Datasheet Motor Drivers for Digital Still Cameras 5-Channel System Lens Driver for Digital Still Cameras BD6758MWV BD6758KN General Description Key Specifications The BD6758MWV and BD6758KN are motor drivers that integrate 4 Full-ON type H-Bridges and 1 Linear Constant-Current type H-Bridge. These devices are intended to drive a stepping motor for auto focus system, and to drive DC motors for zoom and iris. Features Low ON-Resistance Power CMOS Output Drive Mode Switch Function High-Precision(±3%) Linear Constant-Current Driver Phase Compensation Capacitor-Free Design for Linear Constant-Current Drive Block High-Precision (1.2V±3%) Reference Voltage Under Voltage Locked Out Protection & Thermal Shut Down Circuit Power Supply Voltage Range: 2.5V to 5.5V Motor Power Supply Voltage Range: 2.5V to 5.5V Circuit Current(No Signal & No Load): 1.4mA(Typ) Stand-By Current: 10μA(Max) Control Input Voltage Range: 0V to VCCV H-Bridge Output Current: -0.5A/ch to +0.5A/ch Output ON-Resistance(Channel 1 to 4): 1.2Ω(Typ) 1.0Ω(Typ) Output ON-Resistance(Channel 5): Operating Temperature Range: -25°C to +85°C Package W(Typ) x D(Typ) x H(Max) Applications Mobile system Home appliance Amusement system, etc UQFN036V5050 5.00mm x 5.00mm x 1.00mm VQFN36 6.20mm x 6.20mm x 0.95mm ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Typical Application Circuit Bypass filter Capacitor for power supply input. 1µF to 100µF Power-saving H : Active L : Standby VCC Bypass filter Capacitor for power supply input. 4 PS 35 Power Save TSD & UVLO BandGap Motor control input 1µF to 100µF 31 VM1 H bridge IN1A 36 IN1B Drive mode selection L : EN/IN H : IN/IN 1 IN2A 2 IN2B 3 Level Shift Logic12 L 30 OUT1A OUT1B M & o g i c 1 2 SEL1 28 Full ON 29 Pre Driver H bridge Full ON 33 34 32 OUT2A Bypass filter Capacitor for power supply input. OUT2B PGND1 1µF to 100µF Motor control input 14 VM2 12 Drive mode selection L : EN/IN H : IN/IN IN3A 6 IN3B 7 IN4A 8 IN4B 9 H bridge Level Shift Logic34 Full ON 13 OUT3B M & Pre Driver H bridge Full ON 16 17 SEL2 18 Motor control input brake function H : Brake OUT3A 15 BRK1 10 OUT4A Bypass filter Capacitor for power supply input. OUT4B PGND2 1µF to 100µF BRK2 11 24 VM3 EN1 27 Level Shift Logic5 IN5 26 H bridge & Const. Current Pre Driver 21 25 OUT5A OUT5B RNF 23 Motor control input VREF 22 20 19 VREF R1 . www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 VLIM When using the VREF voltage (1.2V) resistance division value as VLIM input value, select R1 and R2 values such that, 2kΩ ≤ R1+R2 ≤ 20kΩ 2/16 0.1Ω to 5.0Ω SENSE R2 GND The output current is converted to a voltage with the RNF external resistor and transmitted to the SENSE pin. IOUT [A] = VLIM[V]÷RRNF[Ω] TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Pin Configurations （TOP VIEW） VLIM VREF OUT5A SENSE RNF VM3 OUT5B IN5 EN1 27 SEL2 SEL1 OUT1A OUT4B OUT1B OUT4A VM1 PGND2 BD6758MWV BD6758KN PGND1 OUT2A VM2 OUT3B OUT3A OUT2B IN4B IN4A IN3B VCC IN3A BRK1 GND IN1A IN2B BRK2 IN2A PS IN1B 36 18 9 Pin Descriptions Pin No. Pin Name 1 IN1B 2 Function Pin No. Pin Name Control logic input 1B 19 VLIM Output current setting ch.5 IN2A Control logic input 2A 20 VREF Reference voltage output 3 IN2B Control logic input 2B 21 OUT5A H-bridge output 5A 4 VCC Power supply 22 SENSE Output current detection ch.5 5 GND Ground 23 RNF Current detect resistor ch.5 6 IN3A Control logic input 3A 24 VM3 Motor power supply ch.5 7 IN3B Control logic input 3B 25 OUT5B 8 IN4A Control logic input 4A 26 IN5 Control logic input ch.5 9 IN4B Control logic input 4B 27 EN1 Control logic input ch.5 10 BRK1 Control logic input ch.3 28 SEL1 Drive mode select ch.1 & ch.2 11 BRK2 Control logic input ch.4 29 OUT1A H-bridge output 1A 12 OUT3A H-bridge output 3A 30 OUT1B H-bridge output 1B 13 OUT3B H-bridge output 3B 31 VM1 14 VM2 Motor power supply ch.3 & ch.4 32 PGND1 Motor ground ch.1 & ch.2 15 PGND2 Motor ground ch.3 & ch.4 33 OUT2A H-bridge output 2A 16 OUT4A H-bridge output 4A 34 OUT2B H-bridge output 2B 17 OUT4B H-bridge output 4B 35 PS 18 SEL2 Drive mode select ch.3 & ch.4 36 IN1A . www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/16 Function H-bridge output 5B Motor power supply ch.1 & ch.2 Power saving Control logic input 1A TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Block Diagram VCC 4 PS 35 Power Save TSD & UVLO BandGap 31 VM1 H-bridge IN1A 36 IN1B 1 Level Shift Logic12 IN2A 2 L & o g i c 1 2 IN2B 3 SEL1 28 Full ON 29 OUT1A 30 OUT1B 33 OUT2A Pre Driver H-bridge Full ON 34 OUT2B 32 PGND1 14 VM2 H-bridge IN3A 6 IN3B 7 Level Shift Logic34 IN4A 8 Full ON & 12 OUT3A 13 OUT3B 16 OUT4A Pre Driver H-bridge IN4B 9 Full ON 17 OUT4B SEL2 18 15 PGND2 BRK1 10 BRK2 11 EN1 27 IN5 26 24 VM3 Level Shift Logic5 H-bridge & Const. Current Pre Driver 21 OUT5A 25 OUT5B 23 RNF 22 SENSE VREF 20 19 5 VREF VLIM GND Description of Blocks 1. Power-Saving Function A power-saving function is included, which allows the system to save power when not driving the motor. The voltage level on this pin should be set high so as to keep the operation mode. (See the Electrical Characteristics; p.6/16) 2. Motor Control Input (a) IN1A to IN5B, EN1, and IN5 Pins Logic level controls the output logic of H-Bridge. (See the Electrical Characteristics; p.6/16, and I/O Truth Table; p.8/16) (b) SEL1 & SEL2 Pins Logic level sets the IN/IN or EN/IN drive mode. (See the Electrical Characteristics; p.6/16 and I/O Truth Table; p.8/16) (c) BRK1 & BRK2 Pins In case of EN/IN mode, logic high puts the device in short brake mode. (See the Electrical Characteristics; p.6/16, and I/O Truth Table; p.8/16) 3. H-Bridge Each H-bridge can be controlled independently. It is therefore possible to drive the H-bridges simultaneously, as long as the package thermal tolerances are not exceeded. Because the respective output transistors consist of power CMOS which consumes a motor power supply VM, the ON-Resistance value of high and low-side total is dependent on VM voltage. Further, the whole application must be designed so that the maximum current of each channel may be 500mA or below. (See the Recommended Operating Conditions; p.6/16) . www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Description of Blocks – continued 4. Drive System of Linear Constant-Current H-bridge (Channel 5) (a) Reference Output Voltage (with a tolerance of ±3%) The VREF pin can output 1.2V based on the internal reference voltage. The output current of the Constant-Current Drive block can be controlled by connecting external resistor to the VREF pin and setting the voltage which is divided by the resistor to the output current setting pin (VLIM pin). It is recommended to place the external 2kΩ or above resistor in consideration of the load current capacity of the VREF pin, and to place the 20kΩ or below resistor in order to minimize the fluctuation caused by the base current of the internal transistor. (b) Output Current Detection and Current Settings A low-value (0.1Ω to 5.0Ω) resistor can be placed between the RNF pin and ground to detect the motor winding current. When making the RNF and SENSE pins short-circuit, the internal circuits can output the accurate constant current by comparing the VLIM voltage with detecting voltage. To make more accurate motor winding current, trim the external RNF resistor, and supply VLIM pin with another precise external voltage. In case of this condition, VREF pin should be kept open. Output Current Value IOUT[A] = VLIM[V] / RNF[Ω] The motor winding current will be equal to 400mA3%, if 0.2V is set to the VLIM pin and a 0.5Ω external resistor is connected to the RNF pin. If the VLIM pin is shorted to the VCC pin (or the same voltage as the VCC is set) and the SENSE and RNF pins are shorted to the ground, this channel can drive as a Full-ON type H-bridge like other channels. . www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Absolute Maximum Ratings (Ta=25°C) Limit Parameter Symbol Unit BD6758MWV BD6758KN Power Supply Voltage VCC 0 to +7.0 0 to +7.0 V Motor Power Supply Voltage VM 0 to +7.0 0 to +7.0 V Control Input Voltage VIN 0 to +VCC 0 to +VCC V Power Dissipation Pd 0.88 (Note 1) 0.87 (Note 2) W -0.8 to +0.8 (Note 3) H-bridge Output Current IOUT Storage Temperature Range Tstg -55 to +150 -55 to +150 °C Tjmax 150 150 °C Junction Temperature -0.8 to +0.8 (Note 3) A/ch (Note 1) Reduced by 7.04mW/°C over 25°C, when mounted on a glass epoxy board (74.2mm x 74.2mm x 1.6mm) (Note 2) Reduced by 6.96mW/°C over 25°C, when mounted on a glass epoxy board (70mm x 70mm x 1.6mm) (Note 3) Must not exceed Pd, ASO, or Tjmax of 150°C Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter BD6758MWV Symbol BD6758KN Unit Min Typ Max Min Typ Max Power Supply Voltage VCC 2.5 - 5.5 2.5 - 5.5 V Motor Power Supply Voltage VM 2.5 - 5.5 2.5 - 5.5 V Control Input Voltage VIN 0 - VCC 0 - VCC V - +0.5 -0.5 - +0.5 A/ch Current (Note 4) IOUT -0.5 Control Input Frequency (Note 5) fIN 0 - 100 0 - 100 kHz Operating Temperature Range Topr -25 - +85 -25 - +85 °C H-bridge Output (Note 4) Must not exceed Pd, ASO, or Tjmax of 150°C (Note 5) ON duty=50% Electrical Characteristics (Unless otherwise specified VCC=3.0V, VM=5.0V, Ta=25°C) Parameter Symbol Min Typ Max Unit Conditions ICCST - 0 10 μA VPS=0V ICC - 1.4 2.5 mA VPS=3V with no signal and no load All Circuits Stand-by Current Circuit Current Control Input (IN=PS, IN1A to IN4B, SEL1, SEL2, BRK1, BRK2, EN1, IN5) High Level Input Voltage VINH Low Level Input Voltage VINL High Level Input Current IINH 2.0 - VCC V 0 - 0.7 V 15 30 60 μA VIN=3V VIN=0V Low Level Input Current IINL -1 0 - μA Pull-down Resistor RIN 50 100 200 kΩ 1.6 - 2.4 V 1.2 1.5 Ω IOUT=±400mA, High & Low-side total Ω IOUT=±400mA, High & Low-side total IOUT=0mA to 1mA Under Voltage Locked Out (UVLO) UVLO Voltage VUVLO Full ON Type H-Bridge Driver (Channel 1 to Channel 4) Output ON-Resistance RON - Linear Constant-Current Drive Block (Channel 5) Output ON-Resistance RON - 1.0 1.25 VREF Output Voltage VREF 1.16 1.20 1.24 V Output Limit Voltage VOL 194 200 206 mV . www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/16 RRNF=0.5Ω, VVLIM=0.2V TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Typical Performance Curves (Reference Data) 5.0 5.0 Output On Resistance : R ON [Ω] Top 85°C Mid 25°C Low -25°C Circuit Current : ICC [mA] 4.0 Operating range (2.5V to 5.5V) 3.0 2.0 1.0 0.0 4.0 Operating range (2.5V to 5.5V) 3.0 2.0 1.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Power Supply Voltage : VCC [V] 7.0 0.0 Figure 1. Circuit Current vs Supply Voltage 5.0 1.0 2.0 3.0 4.0 5.0 6.0 Motor Power Supply Voltage : VM [V] 7.0 Figure 2. Output ON-Resistance vs Motor Power Supply Voltage (Channel 1 to Channel 4, VCC=3V) 250 Top 85°C Mid 25°C Low -25°C Top 85°C Mid 25°C Low -25°C 4.0 200 Operating range (2.5V to 5.5V) RNF Voltage : VRNF [V] Output On Resistance : R ON [Ω] Top 85°C Mid 25°C Low -25°C 3.0 2.0 1.0 150 100 50 0.0 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Motor Power Supply Voltage : VM [V] 7.0 0 100 150 200 VLIM Voltage : VM [V] 250 Figure 4. RNF Voltage vs VLIM Voltage (Output Limit Voltage, RRNF=0.5Ω) Figure 3. Output ON-Resistance vs Motor Power Supply Voltage (Channel 5, VCC=3V) . www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 50 7/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Timing Chart Table 1. I/O Truth Table (Channel 1 & Channel 2) INPUT Input Mode SEL1 INxA INxB EN/IN L IN/IN H OUTPUT OUTxA OUTxB Output Mode(Note 6) H X Z Z Open L L H L CW L H L H CCW L L Z Z Open H L H L CW L H L H CCW H H L L Short Brake L: Low, H: High, X: Don’t care, Z: Hi impedance (Note 6) CW: Current flows from OUTxA to OUTxB, CCW: Current flows from OUTxB to OUTxA (x=1, 2) Table 2. I/O Truth Table (Channel 3 & Channel 4) INPUT Input Mode SEL2 INxA INxB EN/IN IN/IN L H OUTPUT BRKx OUTxA OUTxB Output Mode(Note 7) H X X Z Z Open L L L H L CW L H L L H CCW L X H L L Short Brake L L X Z Z Open H L X H L CW L H X L H CCW H H X L L Short Brake L: Low, H: High, X: Don’t care, Z: Hi impedance (Note 7) CW: Current flows from OUTxA to OUTxB, CCW: Current flows from OUTxB to OUTxA (x=3,4) Table 3. I/O Truth Table (Channel 5) INPUT Input Mode EN1 EN/IN OUTPUT IN5 OUT5A OUT5B Output Mode(Note 8) H X Z Z Open L L H L CW L H L H CCW L: Low, H: High, X: Don’t care, Z: Hi impedance (Note 8) CW: Current flows from OUT5A to OUT5B, CCW: Current flows from OUT5B to OUT5A www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Application Example Bypass filter Capacitor for power supply input. 1µF to 100µF Power-saving H : Active L : Standby VCC Bypass filter Capacitor for power supply input. 4 PS 35 Power Save TSD & UVLO BandGap Motor control input 1µF to 100µF 31 VM1 H bridge IN1A 36 Drive mode selection L : EN/IN H : IN/IN IN1B 1 IN2A 2 IN2B 3 Level Shift Logic12 L 30 OUT1A OUT1B M & o g i c 1 2 SEL1 28 Full ON 29 Pre Driver H bridge Full ON 33 34 32 OUT2A Bypass filter Capacitor for power supply input. OUT2B PGND1 1µF to 100µF Motor control input 14 VM2 12 Drive mode selection L : EN/IN H : IN/IN IN3A 6 IN3B 7 IN4A 8 IN4B 9 H bridge Level Shift Logic34 Full ON 13 OUT3B M & Pre Driver H bridge Full ON 16 17 SEL2 18 Motor control input brake function H : Brake OUT3A 15 BRK1 10 OUT4A Bypass filter Capacitor for power supply input. OUT4B PGND2 1µF to 100µF BRK2 11 24 VM3 EN1 27 Level Shift Logic5 IN5 26 H bridge & Const. Current Pre Driver 21 25 OUT5A OUT5B RNF 23 Motor control input VREF 22 20 19 VREF 5 VLIM R1 When using the VREF voltage (1.2V) resistance division value as VLIM input value, select R1 and R2 values such that, 2kΩ ≤ R1+R2 ≤ 20kΩ 0.1Ω to 5.0Ω SENSE R2 GND The output current is converted to a voltage with the RNF external resistor and transmitted to the SENSE pin. IOUT [A] = VLIM[V]÷RRNF[Ω] Selection of Components Externally Connected When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the IC. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Power Dissipation 1.0 1.0 0.880W 0.875W 0.8 Power Dissipation : Pd [W] Power Dissipation : Pd [W] 0.8 0.6 0.458W 0.4 0.2 0.6 0.455W 0.4 0.2 85°C 0.0 0 25 50 75 100 125 Ambient Temperature : Ta [°C] 85°C 0.0 150 0 Figure 5. BD6758MWV Power Dissipation vs Ambient Temperature 25 50 75 100 125 Ambient Temperature : Ta [°C] 150 Figure 6. BD6758KN Power Dissipation vs Ambient Temperature I/O Equivalent Circuits PS, INxA, INxB, EN1, IN5, SEL1, SEL2, BRK1, BRK2 VCC VMx, OUTxA, OUTxB, PGND1, PGND2, RNF VCC 10kΩ 100kΩ www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VREF VMx VCC 10/16 VCC VCC 1kΩ OUTxA OUTxB PGND1 PGND2 RNF VLIM, SENSE 200kΩ TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal(GND) and large-current ground(PGND) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 7. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Ordering Information B D 6 7 5 8 X X X - Package MWV : UQFN036V5050 KN : VQFN36 Part Number E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams UQFN036V5050 (TOP VIEW) VQFN36 (TOP VIEW) Part Number Marking BD6758 Part Number Marking BD6758 LOT Number 1PIN MARK Part Number Marking 1PIN MARK Package Orderable Part Number BD6758 UQFN036V5050 BD6758MWV-E2 BD6758 VQFN36 BD6758KN-E2 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 LOT Number 13/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 UQFN036V5050 14/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Physical Dimension, Tape and Reel Information - continued Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN36 15/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 BD6758MWV BD6758KN Revision History Date Revision 09.Dec.2015 001 Changes New Release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/16 TSZ02201-0H3H0B601360-1-2 09.Dec.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD6758KN - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD6758KN VQFN36 2500 2500 Taping inquiry Yes