Rohm BD6237FM Dc brush motor drivers (36v max.) Datasheet

Datasheet
DC Brush Motor Drivers (36V max.)
BD623xxx Series
●General Description
These H-bridge drivers are full bridge drivers for brush
motor applications. Each IC can operate at a wide range
of power supply voltages (from 6V to 32V), with output
currents of up to 2A. MOS transistors in the output stage
allow PWM speed control. The integrated VREF voltage
control function allows direct replacement of deprecated
motor driver ICs. These highly efficient H-bridge driver
ICs facilitate low-power consumption design.
●Key Specifications
■ Supply Voltage Range:
■ Maximum Output Current:
■ Output ON resistance:
■ PWM Input frequency range:
■ Standby current:
■ Operating temperature range:
●Packages
SOP8
HSOP25
HSOP-M28
HRP7
●Features
„ Built-in, selectable one channel or two channels
configuration
„ VREF voltage setting pin enables PWM duty control
„ Cross-conduction prevention circuit
„ Four protection circuits provided: OCP, OVP, TSD
and UVLO
●Applications
VTR; CD/DVD players; audio-visual equipment; optical
disc drives; PC peripherals; OA equipments
36V(Max.)
0.5A / 1.0A / 2.0A
1.5Ω / 1.5Ω / 1.0Ω
20 to 100kHz
0μA (Typ.)
-40 to 85℃
(Typ.)
(Typ.)
(Max.)
5.00mm x 6.20mm x 1.71mm
13.60mm x 7.80mm x 2.11mm
18.50mm x 9.90mm x 2.41mm
9.395mm x 10.540mm x 2.005mm
HRP7 (Pd=1.60W)
SOP8 (Pd=0.69W)
HSOP25( (Pd=1.45W)
HSOP-M28 (Pd=2.20W)
*Pd : Mounted on a 70mm x 70mm x 1.6mm glass-epoxy
●Ordering Information
B
D
6
2
3
x
x
x
x
-
Package
F
: SOP8
FP : HSOP25
FM : HSOP-M28
HFP : HRP7
Part Number
xx
Packaging and forming specification
E2: Embossed taping
(SOP8/HSOP25/HSOP-M28)
TR: Embossed taping
(HRP7)
●Lineup
Rating voltage
(Max.)
Channels
Output current
(Max.)
0.5A
1ch
36V
1.0A
2.0A
2ch
1.0A
2.0A
○Product structure:Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
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Package
Ordeble
Part Number
SOP8
Reel of 2500
BD6230F-E2
HRP7
Reel of 2000
BD6231HFP-TR
SOP8
Reel of 2500
BD6231F-E2
HRP7
Reel of 2000
BD6232HFP-TR
HSOP25
Reel of 2000
BD6232FP-E2
HSOP25
Reel of 2000
BD6236FP-E2
HSOP-M28
Reel of 1500
BD6236FM-E2
HSOP-M28
Reel of 1500
BD6237FM-E2
○This product is not designed for protection against radioactive rays
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Datasheet
BD623xxx Series
●Block Diagrams / Pin Configurations / Pin Descriptions
BD6230F / BD6231F
VREF
FIN
6
DUTY
Table 1 BD6230F/BD6231F
PROTECT
3
VCC
2
VCC
4
CTRL
RIN
5
8
1
7
OUT1
OUT2
GND
Fig.1 BD6230F / BD6231F
OUT1
GND
VCC
OUT2
VCC
VREF
FIN
Fig.2
Pin
Name
1
OUT1
Driver output
2
VCC
Power supply
3
VCC
Power supply
4
FIN
Control input (forward)
5
RIN
Control input (reverse)
6
VREF
Duty setting pin
7
OUT2
Driver output
8
GND
Ground
Note: Use all VCC pin by the same voltage.
RIN
SOP8 (TOP VIEW)
BD6231HFP / BD6232HFP
VREF
1
DUTY
Table 2 BD6231HFP/BD6232HFP
PROTECT
7
FIN
3
RIN
5
Function
VCC
CTRL
4
FIN
2
6
GND
OUT1
OUT2
GND
Fig.3 BD6231HFP / BD6232HFP
Pin
Name
Function
1
VREF
Duty setting pin
2
OUT1
Driver output
3
FIN
4
GND
Ground
5
RIN
Control input (reverse)
6
OUT2
Driver output
7
VCC
Power supply
FIN
GND
Ground
Control input (forward)
VCC
OUT2
RIN
GND
FIN
OUT1
VREF
Fig.4 HRP7 (TOP VIEW)
BD6232FP
Table 3 BD6232FP
VREF 17
DUTY
PROTECT
21
22
VCC
VCC
23
FIN 20
CTRL
Pin
Name
1,2
OUT1
Driver output
Function
6
GND
Small signal ground
7,8
RNF
Power stage ground
12,13
OUT2
Driver output
17
VREF
Duty setting pin
19
RIN
Control input (reverse)
20
FIN
Control input (forward)
21
VCC
Power supply
22,23
VCC
Power supply
FIN
GND
Ground
RIN 19
7
RNF
8
6
FIN
1
2
12 13
GND
GND
OUT1
OUT2
Fig.5 BD6232FP
OUT1
OUT1
NC
NC
NC
GND
GND
RNF
RNF
NC
NC
NC
OUT2
OUT2
NC
NC
VCC
VCC
VCC
FIN
GND
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
RIN
NC
VREF
NC
NC
NC
Fig.6 HSOP25 (TOP VIEW)
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Datasheet
BD623xxx Series
●Block Diagrams / Pin Configurations / Pin Descriptions - Continued
BD6236FP
Table 4 BD6236FP
VREFA
DUTY
9
PROTECT
24
VCC
25
VCC
FINA 11
CTRL
RINA 10
GND
20
VREFB 21
DUTY
1
OUT1A
6
OUT2A
3
RNFA
PROTECT
CTRL
GND
8
Fig.8
OUT1A
3
RNFA
6
OUT2A
8
GND
9
VREFA
10
RINA
Control input (reverse)
Driver output
Power stage ground
Driver output
Small signal ground
Duty setting pin
11
FINA
Control input (forward)
VCC
12
VCC
Power supply
14
OUT1B
13
VCC
Power supply
19
OUT2B
14
OUT1B
Driver output
16
RNFB
Fig.7 BD6236FP
NC
GND
VREFA
RINA
FINA
VCC
VCC
1
VCC
FIN
GND
Function
13
GND
OUT1A
NC
RNFA
NC
NC
OUT2A
Name
12
FINB 23
RINB 22
Pin
VCC
VCC
FINB
RINB
VREFB
GND
GND
OUT2B
NC
NC
RNFB
NC
OUT1B
16
RNFB
19
OUT2B
Power stage ground
20
GND
21
VREFB
22
RINB
Control input (reverse)
23
FINB
Control input (forward)
24
VCC
Power supply
25
VCC
Power supply
FIN
GND
Ground
Driver output
Small signal ground
Duty setting pin
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
HSOP25 (TOP VIEW)
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Datasheet
BD623xxx Series
●Block Diagrams / Pin Configurations / Pin Descriptions - Continued
BD6236FM
Table 5 BD6236FM
VREFA
DUTY
9
26
VCC
28
VCC
FINA 11
CTRL
RINA 10
GND
22
VREFB 23
DUTY
1
OUT1A
6
OUT2A
3
RNFA
Name
Function
1
OUT1A
3
RNFA
6
OUT2A
8
GND
9
VREFA
10
RINA
Control input (reverse)
12
VCC
14
VCC
11
FINA
Control input (forward)
12
VCC
Power supply
15
OUT1B
14
VCC
Power supply
20
OUT2B
15
OUT1B
Driver output
17
RNFB
Driver output
Power stage ground
Driver output
Small signal ground
Duty setting pin
PROTECT
FINB 25
CTRL
RINB 24
GND
Pin
PROTECT
8
FIN
GND
Fig.9 BD6236FM
OUT1A
NC
RNFA
NC
NC
OUT2A
NC
GND
VCC
NC
VCC
FINB
RINB
VREFB
GND
GND
17
RNFB
20
OUT2B
Power stage ground
22
GND
23
VREFB
24
RINB
Control input (reverse)
25
FINB
Control input (forward)
26
VCC
Power supply
28
VCC
Power supply
FIN
GND
Ground
Driver output
Small signal ground
Duty setting pin
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
GND
VREFA
RINA
FINA
VCC
NC
VCC
NC
OUT2B
NC
NC
RNFB
NC
OUT1B
Fig.10 HSOP-M28 (TOP VIEW)
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Datasheet
BD623xxx Series
●Block Diagrams / Pin Configurations / Pin Descriptions - Continued
BD6237FM
Table 6 BD6237FM
VREFA
DUTY
9
PROTECT
26
VCC
27
Pin
Name
Function
1,2
OUT1A
Driver output
3,4
RNF A
Power stage ground
6,7
OUT2A
Driver output
VCC
28
1
FINA 11
OUT1A
2
CTRL
RINA 10
6
OUT2A
8
GND
9
VREFA
Small signal ground
7
GND 22
3
RNFA
10
RINA
Control input (reverse)
VCC
11
FINA
Control input (forward)
VCC
12
VCC
Power supply
13,14
VCC
Power supply
15,16
OUT1B
Driver output
17,18
RNFB
20,21
OUT2B
22
GND
23
VREFB
24
RINB
Control input (reverse)
25
FINB
Control input (forward)
26
VCC
Power supply
27,28
VCC
Power supply
FIN
GND
Ground
4
VREFB 23
DUTY
PROTECT
12
13
14
15
FINB 25
OUT1B
16
CTRL
RINB 24
20
OUT2B
21
GND
8
17
Duty setting pin
RNFB
Power stage ground
Driver output
18
FIN
GND
Fig.11
BD6237FM
OUT1A
OUT1A
RNFA
RNFA
NC
OUT2A
OUT2A
VCC
VCC
VCC
FINB
RINB
VREFB
GND
Small signal ground
Duty setting pin
Note: All pins not described above are NC pins.
Note: Use all VCC pin by the same voltage.
GND
GND
VREFA
RINA
FINA
VCC
VCC
VCC
GND
OUT2B
OUT2B
NC
RNFB
RNFB
OUT1B
OUT1B
Fig.12 HSOP-M28 (TOP VIEW)
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Datasheet
BD623xxx Series
●Absolute Maximum Ratings (Ta=25℃, All voltages are with respect to ground)
Parameter
Symbol
Ratings
Unit
Supply voltage
VCC
36
V
Output current
IOMAX
0.5 *1 / 1.0 *2 / 2.0 *3
A
VIN
-0.3 to VCC
V
Operating temperature
TOPR
-40 to +85
℃
Storage temperature
TSTG
-55 to +150
℃
Pd
0.687 *4 / 1.6 *5 / 1.45 *6 / 2.2 *7
W
Tjmax
150
℃
All other input pins
Power dissipation
Junction temperature
*1
*2
*3
*4
*5
*6
*7
BD6230.
Do not exceed Pd or ASO.
BD6231 / BD6236. Do not exceed Pd or ASO.
BD6232 / BD6237. Do not exceed Pd or ASO.
SOP8 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 5.5mW/℃ above 25℃.
HRP7 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 12.8mW/℃ above 25℃.
HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 11.6mW/℃ above 25℃.
HSOP-M28 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 17.6mW/℃ above 25℃.
●Recommended Operating Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Supply voltage
VCC
6 to 32
V
VREF voltage
VREF
3 to 32
V
●Electrical Characteristics (Unless otherwise specified, Ta=25℃ and VCC=VREF=24V)
Limits
Parameter
Symbol
Unit
Min.
Min.
Min.
Conditions
Supply current (1ch)
ICC
0.8
1.3
2.5
mA
Forward / Reverse / Brake
Supply current (2ch)
ICC
1.3
2.0
3.5
mA
Forward / Reverse / Brake
Stand-by current
ISTBY
-
0
10
µA
Stand-by
Input high voltage
VIH
2.0
-
-
V
Input low voltage
VIL
-
-
0.8
V
Input bias current
IIH
30
50
100
µA
VIN=5.0V
Output ON resistance *1
RON
1.0
1.5
2.5
Ω
IO=0.25A, vertically total
Output ON resistance *2
RON
1.0
1.5
2.5
Ω
IO=0.5A, vertically total
Output ON resistance *3
RON
0.5
1.0
1.5
Ω
IO=1.0A, vertically total
VREF bias current
IVREF
-10
0
10
µA
VREF=VCC
Carrier frequency
FPWM
20
25
35
kHz
VREF=18V
Input frequency range
FMAX
20
-
100
kHz
FIN / RIN
*1
*2
*3
BD6230
BD6231 / BD6236
BD6232 / BD6237
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Datasheet
BD623xxx Series
2.5
3.0
2.0
2.5
Circuit Current: Icc [mA]
Circuit Current: Icc [mA]
●Typical Performance Curves (Reference data)
1.5
85°C
25°C
-40°C
1.0
0.5
2.0
85°C
25°C
-40°C
1.5
1.0
6
12
18
24
30
36
6
12
Supply Voltage: Vcc [V]
24
30
36
Supply Voltage: Vcc [V]
Fig.13 Supply current (1ch)
Fig.14
Supply current (2ch)
1.0
Input Bias Current: IIH [mA] _
1.5
Internal Logic: H/L [-] _
18
1.0
-40°C
25°C
85°C
0.5
-40°C
25°C
85°C
0.0
-0.5
85°C
25°C
-40°C
0.8
0.6
0.4
0.2
0.0
0.8
1.2
1.6
2
0
Input Voltage: VIN [V]
Fig.15
12
18
24
30
36
Input Voltage: VIN [V]
Input threshold voltage
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Fig.16 Input bias current
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Datasheet
BD623xxx Series
●Typical Performance Curves (Reference data) - Continued
1.0
-40°C
25°C
85°C
Switching Duty: D [Ton/T] _
Input Bias Current: IVREF [µA]
10
5
0
-5
-10
0.8
0.6
0.4
-40°C
25°C
85°C
0.2
0.0
0
6
12
18
24
30
36
0
VREF input bias current
40
0.6
0.8
1
Fig.18 VREF - DUTY
(VCC=24V)
9
85°C
25°C
-40°C
Internal signal: Release [V] _
Oscillation Frequency: FPWM [kHz]
0.4
Input Voltage: VREF / VCC [V]
Input Voltage: VREF [V]
Fig.17
0.2
30
20
10
85°C
25°C
-40°C
6
3
0
6
12
18
24
30
36
4.5
Supply Voltage: VCC [V]
5.5
6
Supply Voltage: VCC [V]
Fig.19 VCC - Carrier frequency
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Fig.20
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Under voltage lock out
TSZ02201-0P2P0B300090-1-2
25.Dec.2012 Rev.002
Datasheet
BD623xxx Series
●Typical Performance Curves (Reference data) - Continued
1.5
36
Internal Logic: H/L [-]
Internal signal: Release [V]
48
-40°C
25°C
85°C
24
1.0
0.5
12
0.0
0
-0.5
36
40
44
48
125
150
175
Supply Voltage: VCC [V]
Junction Temperature: Tj [°C]
Fig.21 Over voltage protection
Fig.22 Thermal shutdown
1.5
1.5
85°C
25°C
-40°C
85°C
25°C
-40°C
1.0
Internal Logic: H/L [-]
Internal Logic: H/L [-]
200
0.5
1.0
0.5
0.0
0.0
-0.5
-0.5
2
2.5
3
3.5
4
1
Load Current / Iomax: Normalized
1.5
1.75
2
Load Current / Iomax: Normalized
Fig.23 Over current protection (H side)
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1.25
Fig.24
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Over current protection (L side)
TSZ02201-0P2P0B300090-1-2
25.Dec.2012 Rev.002
Datasheet
BD623xxx Series
●Typical Performance Curves (Reference data) – Continued
1.6
85°C
25°C
-40°C
Output Voltage: VCC-VOUT [V]
Output Voltage: VCC-VOUT [V]
0.8
0.6
0.4
0.2
0
85°C
25°C
-40°C
1.2
0.8
0.4
0
0
0.1
0.2
0.3
0.4
0.5
0
0.2
Output Current: IOUT [A]
0.8
1
Fig.26 Output high voltage (BD6231/36)
2
85°C
25°C
-40°C
Output Voltage:VCC-VOUT [V]
Output Voltage: VCC-VOUT [V]
0.6
Output Current: IOUT [A]
Fig.25 Output high voltage (BD6230)
2
0.4
1.5
1
0.5
0
-40°C
25°C
85°C
1.5
1
0.5
0
0
0.4
0.8
1.2
1.6
2
0
0.1
0.2
0.3
0.4
Output Current: IOUT [A]
Output Current: IOUT [A]
Fig.27 Output high voltage (BD6232/37)
Fig.28 High side body diode (BD6230)
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Datasheet
BD623xxx Series
●Typical Performance Curves (Reference data) – Continued
2
-40°C
25°C
85°C
Output Voltage:VCC-VOUT [V]
Output Voltage:VCC-VOUT [V]
2
1.5
1
0.5
0
-40°C
25°C
85°C
1.5
1
0.5
0
0
0.2
0.4
0.6
0.8
1
0
0.4
Output Current: IOUT [A]
1.6
2
Fig.30 High side body diode (BD6232/37)
1.6
85°C
25°C
-40°C
85°C
25°C
-40°C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
1.2
Output Current: IOUT [A]
Fig.29 High side body diode (BD6231/36)
0.8
0.8
0.6
0.4
0.2
0
1.2
0.8
0.4
0
0
0.1
0.2
0.3
0.4
0.5
0
Output Current: IOUT [A]
0.4
0.6
0.8
1
Output Current: IOUT [A]
Fig.31 Output low voltage (BD6230)
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Fig.32 Output low voltage (BD6231/36)
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TSZ02201-0P2P0B300090-1-2
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Datasheet
BD623xxx Series
●Typical Performance Curves (Reference data) - Continued
2
85°C
25°C
-40°C
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
2
1.5
1
0.5
-40°C
25°C
85°C
1.5
1
0.5
0
0
0
0.4
0.8
1.2
1.6
2
0
0.1
0.2
0.3
Output Current: IOUT [A]
Output Current: IOUT [A]
Fig.33 Output low voltage (BD6232/37)
Fig.34 Low side body diode (BD6230)
2
2
Output Voltage: VOUT [V]
1.5
1
0.5
0
0.5
-40°C
25°C
85°C
-40°C
25°C
85°C
Output Voltage: VOUT [V]
0.4
1.5
1
0.5
0
0
0.2
0.4
0.6
0.8
1
0
Output Current: IOUT [A]
0.8
1.2
1.6
2
Output Current: IOUT [A]
Fig.35 Low side body diode (BD6231/36)
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Fig.36 Low side body diode (BD6232/37)
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Datasheet
BD623xxx Series
●Functional Descriptions
1)
Operation modes
Table 7 Logic table
FIN
RIN
VREF
OUT1
OUT2
Operation
a
L
L
X
Hi-Z*
Hi-Z*
b
H
L
VCC
H
L
Forward (OUT1 > OUT2)
c
L
H
VCC
L
H
Reverse (OUT1 < OUT2)
d
H
H
X
L
L
Brake (stop)
e
PWM
f
L
L
g
PWM
H
h
PWM
PWM
i
H
H
j
VCC
VCC
H
PWM
Option
PWM
Forward (PWM control mode A)
H
Reverse (PWM control mode A)
L
Forward (PWM control mode B)
__________
PWM
__________
L
Option
H
__________
__________
VCC
L
L
VCC
Stand-by (idling)
Reverse (PWM control mode B)
PWM
__________
H
__________
PWM
PWM
Forward (VREF control)
H
Reverse (VREF control)
* Hi-Z : all output transistors are off. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.
X : Don’t care
a) Stand-by mode
Stand-by operates independently with the VREF pin voltage. In stand-by mode, all internal circuits are turned off,
including the output power transistors. Motor output goes to high impedance. When the system is switched to
stand-by mode while the motor is running, the system enters an idling state because of the body diodes. However,
when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the
high state for at least 50µs before shutting down all circuits.
b) Forward mode
This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. To operate
in this mode, connect the VREF pin to the VCC pin.
c) Reverse mode
This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high.
When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. To operate
in this mode, connect the VREF pin to the VCC pin.
d) Brake mode
This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because
the internal control circuit is operating in the brake mode. Please switch to stand-by mode (rather than the brake
mode) to save power and reduce consumption.
OFF
OFF
ON
M
OFF
OFF OFF
M
OFF OFF
a) Stand-by mode
ON
OFF
M
ON
b) Forward mode
ON
c) Reverse mode
OFF
M
OFF
ON
ON
d) Brake mode
Fig.37 Four basic operations (output stage)
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Datasheet
BD623xxx Series
e) f) PWM control mode A
The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the
RIN pin. In this mode, the high side output is fixed and the low side output is switching, corresponding to the input
signal. The state of the output toggles between "L" and "Hi-Z".
The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for
PWM frequencies below 20kHz and above 100kHz. Note that control may not be attained by switching on duty at
frequencies lower than 20kHz, since the operation functions via the stand-by mode. To operate in this mode,
connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor,
by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground.
ON
OFF
ON
M
OFF
OFF
M
ON
OFF
Control input : H
OFF
Control input : L
Fig.38 PWM control mode A operation (output stage)
FIN
RIN
OUT1
OUT2
Fig.39 PWM control mode A operation (timing chart)
g) h) PWM control mode B
The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the
RIN pin. In this mode, the low side output is fixed and the high side output is switching, corresponding to the input
signal. The state of the output toggles between "L" and "H".
The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for
PWM frequencies below 20kHz and above 100kHz. To operate in this mode, connect the VREF pin to the VCC pin.
In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF
or higher is recommended) between VCC and ground.
ON
OFF
ON
M
OFF
OFF
M
ON
OFF
Control input : H
OFF
Control input : L
Fig.40 PWM control mode B operation (output stage)
FIN
RIN
OUT1
OUT2
Fig.41 PWM control mode B operation (timing chart)
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i) j) VREF control mode
The built-in VREF duty cycle conversion circuit provides a duty cycle corresponding to the voltage of the VREF pin
and the VCC voltage. The function offers the same level of control as the high voltage output setting function in
previous models. The duty cycle is calculated by the following equation.
DUTY ≈ VREF [V] / VCC [V]
For example, if VCC voltage is 24V and VREF pin voltage is 18V, the duty cycle is about 75 percent. However,
please note that the duty cycle might be limited by the range of the VREF pin voltage (Refer to the operating
conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching
operation is the same as the PWM control modes. When operating in this mode, do not input a PWM signal to the
FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a
bypass capacitor (10µF or more is recommended) between VCC and ground.
VCC
VREF
0
FIN
RIN
OUT1
OUT2
Fig.42 VREF control operation (timing chart)
2)
Cross-conduction protection circuit
In the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low
or low to high transition, an inrush current flows from the power supply to ground, resulting to a loss. This circuit
eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition.
3)
Output protection circuits
a) Under voltage lock out (UVLO) circuit
To ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage
malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.0V (nominal) or
below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above,
the UVLO circuit ends the lockout operation and returns the chip to normal operation.
b) Over voltage protection (OVP) circuit
When the power supply voltage exceeds 45V (nominal), the controller forces all driver outputs to high impedance.
The OVP circuit is released and its operation ends when the voltage drops back to 40V (nominal) or below. This
protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is
asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this
circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.
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c) Thermal shutdown (TSD) circuit
The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175℃
nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided
in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset
temperature (150℃ nominal). Thus, it is a self-resetting circuit.
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is
activated, and do not operate the IC in an environment where activation of the circuit is assumed.
d) Over current protection (OCP) circuit
To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors
the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over
current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns
to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit
works independently for each channel.
Threshold
Iout
0
CTRL Input
ON
Internal status
OFF
mon.
ON
off timer
Monitor / Timer
Fig.43
Over current protection (timing chart)
●I/O equivalent circuit
VCC
FIN
RIN
VCC
VCC
OUT1
OUT2
OUT1
OUT2
GND
RNF
GND
VCC
100k
10k
VREF
100k
Fig.44 FIN / RIN
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Fig.45 VREF
Fig.46 OUT1 / OUT2
Fig.47 OUT1 / OUT2
(SOP8/HRP7)
(HSOP25/HSOPM28)
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25.Dec.2012 Rev.002
Datasheet
BD623xxx Series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse
polarity when connecting the power supply, such as mounting an external diode between the power
supply and the IC’s power supply terminals.
3) Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
4) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
5) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax-Ta)/θja
: Pc (W)=(Vcc-Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a
wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles
caught between the pins.
7)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8) Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
9) Capacitor between output and GND
If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor can flow into
the output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a
capacitor smaller than 10uF between output and GND.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
11) Switching noise
When the operation mode is in PWM control or VREF control, PWM switching noise may affect the control input pins
and cause IC malfunctions. In this case, insert a pull down resistor (10kΩ is recommended) between each control input
pin and ground.
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Datasheet
BD623xxx Series
12) Regarding the input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
Pin A
N
P+
N
P+
P
N
E
Parasitic
element
N
P+
Parasitic element
B
P+
P
C
N
E
P substrate
GND
N
P substrate
GND
Parasitic element
GND
Parasitic
GND element
Other adjacent elements
Fig. 48 Example of monolithic IC structure
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Datasheet
BD623xxx Series
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
7
5
6
+6°
4° −4°
6.2±0.3
4.4±0.2
0.3MIN
8
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
HSOP25
<Tape and Reel information>
13.6 ± 0.2
(MAX 13.95 include BURR)
2.75 ± 0.1
2000pcs
Direction
of feed
0.3Min.
1
13
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.25 ± 0.1
1.95 ± 0.1
1.9 ± 0.1
Embossed carrier tape
Quantity
14
5.4 ± 0.2
7.8 ± 0.3
25
Tape
0.11
S
0.1 S
0.8
0.36 ± 0.1
12.0 ± 0.2
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
HSOP-M28
<Tape and Reel information>
18.5 ± 0.2
(MAX 18.85 include BURR)
+6°
4°−4°
1.25
1500pcs
1.2±0.15
0.5±0.2
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
14
1
5.15 ± 0.1
+0.1
0.27 −0.05
S
0.11
2.2±0.1
Embossed carrier tape
Quantity
15
7.5±0.2
9.9±0.3
28
Tape
0.8
0.37 ± 0.1
0.1 S
1pin
Reel
(Unit : mm)
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0P2P0B300090-1-2
25.Dec.2012 Rev.002
Datasheet
BD623xxx Series
●Physical Dimensions Tape and Reel Information- Continued
HRP7
<Tape and Reel information>
1.905±0.1
0.8875
1 2
3 4
0.835±0.2
8.0±0.13
(7.49)
8.82±0.1
(6.5)
5 6 7
1.523±0.15
10.54±0.13
1.017±0.2
9.395±0.125
(MAX 9.745 include BURR)
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
+5.5°
4.5° −4.5°
0.08±0.05
+0.1
0.27 -0.05
0.73±0.1
1.27
S
Direction of feed
0.08 S
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Reel
(Unit : mm)
20/22
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0P2P0B300090-1-2
25.Dec.2012 Rev.002
Datasheet
BD623xxx Series
●Marking Diagrams
SOP8(TOP VIEW)
HSOP25 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
HSOP-M28 (TOP VIEW)
HRP7 (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Part Number
Package
Part Number Marking
BD6230F
SOP8
6230
BD6231HFP
HRP7
BD6231HFP
BD6231F
SOP8
6231
BD6232HFP
HRP7
BD6232HFP
BD6232FP
HSOP25
BD6232FP
BD6236FP
HSOP25
BD6236FP
BD6236FM
HSOP-M28
BD6236FM
BD6237FM
HSOP/M28
BD6237FM
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Datasheet
BD623xxx Series
●Revision History
Date
Revision
10.Apr.2012
001
25.Dec.2012
002
Changes
New Release
Improved the statement in all pages.
Deleted “Status of this document” in page 18.
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
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