Rohm BD5341FVE Free delay time setting cmos voltage detector ic sery Datasheet

Datasheet
Voltage Detector IC Series
Free Delay Time Setting
CMOS Voltage Detector IC Series
BD52xx series
BD53xx series
●General Description
ROHM’s BD52xx and BD53xx series are highly
accurate, low current consumption reset IC series with
a built-in delay circuit. The lineup was established with
tow output types (Nch open drain and CMOS output)
and detection voltages range from 2.3V to 6.0V in
increments of 0.1V, so that the series may be selected
according the application at hand.
●Features
„ Free delay time setting by external capacitor
„ Two output types (Nch open drain and CMOS output)
„ Ultra-low current consumption
„ Very small and low height package
●Key Specifications
„ Detection voltage:
2.3V to 6.0V (Typ.)
0.1V steps
„ High accuracy detection voltage:
±1.0%
„ Ultra-low current consumption:
0.95µA (Typ.)
●Package
SSOP5:
2.90mm x 2.80mm x 1.15mm
VSOF5:
1.60mm x 1.60mm x 0.60mm
●Applications
All electronic devices that use micro controllers and logic
circuits
●Typical Application Circuit
VDD1
VDD2
VDD1
RL
RST
BD52xx
CT
CT
CL
CL
(Capacitor for
noise filtering)
(Capacitor for
noise filtering)
GND
GND
Open Drain Output type
BD52xx Series
●Connection Diagram
SSOP5
CT
TOP VIEW
CMOS Output type
BD53xx Series
N.C.
VSOF5
TOP VIEW
Lot. No
Marking
●Pin Descriptions
VOUT
Micro
RST controller
BD53xx
Micro
controller
VDD GND
4
5
Marking
1 2 3
VOUT SUB CT
VDD GND
SSOP5
Lot. No
VSOF5
PIN No.
1
2
Symbol
VOUT
VDD
Function
Reset Output
Power Supply Voltage
PIN No.
1
2
Symbol
VOUT
SUB
3
GND
GND
3
CT
4
N.C.
4
GND
5
CT
Unconnected Terminal
Capacitor connection terminal for
output delay time
Function
Reset Output
Substrate*
Capacitor connection terminal for
output delay time
GND
5
VDD
Power Supply Voltage
*Connect the substrate to GND.
○Product structure:Silicon monolithic integrated circuit
○This product is not designed protection against radioactive rays.
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BD52xx series
Datasheet
BD53xx series
●Ordering Information
B
D
5
2
2
BD52: Adjustable Delay Time
CMOS Reset IC
Open Drain Type
BD53: Adjustable Delay Time
CMOS Reset IC
CMOS Output Type
3
G
Reset Voltage Value
23: 2.3V to (0.1V step)
60: 6.0V
-
Package
G: SSOP5
FVE: VSOF5
TR
Packaging and forming specification
TR: Embossed tape and reel
SSOP5
5
4
1
2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
+0.05
0.42 −0.04
0.05±0.05
1.1±0.05
1.25Max.
)
0.95
0.1
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
VSOF5
4
(MAX 1.28 include BURR)
1.2 ± 0.05
1.6 ± 0.05
5
0.2MAX
1.6±0.05
1.0±0.05
1
2
3
0.6MAX
0.13±0.05
0.5
0.22±0.05
(Unit : mm)
●Lineup
Detection
Marking
Voltage
PW
6.0V
PV
5.9V
PU
5.8V
PT
5.7V
PS
5.6V
PR
5.5V
PQ
5.4V
PP
5.3V
PN
5.2V
PM
5.1V
PL
5.0V
PK
4.9V
PJ
4.8V
PH
4.7V
PG
4.6V
PF
4.5V
PE
4.4V
PD
4.3V
PC
4.2V
Part
Marking
Number
BD5260
PB
BD5259
PA
BD5258
MV
BD5257
MU
BD5256
MT
BD5255
MS
BD5254
MR
BD5253
MQ
BD5252
MP
BD5251
MN
BD5250
MM
BD5249
ML
BD5248
MK
BD5247
MJ
BD5246
MH
BD5245
MG
BD5244
MF
BD5243
ME
BD5242
MD
Detection
Voltage
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Part
Marking
Number
BD5241
RW
BD5240
RV
BD5239
RU
BD5238
RT
BD5237
RS
BD5236
RR
BD5235
RQ
BD5234
RP
BD5233
RN
BD5232
RM
BD5231
RL
BD5230
RK
BD5229
RJ
BD5228
RH
BD5227
RG
BD5226
RF
BD5225
RE
BD5224
RD
BD5223
RC
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Detection
Voltage
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
Part
Marking
Number
BD5360
RB
BD5359
RA
BD5358
QV
BD5357
QU
BD5356
QT
BD5355
QS
BD5354
QR
BD5353
QQ
BD5352
QP
BD5351
QN
BD5350
QM
BD5349
QL
BD5348
QK
BD5347
QJ
BD5346
QH
BD5345
QG
BD5344
QF
BD5343
QE
BD5342
QD
Detection
Voltage
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Part
Number
BD5341
BD5340
BD5339
BD5338
BD5337
BD5336
BD5335
BD5334
BD5333
BD5332
BD5331
BD5330
BD5329
BD5328
BD5327
BD5326
BD5325
BD5324
BD5323
TSZ02201-0R7R0G300040-1-2
19.DEC.2011 Rev.002
BD52xx series
Datasheet
BD53xx series
z Absolute maximum ratings (Ta=25°C)
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
*1*3
Power
SSOP5
*2*3
Dissipation
VSOF5
Operating Temperature
Ambient Storage Temperature
Symbol
VDD-GND
Limits
-0.3 ~ +10
GND-0.3 ~ +10
GND-0.3 ~ VDD+0.3
540
210
-40 ~ +105
-55 ~ +125
VOUT
Pd
Topr
Tstg
Unit
V
V
mW
°C
°C
*1 Use above Ta=25°C results in a 5.4mW loss per degree.
*2 Use above Ta=25°C results in a 2.1mW loss per degree.
*3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter
Detection Voltage
Symbol
VDET
Circuit Current when ON
IDD1
Circuit Current when OFF
IDD2
Operating Voltage Range
VOPL
‘Low’ Output Current (Nch)
IOL
‘High’ Output Current (Pch)
IOH
Leak Current when OFF
Ileak
Limit
Typ.
Condition
VDD=HÆL, RL=470kΩ
*1
VDET =2.3-3.1V
VDET =3.2-4.2V
VDD=VDET-0.2V
VDET =4.3-5.2V
VDET =5.3-6.0V
VDET =2.3-3.1V
VDET =3.2-4.2V
VDD=VDET+2.0V
VDET =4.3-5.2V
VDET =5.3-6.0V
VOL≤0.4V, Ta=25~105°C, RL=470kΩ
VOL≤0.4V, Ta=-40~25°C, RL=470kΩ
VDS=0.5V VDD=1.2V
VDS=0.5V VDD=2.4V
VDS=0.5V VDD=4.8V VDET=2.3-4.2V
VDS=0.5V VDD=6.0V VDET=4.3-5.2V
VDS=0.5V VDD=8.0V VDET=5.3-6.0V
VDD=VDS=10V
*1
VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ
VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ
CT pin Threshold Voltage
VCTH
VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ
VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ
Output Delay Resistance
CT pin Output Current
Detection Voltage
Temperature coefficient
Hysteresis Voltage
RCT
ICT
VDD=VDET×1.1 VCT=0.5V
VCT=0.1V VDD=0.95V
VCT=0.5V VDD=1.5V
VDET/∆T Ta=-40°C to 105°C
∆ VDET VDD=LÆHÆL, RL=470kΩ
*1
*1
Min.
Max.
VDET(T)
VDET(T)
VDET(T)
×0.99
×1.01
0.80
2.40
0.85
2.55
0.90
2.70
0.95
2.85
0.75
2.25
0.80
2.40
0.85
2.55
0.90
2.70
0.95
1.20
0.4
1.2
2.0
5.0
0.7
1.4
0.9
1.8
1.1
2.2
0.1
VDD
VDD
VDD
×0.30
×0.40
×0.60
VDD
VDD
VDD
×0.30
×0.45
×0.60
VDD
VDD
VDD
×0.35
×0.50
×0.60
VDD
VDD
VDD
×0.40
×0.50
×0.60
5.5
9
12.5
15
40
150
240
-
Unit
V
µA
µA
V
mA
mA
µA
V
MΩ
µA
-
±100
±360
ppm/°C
VDET
×0.03
VDET
×0.05
VDET
×0.08
V
VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Designed Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
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BD52xx series
Datasheet
BD53xx series
●Block Diagrams
VDD
VOUT
Vref
CT
GND
Fig.1 BD52xx
Series
VDD
VOUT
Vref
CT
GND
Fig.2 BD53xx
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19.DEC.2011 Rev.002
BD52xx series
Datasheet
BD53xx series
●Typical Performance Curves
"LOW" OUTPUT CURRENT : IOL [mA]
CIRCUIT CURRENT : IDD [μA]
2.0
【
【BD5242G/FVE
BD5242】 】
【BD5342】
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
7
8
9 10
18
【BD5342】
12
VDD =2.4V
9
6
3
VDD =1.2V
0
0.0
0.5
1.0
1.5
2.0
2.5
DRAIN-SOURCE VOLTAGE : VDS[V]
VDD SUPPLY VOLTAGE :VDD [V]
Fig.4 “Low” Output Current
Fig.3 Circuit Current
9
45
BD5342G/FVE
【BD5342
】
【
】
40
OUTPUT VOLTAGE: VOUT [V]
"HIGH" OUTPUT CURRENT : IOH [mA]
【BD5242G/FVE】
【BD5242】
15
35
30
25
20
VDD =8.0V
15
VDD =6.0V
10
5
VDD =4.8V
8
【BD5242G/FVE
】
BD5242】
7
【BD5342】
6
5
4
3
Ta=25℃
2
1
Ta=25℃
0
0
0
1
2
3
4
5
6
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
DRAIN-SOURCE VOLTAGE : VDS[V]
VDD SUPPLY VOLTAGE :VDD [V]
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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BD52xx series
Datasheet
BD53xx series
450
BD5242G/FVE
【BD5242
】
【
】
0.8
CT OUTPUT CURRENT : ICT [μA]
OUTPUT VOLTAGE: VOUT [V]
1.0
【BD5342】
0.6
0.4
0.2
0.0
0.0
0.5
1.0
1.5
2.0
400
BD5242G/FVE】
【BD5242
【
】
350
【BD5342】
300
250
200
150
100
50
0
0
2.5
1
CIRCUIT CURRENT WHEN ON : IDD1 [μA]
DETECTION VOLTAGE : V DET[V]
5.6
【BD5242G/FVE
BD5242】
【
】
【BD5342】
Low to high(VDET+ ΔVDET)
4.4
4.0
High to low(VDET)
3.6
~
~
3.2
-40
0
40
80
5
1.5
【BD5242G/FVE
BD5242】
【
】
【BD5342】
1.0
0.5
0.0
-40 -20
0
20
40
60
80
100
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
Fig.10 Circuit Current when ON
Fig.9 Detection Voltage
Release Voltage
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Fig.8 CT Terminal Current
Fig.7 Operating Limit Voltage
4.8
3
VDD SUPPLY VOLTAGE : VDD [V]
VDD SUPPLY VOLTAGE : VDD [V]
5.2
2
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BD52xx series
Datasheet
BD53xx series
1.5
【BD5242G/FVE
BD5242】
【
】
MINIMUM OPERATING VOLTAGE : V OPL[V]
CIRCUIT CURRENT WHEN OFF : I DD2 [μA]
1.5
【BD5342】
1.0
0.5
0.0
-40 -20
0
20
40
60
80
100
BD5242G/FVE
【BD5242
】
】
【BD5342】
1.0
0.5
0.0
-40 -20
Fig.11 Circuit Current when OFF
【BD5342】
60
80
100
10000
【BD5242G/FVE
】
【BD5242
】
DELAY TIME : tPLH [ms]
RESISTANCE OF CT : RCT[MΩ]
11
40
Fig.12 Operating Limit Voltage
13
【BD5242G/FVE
BD5242】 】
【
20
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
12
0
10
9
8
7
6
1000
【BD5342】
100
10
1
5
4
-40 -20
0
20
40
60
80
0.1
0.0001
100
0.01
0.1
CAPACITANCE OF CT : C CT[μF]
TEMPERATURE : Ta[℃]
Fig.14 Delay Time (tPLH) and
CT Terminal External Capacitance
Fig.13 CT Terminal Circuit Resistance
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BD52xx series
Datasheet
BD53xx series
●Application Information
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52xx series uses an open drain output
type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this case
becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
RL
R1
Q2
R1
RESET
Vref
VDD
Vref
RESET
VOUT
R2
R2
Q1
Q3
VOUT
Q1
Q3
R3
R3
GND
GND
CT
CT
Fig.15 (BD52xxType Internal Block Diagram)
Fig.16 (BD53xxType Internal Block Diagram)
Setting of Detector Delay Time
This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal.
Delay time at the rise of VDD tPLH:Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release
voltage(VDET+∆VDET)
tPLH = -CCT×RCT×ln
CCT:
VCTH:
VDD-VCTH
VDD
CT pin Externally Attached Capacitance
CT pin Threshold Voltage(P.2 VCTH refer.)
RCT : CT pin Internal Impedance (P.2 RCT refer.)
ln : Natural Logarithm
Reference Data of Falling Time (tPHL) Output
Examples of Falling Time (tPHL) Output
Part Number
tPHL[µs] -40°C
tPHL[µs] ,+25°C
tPHL[µs],+105°C
BD5227
30.8
30
28.8
BD5327
26.8
26
24.8
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveforms
Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Fig.15 and 16).
1 When the power supply is turned on, the output is unsettled from
VDD
after over the operating limit voltage (VOPL) until tPHL. There fore it is
possible that the reset signal is not outputted when the rise time of
VDET+ΔVDET
⑤
VDET
VDD is faster than tPHL.
2 When VDD is greater than VOPL but less than the reset release
VOPL
0V
voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)
voltages will switch to L.
VCT
3 If VDD exceeds the reset release voltage (VDET+∆VDET), then
1/2 VDD
VOUT switches from L to H (with a delay to the CT terminal).
4 If VDD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply fluctuation,
VOUT switches to L (with a delay of tPHL).
VOUT
tPLH
tPHL
tPLH
5 The potential difference between the detection voltage and the
tPHL
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not flip-flop with power
① ②
③ ④
supply fluctuations within this hysteresis width, preventing
malfunctions due to noise
Fig.17 Timing Waveform
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BD52xx series
Datasheet
BD53xx series
Circuit Applications
●Examples of a common power supply detection reset circuit
VDD1
VDD2
RL
RST
BD52xx
Micro
controller
CT
CL
(Noise-filtering
Capacitor)
GND
Application examples of BD52xx series (Open Drain
output type) and BD53xx series (CMOS output type) are
shown below.
CASE1: the power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection (VDD1).
Use the open drain output type (BD52xx) attached a load
resistance (RL) between the output and VDD2. (As shown
Fig.15)
Fig.18 Open Drain Output Type
CASE2: the power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use CMOS output type (BD53xx) or open drain output
type (BD52xx) attached a load resistance (RL) between
the output and VDD1. (As shown Fig.16)
VDD1
Micro
RST controller
BD53xx
CT
CL
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform of
the rise and fall of the output voltage (VOUT).
(Noise-filtering
Capacitor)
GND
Fig.19 CMOS Output Type
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BD52xx series
Datasheet
BD53xx series
●Operational Notes
1 . Absolute maximum range
Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the
failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given
when a specific mode to be beyond absolute maximum ratings is considered.
2 . GND potential
GND terminal should be a lowest voltage potential every state.
Please make sure all pins, which are over ground even if, include transient feature.
3 . Electrical Characteristics
Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature,
supply voltage, and external circuit.
4 . Bypass Capacitor for Noise Rejection
Please put into the capacitor of 1µF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT pin
and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for
the point.
5 . Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the
IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is
mistaken the IC may be destroyed.
6 . Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
7 . The VDD line inpedance might cause oscillation because of the detection current.
8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.
10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed
between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak
resistance. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT
terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is
connected to CT terminal, so please consider the delay time that is decided by τ×RCT×CCT changes.
11. External parameters
The recommended parameter range for CT is 100pF~0.1µF and RL is 50kΩ~1MΩ. There are many factors (board layout,
etc) that can affect characteristics. Please verify and confirm using practical applications.
12. Power on reset operation
Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.
13. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the test operation.
To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any
equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer
and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is
OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.
14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic
unsettled, the couple capacitance, GND pattern of width and leading line must be considered.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
10/10
TSZ02201-0R7R0G300040-1-2
19.DEC.2011 Rev.002
Datasheet
Notice
●Precaution for circuit design
1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA
equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be
used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,
nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose
malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the
ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,
sufficient fail-safe measures must be taken, including the following:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits in the case of single-circuit failure
2)
The products are designed for use in a standard environment and not in any special environments. Application of the
products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of
product performance, prior to use, is recommended if used under the following conditions:
[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents
[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places
[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,
and NO2
[d] Use in places where the products are exposed to static electricity or electromagnetic waves
[e] Use in proximity to heat-producing components, plastic cords, or other flammable items
[f] Use involving sealing or coating the products with resin or other coating materials
[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering
[h] Use of the products in places subject to dew condensation
3)
The products are not radiation resistant.
4)
Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.
5)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
6)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).
When used in sealed area, confirm the actual ambient temperature.
7)
Confirm that operation temperature is within the specified range described in product specification.
8)
Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect
product performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
Company in advance.
Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics
of the products and external components, including transient characteristics, as well as static characteristics.
2)
The application examples, their constants, and other types of information contained herein are applicable only when
the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient
consideration to external conditions must be made.
Notice - Rev.001
Datasheet
●Precaution for Electrostatic
This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper
caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.
Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from
charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the products are stored in the following places:
[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] Where the temperature or humidity exceeds those recommended by the Company
[c] Storage in direct sunshine or condensation
[d] Storage in high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is
exceeding recommended storage time period .
3)
Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may
occur due to excessive stress applied when dropping of a carton.
4)
Use products within the specified time after opening a dry bag.
●Precaution for product label
QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a
internal part number that is inconsistent with an product part number.
●Precaution for disposition
When disposing products please dispose them properly with a industry waste company.
●Precaution for Foreign exchange and Foreign trade act
Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,
please consult with ROHM in case of export.
●Prohibitions Regarding Industrial Property
1) Information and data on products, including application examples, contained in these specifications are simply for
reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other
rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:
[a] infringement of the intellectual property rights of a third party
[b] any problems incurred by the use of the products listed herein.
2)
The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial
property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,
sell, or dispose of the products.
Notice - Rev.001
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