Rohm BD6211HFP H-bridge drivers (7v max.) Datasheet

For brush motors
H-bridge drivers
(7V max.)
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
No.09007ECT01
 Overview
These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power
supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow for
PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of
deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.
 Features
1) Built-in, selectable one channel or two channels configuration
2) Low standby current
3) Supports PWM control signal input (20kHz to 100kHz)
4) VREF voltage setting pin enables PWM duty control
5) Cross-conduction prevention circuit
6) Four protection circuits provided: OCP, OVP, TSD and UVLO
 Applications
VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals;
car audios; car navigation systems; OA equipments
 Line up matrix
Rating voltage
Channels
Maximum output current
0.5A
1.0A
2.0A
1ch
BD6210
HFP / F
BD6211
HFP / F
BD6212
HFP / FP
2ch
BD6215
FP
BD6216
FP / FM
BD6217
FM
1ch
BD6220
HFP / F
BD6221
HFP / F
BD6222
HFP / FP
2ch
BD6225
FP
BD6226
FP / FM
BD6227
FM
1ch
BD6230
HFP / F
BD6231
HFP / F
BD6232
HFP / FP
2ch
BD6235
FP
BD6236
FP / FM
BD6237
FM
7V
18V
36V
*Packages; F:SOP8, HFP:HRP7, FP:HSOP25, FM:HSOP-M28
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1/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Absolute maximum ratings (Ta=25°C, All voltages are with respect to ground)
Parameter
Symbol
Supply voltage
Ratings
VCC
Output current
Unit
7
1
V
2
3
IOMAX
0.5 * / 1.0 * / 2.0 *
A
VIN
-0.3 ~ VCC
V
Operating temperature
TOPR
-40 ~ +85
°C
Storage temperature
TSTG
All other input pins
Power dissipation
Junction temperature
*1
*2
*3
*4
*5
*6
*7
-55 ~ +150
4
5
°C
6
7
Pd
0.687 * / 1.4 * / 1.45 * / 2.2 *
W
Tjmax
150
°C
BD6210 / BD6215. Do not, exceed Pd or ASO.
BD6211 / BD6216. Do not, exceed Pd or ASO.
BD6212 / BD6217. Do not, exceed Pd or ASO.
SOP8 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 5.5mW/°C above 25°C.
HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/°C above 25°C.
HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/°C above 25°C.
HSOP-M28 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 17.6mW/°C above 25°C.
 Operating conditions (Ta=25°C)
Parameter
Symbol
Ratings
Unit
Supply voltage
VCC
3.0 ~ 5.5
V
VREF voltage
VREF
1.5 ~ 5.5
V
 Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=VREF=5V)
Parameter
Symbol
Limits
Min.
Min.
Min.
Limits
Conditions
Supply current (1ch)
ICC
0.4
0.7
1.5
mA
Forward / Reverse / Brake
Supply current (2ch)
ICC
0.6
0.9
1.7
mA
Forward / Reverse / Brake
Stand-by current
ISTBY
-
0
10
µA
Stand-by
Input high voltage
VIH
2.0
-
-
V
Input low voltage
VIL
-
-
0.8
V
Input bias current
IIH
30
50
100
µA
VIN=5.0V
1
RON
0.5
1.0
1.5
Ω
IO=0.25A, vertically total
2
RON
0.5
1.0
1.5
Ω
IO=0.5A, vertically total
3
Output ON resistance *
RON
0.2
0.5
1.0
Ω
IO=1.0A, vertically total
VREF bias current
IVREF
-10
0
10
µA
VREF=VCC
Carrier frequency
FPWM
20
25
35
kHz
VREF=3.75V
Input frequency range
FMAX
20
-
100
kHz
FIN / RIN
Output ON resistance *
Output ON resistance *
*1 BD6210 / BD6215
*2 BD6211 / BD6216
*3 BD6212 / BD6217
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c 2009 ROHM Co., Ltd. All rights reserved.
○
2/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Electrical characteristic curves (Reference data)
1.0
0.8
0.6
0.4
0.2
1.5
0.8
85°C
25°C
-40°C
0.6
0.4
0.2
0.0
0.0
3
4
5
3
4
Fig.1 Supply current (1ch)
60
40
20
2
3
4
5
5
0
-5
1
2
3
4
4
5
Internal signal: Release [V] _
6
-40°C
25°C
85°C
0.2
0
2.0
2
2.5
3
6.0
3.0
3.5
6
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c 2009 ROHM Co., Ltd. All rights reserved.
○
7
7.5
8
Fig.9 Over voltage protection
1.5
85°C
25°C
-40°C
Internal Logic: H/L [-] _
Internal Logic: H/L [-] _
Fig.10 Thermal shutdown
6.5
Supply Voltage: VCC [V]
0.5
0.0
-0.5
Junction Temperature: Tj [°C]
1
-40°C
25°C
85°C
Fig.8 Under voltage lock out
1.0
200
0.8
0.0
1.5
1.0
-0.5
0.6
Fig.6 VREF - DUTY
(VCC=5V)
4.0
1.5
0.0
0.4
Fig.5 VREF input bias current
Supply Voltage: VCC [V]
0.5
0.2
9.0
1.5
175
0.4
Input Voltage: VREF / VCC [V]
85°C
25°C
-40°C
Fig.7 VCC - Carrier frequency
150
0.6
Input Voltage: VREF [V]
Supply Voltage: VCC [V]
125
0.8
5
0.0
3
2
0.0
0
20
1.8
Fig.3 Input threshold voltage
6.0
25
1.6
1.0
Fig.4 Input bias current
30
1.4
Fig.2 Supply current (2ch)
-40°C
25°C
85°C
6
85°C
25°C
-40°C
1.2
Input Voltage: VIN [V]
Input Voltage: VIN [V]
35
0.0
1
Internal signal: Release [V] _
1
-40°C
25°C
85°C
Supply Voltage: Vcc [V]
-10
0
-40°C
25°C
85°C
0.5
6
Switching Duty: D [Ton/T] _
85°C
25°C
-40°C
80
0
Oscillation Frequency: FPWM [kHz]
5
10
Input Bias Current: IVREF [ A]
Input Bias Current: IIH [µA] _
100
1.0
-0.5
6
Supply Voltage: Vcc [V]
Internal Logic: H/L [-] _
Internal Logic: H/L [-] _
85°C
25°C
-40°C
Circuit Current: Icc [mA]
Circuit Current: Icc [mA]
1.0
85°C
25°C
-40°C
1.0
0.5
0.0
-0.5
1.5
2
2.5
3
1
Load Current / Iomax: Normalized
Fig.11 Over current protection (H side)
3/16
1.5
2
2.5
Load Current / Iomax: Normalized
Fig.12
Over current protection (L side)
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Electrical characteristic curves (Reference data) - Continued
0.8
0.3
0.2
0.1
0
0.8
85°C
25°C
-40°C
0.6
0.4
0.2
0
0
0.1
0.2
0.3
0.4
0.5
0.2
0.4
0.6
0.8
0.5
0
0.4
1.2
1.6
2
2
-40°C
25°C
85°C
1.5
1
0.5
0.5
0.8
Fig.15 Output high voltage (2A class)
0
0.3
0.4
Output Current: IOUT [A]
Output Voltage:VCC- VOUT [V]
Output Voltage:VCC- VOUT [V]
1
0.2
0.2
0
2
-40°C
25°C
85°C
0.1
0.4
1
Fig.14 Output high voltage (1A class)
2
0
0.6
Output Current: IOUT [A]
Fig.13 Output high voltage (0.5A class)
1.5
85°C
25°C
-40°C
0
0
Output Current: IOUT [A]
Output Voltage:VCC- VOUT [V]
Output Voltage: VCC-VOUT [V]
85°C
25°C
-40°C
Output Voltage: VCC-VOUT [V]
Output Voltage: VCC-VOUT [V]
0.4
-40°C
25°C
85°C
1.5
1
0.5
0
0
Output Current: IOUT [A]
0.2
0.4
0.6
0.8
1
0
Output Current: IOUT [A]
0.4
0.8
1.2
1.6
2
Output Current: IOUT [A]
Fig.16 High side body diode (0.5A class) Fig.17 High side body diode (1A class) Fig.18 High side body diode (2A class)
0.8
0.3
0.2
0.1
0
0.8
85°C
25°C
-40°C
0.6
0.4
0.2
0
0.1
0.2
0.3
0.4
0.5
Output Current: IOUT [A]
2
0.2
0.4
0.6
0.8
1
0.5
0
0.4
0.5
Output Current: IOUT [A]
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0.8
1.2
1.6
2
Fig.21 Output low voltage (2A class)
2
-40°C
25°C
85°C
1.5
1
0.5
-40°C
25°C
85°C
1.5
1
0.5
0
0
0.2
0.4
0.6
0.8
1
Output Current: IOUT [A]
Fig.22 Low side body diode (0.5A class) Fig.23 Low side body diode (1A class)
c 2009 ROHM Co., Ltd. All rights reserved.
○
0.4
Output Current: IOUT [A]
0
0.3
0.2
0
Fig.20 Output low voltage (1A class)
Output Voltage: VOUT [V]_
1.5
0.2
0.4
1
2
-40°C
25°C
85°C
0.1
0.6
Output Current: IOUT [A]
Fig.19 Output low voltage (0.5A class)
0
85°C
25°C
-40°C
0
0
Output Voltage: VOUT [V]_
0
Output Voltage: VOUT [V]_
Output Voltage: VOUT [V]
85°C
25°C
-40°C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
0.4
4/16
0
0.4
0.8
1.2
1.6
2
Output Current: IOUT [A]
Fig.24 Low side body diode (2A class)
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Block diagram and pin configuration
BD6210F / BD6211F
VREF
6
FIN
4
RIN
5
DUTY
Table 1 BD6210F/BD6211F
PROTECT
3
VCC
Pin
Name
2
VCC
1
OUT1
Driver output
2
VCC
Power supply
3
VCC
Power supply
4
FIN
Control input (forward)
5
RIN
Control input (reverse)
6
VREF
Duty setting pin
7
OUT2
Driver output
8
GND
Ground
CTRL
8
1
7
OUT1
OUT2
GND
Fig.25 BD6210F / BD6211F
OUT1
GND
VCC
OUT2
VCC
VREF
FIN
Function
Note: Use all VCC pin by the same voltage.
RIN
Fig.26 SOP8
BD6210HFP / BD6211HFP / BD6212HFP
VREF
1
DUTY
Table 2 BD6210HFP/BD6211HFP/BD6212HFP
PROTECT
7
FIN
3
RIN
5
VCC
CTRL
4
FIN
2
6
GND
OUT1
OUT2
GND
Fig.27 BD6210HFP / BD6211HFP / BD6212HFP
Pin
Name
Function
1
VREF
Duty setting pin
2
OUT1
Driver output
3
FIN
4
GND
Control input (forward)
Ground
5
RIN
6
OUT2
Driver output
Control input (reverse)
7
VCC
Power supply
FIN
GND
Ground
VCC
OUT2
RIN
GND
FIN
OUT1
VREF
Fig.28 HRP7
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5/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Block diagram and pin configuration - Continued
BD6212FP
VREF 17
DUTY
Table 3 BD6212FP
PROTECT
21
22
VCC
Pin
Name
Function
VCC
1,2
OUT1
Driver output
6
GND
Small signal ground
7,8
RNF
Power stage ground
12,13
OUT2
Driver output
17
VREF
Duty setting pin
19
RIN
Control input (reverse)
20
FIN
Control input (forward)
21
VCC
Power supply
22,23
VCC
Power supply
FIN
GND
Ground
23
FIN 20
CTRL
RIN 19
7
8
6
FIN
1
2
12 13
GND
GND
OUT1
OUT2
RNF
Fig.29 BD6212FP
OUT1
OUT1
NC
NC
NC
GND
NC
NC
VCC
VCC
VCC
FIN
GND
GND
RNF
RNF
NC
NC
NC
OUT2
OUT2
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
RIN
NC
VREF
NC
NC
NC
Fig.30 HSOP25
BD6215FP / BD6216FP
Table 4 BD6215FP / BD6216FP
VREFA
9
DUTY
PROTECT
24
VCC
Pin
Name
25
VCC
1
OUT1A
3
RNFA
6
OUT2A
8
GND
FINA 11
1
OUT1A
RINA 10
6
OUT2A
GND 20
3
RNFA
CTRL
VREFB 21
DUTY
PROTECT
12
VCC
13
VCC
14
OUT1B
19
OUT2B
16
RNFB
FINB 23
CTRL
RINB 22
GND
8
FIN
GND
Fig.31 BD6215FP / BD6216FP
OUT1A
NC
RNFA
NC
NC
OUT2A
GND
NC
GND
VREFA
RINA
FINA
VCC
VCC
VCC
VCC
FINB
RINB
VREFB
GND
GND
OUT2B
NC
NC
RNFB
NC
OUT1B
Function
Driver output
Power stage ground
Driver output
Small signal ground
9
VREFA
10
RINA
Control input (reverse)
Duty setting pin
11
FINA
Control input (forward)
12
VCC
Power supply
13
VCC
Power supply
14
OUT1B
Driver output
16
RNFB
19
OUT2B
20
GND
21
VREFB
22
RINB
Control input (reverse)
23
FINB
Control input (forward)
24
VCC
Power supply
25
VCC
Power supply
FIN
GND
Ground
Power stage ground
Driver output
Small signal ground
Duty setting pin
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
Fig.32 HSOP25
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6/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Block diagram and pin configuration - Continued
BD6216FM
VREFA
9
DUTY
Table 5 BD6216FM
PROTECT
26
VCC
28
VCC
FINA 11
Pin
Name
1
OUT1A
3
RNFA
6
OUT2A
8
GND
9
VREFA
Function
Driver output
Power stage ground
1
OUT1A
RINA 10
6
OUT2A
GND 22
3
RNFA
12
VCC
10
RINA
Control input (reverse)
14
VCC
11
FINA
Control input (forward)
15
OUT1B
12
VCC
Power supply
20
OUT2B
14
VCC
Power supply
17
RNFB
15
OUT1B
Driver output
17
RNFB
20
OUT2B
22
GND
23
VREFB
24
RINB
25
FINB
Control input (forward)
26
VCC
Power supply
28
VCC
Power supply
FIN
GND
Ground
CTRL
VREFB 23
DUTY
PROTECT
FINB 25
CTRL
RINB 24
GND
8
FIN
GND
Fig.33 BD6216FM
OUT1A
NC
RNFA
NC
NC
OUT2A
NC
GND
GND
VREFA
RINA
FINA
VCC
NC
VCC
VCC
NC
VCC
FINB
RINB
VREFB
GND
Driver output
Small signal ground
Duty setting pin
Power stage ground
Driver output
Small signal ground
Duty setting pin
Control input (reverse)
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
GND
NC
OUT2B
NC
NC
RNFB
NC
OUT1B
Fig.34 HSOP-M28
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7/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Block diagram and pin configuration - Continued
BD6217FM
VREFA
DUTY
9
PROTECT
26
27
28
1
FINA 11
2
CTRL
RINA 10
6
7
GND 22
3
Table 6 BD6217FM
VCC
VCC
OUT1A
OUT2A
DUTY
PROTECT
12
13
14
15
FINB 25
16
CTRL
RINB 24
20
21
GND
8
17
Function
1,2
OUT1A
Driver output
3,4
RNF A
Power stage ground
6,7
OUT2A
Driver output
8
GND
9
VREFA
VCC
10
RINA
Control input (reverse)
VCC
11
FINA
Control input (forward)
12
VCC
Power supply
13,14
VCC
Power supply
15,16
OUT1B
Driver output
17,18
RNFB
20,21
OUT2B
22
GND
23
VREFB
24
RINB
25
FINB
Control input (forward)
26
VCC
Power supply
27,28
VCC
Power supply
FIN
GND
Ground
OUT1B
OUT2B
RNFB
18
FIN
GND
Fig.35 BD6217FM
OUT1A
OUT1A
RNFA
RNFA
NC
OUT2A
OUT2A
Name
RNFA
4
VREFB 23
Pin
VCC
VCC
VCC
FINB
RINB
VREFB
GND
Small signal ground
Duty setting pin
Power stage ground
Driver output
Small signal ground
Duty setting pin
Control input (reverse)
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
GND
GND
VREFA
RINA
FINA
VCC
VCC
VCC
GND
OUT2B
OUT2B
NC
RNFB
RNFB
OUT1B
OUT1B
Fig.36 HSOP-M28
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○
8/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
 Functional descriptions
1) Operation modes
Table 7 Logic table
FIN
RIN
VREF
OUT1
OUT2
a
L
L
X
Hi-Z*
Hi-Z*
b
H
L
VCC
H
L
Forward (OUT1 > OUT2)
c
L
H
VCC
L
H
Reverse (OUT1 < OUT2)
d
H
H
X
L
L
Brake (stop)
e
PWM
L
VCC
f
L
PWM
VCC
g
H
h
PWM
PWM
i
H
j
H
H
H
Option
PWM
Forward (PWM control mode A)
H
Reverse (PWM control mode A)
L
Forward (PWM control mode B)
PWM
__________
PWM
__________
L
Option
Stand-by (idling)
__________
__________
VCC
L
L
VCC
Operation
Reverse (PWM control mode B)
PWM
__________
H
PWM
Forward (VREF control)
H
Reverse (VREF control)
__________
PWM
* Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.
X : Don’t care
a) Stand-by mode
Stand-by operates independently of the VREF pin voltage. In stand-by mode, all internal circuits are turned off,
including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to
stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches
to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least
50µs before shutting down all circuits.
b) Forward mode
This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. For
operation in this mode, connect the VREF pin with VCC pin.
c) Reverse mode
This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. For
operation in this mode, connect the VREF pin with VCC pin.
d) Brake mode
This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode
because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than
the brake mode) to save power and reduce consumption.
OFF
OFF
ON
M
OFF
OFF OFF
M
OFF OFF
a) Stand-by mode
ON
OFF
M
ON
b) Forward mode
ON
c) Reverse mode
OFF
M
OFF
ON
ON
d) Brake mode
Fig.37 Four basic operations (output stage)
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9/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
e) f) PWM control mode A
The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN
pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching,
corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z".
The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained
by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also,
circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode,
connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by
connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.
ON
OFF
ON
M
OFF
OFF
M
ON
OFF
Control input : H
OFF
Control input : L
Fig.38 PWM control mode A operation (output stage)
FIN
RIN
OUT1
OUT2
Fig.39 PWM control mode A operation (timing chart)
g) h) PWM control mode B
The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN
pin or the RIN pin. In this mode, the low side output is fixed and the high side output does the switching,
corresponding to the input signal. The switching operates by the output state toggling between "L" and "H".
The PWM frequency can be input in the range between 20kHz and 100kHz. Also, circuit operation may not respond
correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin.
In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF
or more is recommended) between VCC and ground.
OFF
OFF
ON
M
ON
OFF
M
ON
OFF
Control input : H
ON
Control input : L
Fig.40 PWM control mode B operation (output stage)
FIN
RIN
OUT1
OUT2
Fig.41 PWM control mode B operation (timing chart)
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10/16
2009.08 - Rev.C
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
Technical Note
i) j) VREF control mode
The built-in VREF-switching on duty conversion circuit provides switching duty corresponding to the voltage of the
VREF pin and the VCC voltage. The function offers the same level of control as the high voltage output setting
function in previous models. The on duty is shown by the following equation.
DUTY ≈ VREF [V] / VCC [V]
For example, if VCC voltage is 5V and VREF pin voltage is 3.75V, the switching on duty is about 75 percent.
However, please note that the switching on duty might be limited by the range of VREF pin voltage (Refer to the
operating conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the
switching operation is the same as it is the PWM control modes. When operating in this mode, do not input the
PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by
connecting a bypass capacitor (10µF or more is recommended) between VCC and ground.
VCC
VREF
0
FIN
RIN
OUT1
OUT2
Fig.42 VREF control operation (timing chart)
2) Cross-conduction protection circuit
In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition
exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to
ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 400ns,
nominal) at the transition.
3) Output protection circuits
a) Under voltage lock out (UVLO) circuit
To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage
malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 2.3V (nominal) or
below, the controller forces all driver outputs to high impedance. When the voltage rises to 2.5V (nominal) or above,
the UVLO circuit ends the lockout operation and returns the chip to normal operation.
b) Over voltage protection (OVP) circuit
When the power supply voltage exceeds 7.3V (nominal), the controller forces all driver outputs to high impedance.
The OVP circuit is released and its operation ends when the voltage drops back to 6.8V (nominal) or below. This
protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is
asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this
circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.
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11/16
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
c) Thermal shutdown (TSD) circuit
The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C
nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided
in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset
temperature (150°C nominal). Thus, it is a self-returning type circuit.
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is
activated, and do not operate the IC in an environment where activation of the circuit is assumed.
d) Over current protection (OCP) circuit
To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors
the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over
current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC
returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this
circuit works independently for each channel.
Threshold
Iout
0
CTRL Input
ON
Internal status
OFF
mon.
ON
off timer
Monitor / Timer
Fig.43
Over current protection (timing chart)
 Interfaces
VCC
VCC
OUT1
OUT2
OUT1
OUT2
GND
RNF
VCC
100k
FIN
RIN
VCC
VREF
10k
100k
GND
Fig.44 FIN / RIN
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c 2009 ROHM Co., Ltd. All rights reserved.
○
Fig.45 VREF
Fig.46 OUT1 / OUT2
Fig.47 OUT1 / OUT2
(SOP8/HRP7)
(HSOP25/HSOPM28)
12/16
2009.08 - Rev.C
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
Technical Note
 Notes for use
1) Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating.
Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important
to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is
to be implemented.
2) Connecting the power supply connector backward
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply lines, such as adding an external direction diode.
3) Power supply lines
Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path
by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is
important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors –
including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient
current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which
may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To
help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage
clamping diode across the power supply and GND.
4) Electrical potential at GND
Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to
determine whether there is any terminal that provides voltage below GND, including the voltage during transient
phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s
reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that
voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the
same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error, or if pins are shorted together.
7) Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with
electromagnetic fields.
8) ASO - Area of Safety Operation
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9) Built-in thermal shutdown (TSD) circuit
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,
and do not operate the IC in an environment where activation of the circuit is assumed.
10) Capacitor between output and GND
In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or
GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor
smaller than 1μF between output and GND.
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2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress.
Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before
connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps
as an antistatic measure. Use similar precaution when transporting or storing the IC.
12) Switching noise
When the operation mode is in PWM control or VREF control, PWM switching noise may effects to the control input
pins and cause IC malfunctions. In this case, insert a pulled down resistor (10kΩ is recommended) between each
control input pin and ground.
13) Regarding the input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them
isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by
which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
Resistor
Pin A
Pin B
C
Transistor (NPN)
B
Pin A
N
P
+
N
P
P
+
N
Parasitic
element
N
B
N
P+
P
P substrate
Parasitic element
Pin B
E
P
C
+
N
E
P substrate
GND
GND
Parasitic element
GND
GND
Parasitic
element
Other adjacent elements
Appendix: Example of monolithic IC structure
 Ordering part number
B
D
ROHM part
number
6
2
1
0
Type
1X: 7V max.
2X: 18V max.
3X: 36V max.
X0: 1ch/0.5A X5:
2ch/0.5A
X1: 1ch/1A X6: 2ch/1A
X2 1 h/2A X7 2 h/2A
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F
Package
F: SOP8
FP: HSOP25
FM: HSOP-M28
HFP: HRP7
14/16
-
E
2
Packaging spec.
E2: Embossed taping
(SOP8/HSOP25/HSOP-M28)
TR: Embossed taping
(HRP7)
2009.08 - Rev.C
Technical Note
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
SOP8
<Tape and reel information>
<Dimension>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
1234
1234
1234
1234
1234
1234
1234
1234
(Unit:mm)
Direction of feed
1Pin
Reel
*Orders should be placed in multiples of package quantity.
HSOP25
<Tape and reel information>
<Dimension>
13.6 ± 0.2
14
0.3Min.
7.8 ± 0.3
1
13
E2
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
0.25 ± 0.1
1234
1234
1234
1234
Direction of feed
1Pin
Reel
(Unit:mm)
1234
0.1
0.36 ± 0.1
1234
0.8
Direction
of feed
1234
0.11
1.95 ± 0.1
Embossed carrier tape
2000pcs
1234
1.9 ± 0.1
2.75 ± 0.1
5.4 ± 0.2
25
Tape
Quantity
*Orders should be placed in multiples of package quantity.
HSOP-M28
<Tape and reel information>
<Dimension>
Tape
18.5 ± 0.2
0.5 ± 0.2
9.9 ± 0.3
15
7.5 ± 0.2
28
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper left-hand side.)
0.25 ± 0.1
1234
1234
1234
Direction of feed
1Pin
Reel
(Unit:mm)
1234
0.1 S
1234
0.35 ± 0.1
0.08 M
16.0 ± 0.2
E2
1234
0.8
1500pcs
Direction
of feed
1234
0.11
14
5.15 ± 0.1
Quantity
1234
2.2 ± 0.1
1
Embossed carrier tape
*Orders should be placed in multiples of package quantity.
HRP7
<Tape and reel information>
Tape
9.395 ± 0.125
(MAX 9.745 include BURR)
8.82 – 0.1
(5.59)
0.835 ± 0.2
1 2
3
4
5
6
1.523 ± 0.15
10.54 ± 0.13
(7.49)
1.905 ± 0.1
8.0 ± 0.13
1.017 ± 0.2
<Dimension>
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
TR
(Holding the reel with the left hand and pulling the tape out with the right,
pin 1 will be on the upper right-hand side.)
7
0.8875
4.5
0.27
+5.5
-4.5
+0.1
-0.05
x x x x
x x x x
x x x x
x x x x
x x x x
x x x x
1Pin
Direction of feed
0.08 ± 0.05
S
1.27
0.73 ± 0.1
0.08 S
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Reel
(Unit:mm)
15/16
*Orders should be placed in multiples of package quantity.
2009.08 - Rev.C
BD6210, BD6211, BD6212, BD6215, BD6216, BD6217
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Technical Note
2009.08 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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