Rohm BD52004GUL-TR Omnipolar detection hall ics (polarity detection for both s and n features dual outputs) Datasheet

Hall IC Series
Omnipolar Detection Hall ICs
(Polarity detection for
both S and N features dual outputs)
No.10045EDT01
BU52004GUL, BU52014HFV
●Description
The BU52004GUL and BU52014HFV are bipolar Hall ICs incorporating a polarity determination circuit that enables
operation (output) on both the S- and N-poles, with the polarity judgment based on the output processing configuration.
These Hall IC products can be in with movie, mobile phone and other applications involving crystal panels to detect the
(front-back) location or determine the rotational direction of the panel.
●Features
1) Omnipolar detection (polarity detection for both S and N features dual outputs)
2) Micropower operation (small current using intermittent operation method)
3) Ultra-compact CSP4 package(BU52004GUL)
4) Small outline package (BU52014HFV)
5) Line up of supply voltage
For 1.8V Power supply voltage (BU52014HFV)
For 3.0V Power supply voltage (BU52004GUL)
6) Polarity judgment and output on both poles (OUT1: S-pole output; OUT2: N-pole output)
7) High ESD resistance 8kV(HBM)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, etc.
●Product Lineup
Product name
BU52004GUL
BU52014HFV
Supply
voltage
(V)
2.40~3.30
1.65~3.30
Operate point
(mT)
+/-3.7
+/-3.0
※
※
Hysteresis
(mT)
Period
(ms)
0.8
0.9
50
50
Supply current
(AVG. )
(μA)
8.0
5.0
Output type
Package
CMOS
CMOS
VCSP50L1
HVSOF5
※Plus is expressed on the S-pole; minus on the N-pole
●Absolute Maximum Ratings
BU52004GUL (Ta=25℃)
PARAMETERS
Power Supply Voltage
Output Current
Power Dissipation
Operating Temperature Range
Storage Temperature Range
SYMBOL
VDD
IOUT
Pd
Topr
Tstg
LIMIT
-0.1 ~ +4.5※1
±1
420※2
-40 ~ +85
-40 ~ +125
UNIT
V
mA
mW
℃
℃
SYMBOL
VDD
IOUT
Pd
Topr
Tstg
LIMIT
-0.1 ~ +4.5※3
±0.5
536※4
-40 ~ +85
-40 ~ +125
UNIT
V
mA
mW
℃
℃
※1. Not to exceed Pd
※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52014 HFV (Ta=25℃)
PARAMETERS
Power Supply Voltage
Output Current
Power Dissipation
Operating Temperature Range
Storage Temperature Range
※3. Not to exceed Pd
※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
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© 2010 ROHM Co., Ltd. All rights reserved.
1/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Magnetic, Electrical Characteristics
BU52004GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
LIMIT
PARAMETERS
SYMBOL
MIN
TYP
Power Supply Voltage
VDD
2.4
3.0
MAX
3.3
UNIT
V
BopS
-
3.7
5.5
BopN
-5.5
-3.7
-
BrpS
0.8
2.9
-
BrpN
-
-2.9
-0.8
Period
BhysS
BhysN
Tp
0.8
0.8
50
100
Output High Voltage
VOH
VDD
-0.4
-
-
V
Output Low Voltage
VOL
-
-
0.4
V
IDD(AVG)
IDD(EN)
IDD(DIS)
-
8
4.7
3.8
12
-
μA
mA
μA
mT
Operate Point
mT
Release Point
Hysteresis
Supply Current
Supply Current During Startup Time
Supply Current During Standby Time
CONDITIONS
OUTPUT:OUT1
(respond the south pole)
OUTPUT:OUT2
(respond the north pole)
OUTPUT:OUT1
(respond the south pole)
OUTPUT:OUT2
(respond the north pole)
mT
ms
※5
BrpN<B<BrpS
IOUT =-1.0mA
※5
B<BopN, BopS<B
IOUT =+1.0mA
Average
During Startup Time Value
During Standby Time Value
※5. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
BU52014HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
LIMIT
PARAMETERS
SYMBOL
MIN
TYP
Power Supply Voltage
VDD
1.65
1.80
MAX
3.30
UNIT
V
BopS
-
3.0
5.0
BopN
-5.0
-3.0
-
BrpS
0.6
2.1
-
BrpN
-
-2.1
-0.6
Period
BhysS
BhysN
Tp
0.9
0.9
50
100
Output High Voltage
VOH
VDD
-0.2
-
-
V
Output Low Voltage
VOL
-
-
0.2
V
Supply Current 1
IDD1(AVG)
-
5
8
μA
Supply Current During Startup Time 1
IDD1(EN)
-
2.8
-
mA
Supply Current During Standby Time 1
IDD1(DIS)
-
1.8
-
μA
Supply Current 2
IDD2(AVG)
-
8
12
μA
Supply Current During Startup Time 2
IDD2(EN)
-
4.5
-
mA
Supply Current During Standby Time 2
IDD2(DIS)
-
4.0
-
μA
mT
Operate Point
Release Point
Hysteresis
CONDITIONS
mT
OUTPUT:OUT1
(respond the south pole)
OUTPUT:OUT2
(respond the north pole)
OUTPUT:OUT1
(respond the south pole)
OUTPUT:OUT2
(respond the north pole)
mT
ms
6
※
BrpN<B<BrpS
IOUT =-0.5mA
※6
B<BopN, BopS<B
IOUT =+0.5mA
VDD=1.8V, Average
VDD=1.8V,
During Startup Time Value
VDD=1.8V,
During Standby Time Value
VDD=2.7V, Average
VDD=2.7V,
During Startup Time Value
VDD=2.7V,
During Standby Time Value
※6. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
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© 2010 ROHM Co., Ltd. All rights reserved.
2/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Figure of measurement circuit
Tp
Bop/Brp
VDD
VDD
VDD
VDD
OUT
100μF
GND
Oscilloscope
Fig.2
Bop,Brp measurement circuit
Tp measurement circuit
Product Name
VDD
IOUT
BU52004GUL
1.0mA
BU52014HFV
0.5mA
OUT
100μF
GND
Fig.3
GND
The period is monitored by Oscilloscope.
VOH
VDD
OUT
V
Bop and Brp are measured with applying the magnetic field
from the outside.
Fig.1
200Ω
IOUT
V
VOH measurement circuit
VOL
Product Name
VDD
VDD
IOUT
BU52004GUL
1.0mA
BU52014HFV
0.5mA
OUT
100μF
GND
V
IOUT
VOL measurement circuit
Fig.4
IDD
A
2200μF
VDD
VDD
OUT
GND
Fig.5
IDD measurement circuit
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© 2010 ROHM Co., Ltd. All rights reserved.
3/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Technical (Reference) Data
BU52004GUL (VDD=2.4V~3.3V type)
8.0
Bop S
2.0
Brp S
0.0
-2.0
Brp N
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
Ta = 25°C
2.0
Brp S
0.0
-2.0
Brp N
-4.0
Bop N
-6.0
-8.0
2.0
20 40 60 80 100
2.4
Fig.6 Bop,Brp –
Ambient temperature
Ta = 25°C
PERIOD [ms]
80
70
60
50
40
30
20
10
0
2.4
2.8
3.2
SUPPLLY VOLTAGE[V]
3.2
3.6
VDD=3.0V
-60 -40 -20 0
Fig.8 TP– Ambient
temperature
20.0
20.0
18.0
VDD=3.0V
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
3.6
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.7 Bop,Brp –
Supply voltage
AVERAGE SUPPLY CURRENT [µA]
100
2.0
2.8
100
95
90
85
80
75
70
65
60
55
50
45
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
90
Bop S
4.0
PERIOD [ms]
VDD=3.0V
4.0
6.0
AVERAGE SUPPLY CURRENT [µA]
6.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
18.0
16.0
Ta = 25°C
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
20 40 60 80 100
2.0
2.8
3.2
3.6
Fig.11 IDD – Supply voltage
Fig.10 IDD – Ambient
temperature
Fig.9 TP – Supply voltage
2.4
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
BU52014HFV (VDD=1.65V~3.3V type)
8.0
Bop S
4.0
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
20 40 60 80 100
2.0
Brp N
-2.0
-4.0
90
Ta = 25°C
PERIOD [ms]
80
70
60
50
40
30
20
10
0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLTAGE [V]
Fig.15 TP– Supply voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
VDD=1.8V
80
Brp S
0.0
Bop N
70
60
50
40
30
20
-6.0
10
-8.0
0
1.4
1.8
2.2
2.6
3.0
-60 -40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE [℃]
3.4
SUPPLY VOLTAGE [V]
Fig.13
AVERAGE SUPPLY CURRENT [µA]
100
Bop S
4.0
AMBIENT TEMPERATURE [℃]
Fig.12 Bop,Brp –
Ambient temperature
90
Ta = 25°C
PERIOD [ms]
VDD=1.8V
100
6.0
20.0
18.0
16.0
Fig.14 TP– Ambient
temperature
Bop,Brp – Supply voltage
AVERAGE SUPPLY CURRENT [µA]
6.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
VDD=1.8V
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.16 IDD – Ambient
temperature
4/11
20.0
18.0
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE[V]
Fig.17 IDD – Supply voltage
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Block Diagram
BU52004GUL
VDD
A1
0.1µF
Adjust the bypass capacitor value
as
TIMING LOGIC
necessary,
according
to
LATCH
voltage noise conditions, etc.
HALL
connection to the PC, with no external pull-up
GND
resistor required.
VDD
LATCH
×
The CMOS output terminals enable direct
SAMPLE
& HOLD
DYNAMIC
OFFSET
CANCELLATION
ELEMENT
B1 OUT1
B2 OUT2
A2
GND
Fig.18
PIN No.
PIN NAME
FUNCTION
A1
VDD
POWER SUPPLY
A2
GND
GROUND
B1
OUT1
OUTPUT( respond the south pole)
B2
OUT2
OUTPUT( respond the north pole)
A1
COMMENT
A2
B1
B2
Surface
A2
A1
B2
B1
Reverse
BU52014HFV
VDD
4
0.1μF
LATCH
TIMING LOGIC
GND
The CMOS output terminals enable
direct connection to the PC, with no
external pull-up resistor required.
VDD
LATCH
×
SAMPLE
& HOLD
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
HALL
Adjust the bypass capacitor
value as necessary, according to
voltage noise conditions, etc.
5 OUT1
1
OUT2
2
GND
Fig.19
PIN No.
PIN NAME
FUNCTION
1
OUT2
OUTPUT
( respond the north pole)
2
GND
GROUND
3
N.C.
4
VDD
POWER SUPPLY
5
OUT1
OUTPUT
( respond the south pole)
COMMENT
5
4
4
1
2
3
Surface
3
5
OPEN or Short to GND.
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© 2010 ROHM Co., Ltd. All rights reserved.
5/11
2
1
Reverse
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
● Description of Operations
Micropower Operation (Small current using intermittent action)
The dual output bipolar detection Hall IC adopts an
intermittent operation method to save energy. At startup, the
Hall elements, amp, comparator and other detection circuits
power ON and magnetic detection begins. During standby,
the detection circuits power OFF, thereby reducing current
consumption. The detection results are held while standby
is active, and then output.
IDD
Period 50ms
Startup time
Standby
t
Fig.20
Reference period: 50ms (MAX100ms)
Reference startup time: 48μs
(Offset Cancelation)
VDD
I
B×
+
Hall Voltage
-
GND
Fig.21
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from
changes in resistance due to package or bonding stress. A
dynamic offset cancellation circuit is employed to cancel this
offset voltage.
When Hall elements are connected as shown in Fig. 21 and a
magnetic field is applied perpendicular to the Hall elements,
voltage is generated at the mid-point terminal of the bridge.
This is known as Hall voltage.
Dynamic cancellation switches the wiring (shown in the
figure) to redirect the current flow to a 90˚ angle from its
original path, and thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.
(Magnetic Field Detection Mechanism)
S
N
S
S
S
N
N
Flux direction
Flux direction
Fig.22
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
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© 2010 ROHM Co., Ltd. All rights reserved.
6/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
OUT1
N
S
S
N
OUT 1[V]
N
S
Flux
Flux
High
High
High
Low
B
Brp S
N-Pole
0
Magnetic flux density [mT]
Fig.23 S-Pole Detection
Bop S
S-Pole
The OUT1 pin detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.
OUT2
N
S
N
S
S
N
OUT 2[V]
Flux
Flux
High
High
High
Low
B
Bop N
Brp N
N-Pole
0
Magnetic density [mT]
S-Pole
Fig.24 N-Pole Detection
The OUT2 pin detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole.
The dual output Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package.
There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC:
when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the
magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output
mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and
output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.)
This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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© 2010 ROHM Co., Ltd. All rights reserved.
7/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Standby time
Standby time
Startup time
Supply current
(Intermittent action)
Indefinite
OUT
High
(No magnetic
field present)
Indefinite
OUT
(Magnetic
field present)
Low
Fig.25
The dual output Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during
startup, as shown in Fig. 25. It outputs to the appropriate terminal based on the detection result and maintains the output
condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval,
but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment
applications. Fig. 26 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 27 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52014HFV operating point max 5.0 mT,
the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively.
To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
Magnetic flux density[mT]
9
t=3mm
8
7
t=1mm
t=2mm
6
5
4
3
2
1
7.6mm
0
0
2
4
6
9.2mm 10.4mm
8
10
12
14
16
18
20
Distance between magnet and Hall IC [mm]
Fig.26
X
t
Y
X=Y=4mm
t=1mm,2mm,3mm
Magnet size
Magnet material: NEOMAX-44H (material)
Maker: NEOMAX CO.,LTD.
Magnet
t
L: Variable
…Flux density measuring point
Fig.27 Magnet Dimensions and
Flux Density Measuring Point
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© 2010 ROHM Co., Ltd. All rights reserved.
8/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Position of the Hall Effect IC(Reference)
HVSOF5
VCSP50L1
0.55
0.6
0.55
0.8
0.35
0.2
(UNIT:mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
VCSP50L1
HVSOF5
(UNIT:mm)
Strings
e
b3
SD
SE
Size(Typ)
0.50
0.25
0.25
0.25
●Terminal Equivalent Circuit Diagram
OUT1, OUT2
VDD
Because they are configured for CMOS (inverter) output, the
output pins require no external resistance and allow direct
connection to the PC. This, in turn, enables reduction of the
current that would otherwise flow to the external resistor
during magnetic field detection, and supports overall low
current (micropower) operation.
GND
Fig.28
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9/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Operation Notes
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or
orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the
magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the
design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
Magnet
Flux
Slide
d
Hall IC
L
Fig.29
A
B
S
Flux
N
Fig.30
Magnetic fux density[mT]
6) Slide-by position sensing
Fig.29 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and
the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in
Fig.30, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output Omnipolar detection Hall
IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in
the process of position detection. Fig. 31 plots magnetic flux density during the magnet slide-by. Although a reverse
magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet.
This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field
and prevents malfunctions.
10
8
6
4
2
0
-2
-4
-6
-8
-10
Reverse
0
1
2
3
4
5
6
7
8
9
10
Horizontal distance from the magnet [mm]
Fig.31
7) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
8) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
9) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way,
care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
10) Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
11) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
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© 2010 ROHM Co., Ltd. All rights reserved.
10/11
2010.01 - Rev.D
Technical Note
BU52004GUL, BU52014HFV
●Ordering part number
B
U
5
Part No.
2
0
0
4
G
Part No.
52004
52014
U
L
Package
GUL: VCSP50L1
HFV: HVSOF5
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
(VSCP50L1)
TR: Embossed tape and reel
(HVSOF5)
VCSP50L1(BU52004GUL)
1.10±0.1
<Tape and Reel information>
1.10±0.1
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.55MAX
0.10±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
S
A
0.30±0.1
2
0.50
0.08 S
4-φ0.25±0.05
0.05 A B
B B
A
1
0.30±0.1
Direction of feed
1pin
0.50
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HVSOF5
1.0±0.05
3000pcs
4
4
(0.91)
5
0.2MAX
Embossed carrier tape
Quantity
(0.05)
Tape
(0.3)
5
(0.41)
1.6±0.05
(0.8)
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
3 2 1
1 2 3
1pin
0.13±0.05
S
+0.03
0.02 –0.02
0.6MAX
1.2±0.05
(MAX 1.28 include BURR)
<Tape and Reel information>
1.6±0.05
0.1
S
0.5
0.22±0.05
0.08
Direction of feed
M
Reel
(Unit : mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
11/11
∗ Order quantity needs to be multiple of the minimum quantity.
2010.01 - Rev.D
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
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obtain a license or permit under the Law.
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More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
R1010A
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