0.55
TA = + 85°C
-4
TA = + 25°C
10
0.5
0.45
-6
0.4
IF = 350 mA
10 -7
0.35
10 -8
TA = - 40°C
10 -9
10 -10
0
IF = 100 mA
0.3
0.25
5
10
15
20
V
0.2
-50
30
VR
-25
0
25
50
75
100
°C
150
TA
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BAS3010S-02LRH
Forward current IF = ƒ (VF)
Permissible Reverse voltage VR = ƒ (TA)
tp = Paramter, Duty cycle < 0.01
Device mounted on PCB with Rth = 160 K/W
35
10 0
V
10 -1
25
V Rmax
IF
10
A
1
10 -2
20
TA= +125°C
+85°C
+25°C
- 40°C
10 -3
15
10 -4
10
10 -5
5
10 -6
0
0.1
0.2
0.3
0.4
V
DC
20 ms
1 ms
0
0
0.6
VF
20
40
60
80
100
°C
130
TA
Forward current IF = ƒ (T S)
BAS3010S-02LRH
1100
mA
900
IF
800
700
600
500
400
300
200
100
0
0
15
30
45
60
75
90 105 120 °C
150
TS
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2009-02-02
Package TSLP-2-17
BAS3010S-02LRH
Package Outline
Top view
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.05 MAX.
1
1
0.25 ±0.035 1)
2
1±0.05
0.65 ±0.05
2
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
0.45
Copper
Solder mask
0.375
0.35
0.275
1
0.925
0.3
0.35
0.6
0.275
For board assembly information please refer to Infineon website "Packages"
Stencil apertures
Marking Layout (Example)
BAR90-02LRH
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
Cathode
marking
8
1.16
4
0.76
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2009-02-02
BAS3010S-02LRH
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
6
2009-02-02
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