Rohm BD7931F 0.5a or less reversible motor drivers (single moter) Datasheet

Reversible Motor Drivers for Brush Motors
0.5A or Less Reversible
Motor Drivers (Single Moter)
BH6578FVM,BD7931F
No.11008EBT05
●Description
The BH6578FVM and BD7931F are reversible motor drivers with a wide output dynamic range, with power MOS used for the
output transistor. The motor drivers can set the output mode to four modes of normal rotation, reverse rotation, stop (idling),
and braking in accordance with input logic (2 inputs).
●Features
1) Wide dynamic range loading driver with MOS output, Ron = 1.0Ω (Top+Bottom)
2) With loading driver voltage setting terminal
3) Built-in thermal shutdown circuit (TSD)
4) MSOP8 package (BH6578FVM)
5) SOP8 package (BD7931F)
●Applications
Tray loading of CD/DVD, applications using DC motors
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
BH6578FVM
BD7931F
Unit
Supply Voltage
Vcc
7
15
V
Power dissipation
Pd
0.55 *
0.69**
W
Operating temperature
Topr
-35~+85
-40~85
℃
Storage temperature
Tstg
-55~+150
℃
Output current
Iout
500
mA
Tjmax
150
℃
Junction temperature
*
**
When 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
When used at Ta=25°C or higher, derated at 4.4 mW/°C.
When 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
When used at Ta=25°C or higher, derated at 5.5 mW/°C.
●Recommended operating range
Parameter
Symbol
Supply voltage
Vcc
●Truth table
BH6578FVM,BD7931F
INPUT
OUTPUT
Range
BH6578FVM
BD7931F
4.5~5.5
4.5~ 14
Unit
V
Function
INFWD
INREV
OUT+
OUT-
L
L
Hi Z
Hi Z
High Impedance
L
H
L
H
REV mode
H
L
H
L
FWD mode
H
H
L
L
Brake mode
Hiz:Hi-impedance
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1/8
2011.05 - Rev.B
Technical Note
BH6578FVM,BD7931F
●Electrical characteristics
BH6578FVM(Unless otherwise specified, Ta=25℃, Vcc=5V)
Parameter
Symbol
Limits.
Unit
Conditions
Min.
Typ.
Max.
ICC1
-
0.4
0.8
mA
No load
VOFSL
-15
0
+15
mV
Brake mode
Input threshold voltage H
VIH
2.0
-
Vcc
V
Input threshold voltage L
VIL
GND
-
0.5
V
ON resistance
RON
-
1.0
1.8
Ω
Io=500mA,Top+Bottom
Voltage gain (Loading)
GVLD
4.5
6.0
7.5
dB
*1
ΔGVLD
-2.0
0
2.0
dB
Input bias current
IINL
-
86
120
µA
FIN=5V,RIN=5V
LDCONT bias current
ILDC
-
-
300
nA
CONT=2V
Standby current
(Loading Driver)
Output offset voltage
Voltage gain difference (Loading)
* No radiation-resistant design is adopted for the present product.
*1. Let V01 denote output-to-output voltage when CONT=1V and V02 denote output-to-output voltage
when CONT=3.5V, voltage gain can be expressed by the following equation:GVLD=20log|(V02-V01)/2.5|
BD7931F(Unless otherwise specified, Ta=25℃, Vcc=8V)
Parameter
Symbol
Limits.
Min.
Typ.
Max.
Unit
Conditions
Standby current
ICC1
-
0
5
µA
Supply current 1
ICC2
-
1.1
2.2
mA
FIN=5V,RIN=0V
Supply current 2
ICC3
-
0.8
1.6
mA
FIN=RIN=5V
VOFSL
-35
0
+35
mV
Brake mode
Input threshold voltage H
VIH
2.0
-
Vcc
V
Input threshold voltage L
VIL
GND
-
0.5
V
ON resistance
RON
-
1.0
1.8
Ω
Io=500mA,Top+Bottom
Voltage gain (Loading)
GVLD
4.0
6.0
8.0
dB
*2
ΔGVLD
-2.0
0
2.0
dB
Input bias current
IINL
-
165
250
µA
FIN=5V,RIN=5V
LDCONT bias current
ILDC
-
-
300
nA
CONT=5V
(Loading Driver)
Output offset voltage
Voltage gain difference (Loading)
*
No radiation-resistant design is adopted for the present product.
*1. Let V01 denote output-to-output voltage when CONT=1V and V02 denote output-to-output voltage when CONT=3.5V, voltage gain can be expressed by
the following equation:GVLD=20log|(V02-V01)/2.5|
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2/8
2011.05 - Rev.B
Technical Note
BH6578FVM,BD7931F
●Reference data
0.4
0.3
0.2
0.1
5
85℃
25℃
-35℃
0.3
0.2
0.1
0
100
200
300
400
100
400
0
500
-0.2
-35℃
25℃
85℃
-0.3
100
200
300
400
-0.2
-35℃
25℃
85℃
-0.3
100
200
300
400
0
500
0.1
0.0
200
300
400
0.1
100
200
300
400
500
0
40℃
25℃
85℃
100
200
300
400
500
Load current[mA]
Fig.10 Output loss voltage H(BD7931F)
Vcc=8V, CONT=OPEN
FWD mode
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3
4
5
0
85℃
25℃
-40℃
-2
-0.1
-0.2
40℃
25℃
85℃
-0.3
-4
-6
-8
-10
-0.4
0
2
Fig.9 Voltage gain (BD7931F)
Vcc=8V, CONT=SWEEP
RL=20Ω+47µH
Output voltage[V
-0.2
1
Input voltage : LDCONT[V]
Fig.8 Output loss voltage L(BD7931F)
Vcc=8V, CONT=OPEN
REV mode
Loss voltage[V]
-0.1
-0.4
-40℃
25℃
85℃
Load current[mA]
0.0
-0.3
4
0
0
0.0
5
6
2
Load current[mA]
Fig.7 Output loss voltage L(BD7931F)
Vcc=8V, CONT=OPEN
FWD mode
4
8
0.2
500
3
10
85℃
25℃
-35℃
0.3
2
Fig.6 Voltage gain (BH6578FVM)
Vcc=5V, CONT=SWEEP
RL=8Ω+47µH
0.0
100
1
Input voltage : LDCONT[V]
Fig.5 Output loss voltage H(BH6578FVM)
Vcc=5V, CONT=OPEN
REV mode
0.4
0.2
0
-3
Load current[mA]
Loss voltage[V]
0.3
-2
-5
0
85℃
25℃
-35℃
5
-4
Output voltage[V
0.4
4
85℃
25℃
-35℃
-1
Load current[mA]
Fig.4 Output loss voltage H(BH6578FVM)
Vcc=5V, CONT=OPEN
FWD mode
3
0
-0.1
500
2
Fig.3 Voltage gain(BH6578FVM)
Vcc=5V, CONT=SWEEP
RL=8Ω+47µH
-0.4
0
1
Input voltage : LDCONT[V]
Output voltage[V
Loss voltage[V]
Loss voltage[V]
300
0.0
-0.4
Loss voltage[V]
200
Fig.2 Output loss voltage L(BH6578FVM)
Vcc=5V, CONT=OPEN
REV mode
0.0
-0.1
-35℃
25℃
85℃
Load current[mA]
Load current[mA]
Fig.1 Output loss voltage L(BH6578FVM)
Vcc=5V, CONT=OPEN
FWD mode
2
0
0
500
3
1
0.0
0.0
Loss voltage[V]
4
Output voltage[V
85℃
25℃
-35℃
Loss voltage[V]
Loss voltage[V]
0.4
0
100
200
300
400
500
Load current[mA]
Fig.11 Output loss voltage H(BD7931F)
Vcc=8V, CONT=OPEN
REV mode
3/8
0
1
2
3
4
5
Input voltage : LDCONT[V]
Fig.12 Voltage gain(BD7931F)
Vcc=8V, CONT=SWEEP
RL=20Ω+47µH
2011.05 - Rev.B
Technical Note
BH6578FVM,BD7931F
●Thermal derating curves
BH6578FVM
BD7931F
0.8
0.6
0.6
[W]
[W]
0.8
0.4
Pd
Pd
0.4
0.2
0
0
25
50
75 85 100
AMBIENT TEMPERATURE
125
:
150
0.2
0
175
0
25
Ta [℃]
50
75 85 100
125
AMBIENT TEMPERATURE
Pd : Power Dissipation
:
150
175
Ta [℃]
Pd : Power Dissipation
*when 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted.
●Block diagram, applied circuit diagram example
BH6578FVM, BD7931F (in common)
FWD IN
8
F
LDCONT PREGND
REV IN
7
6
5
R
PRE
GND
Control
Logic
LDCONT
+
T.S.D
POW CMOS
H-Bridge
1
2
3
POW
GND
4
M
Vcc
0.1µF
Bypass
capacitor
POWG
T.S.D: Thermal shutdown
Fig.13
●Pin descriptions
Pin No.
Pin Name
Function
Pin No.
PinName
Function
1
Vcc
Supply voltage
5
GND_S
2
OUT+
FWD output
6
LDCONT
3
OUT-
REV output
7
INREV
REV input
4
GND
Power ground
8
INFWD
FWD input
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Signal ground
Loading driver voltage setting pin
2011.05 - Rev.B
Technical Note
BH6578FVM,BD7931F
●Interfaces
BH6578FVM
BD7931F
LDCONT
LDCONT
VCC
10KΩ
10KΩ
6
6
39KΩ
49.6KΩ
Fig.14
Fig.17
OUT+/OUT-
VCC
VCC
VCC
VCC
FIN/RIN
OUT+/OUT-
INFWD/INREV
200KΩ
200KΩ
7
2
3
8
2
50KΩ
3
7
8
50KΩ
50KΩ
50KΩ
50KΩ
50KΩ
Fig.15
Fig.16
Fig.18
Fig.19
●Operations
(1) CONTROL LOGIC
Operation of each mode is carried out as follows:
+
When INFWD is “H” and INREV is “L,” the normal rotation mode is achieved and current flows from OUT to OUT .
When both INFWD and INREV are “H,” the brake mode is achieved. Operation in such event is described as follows:
the top-side transistor turns OFF to stop supplying motor drive current, the bottom-side transistor turns ON to absorb
+
reverse EMF of motor and applies brake to motor. When both INFWD and INREV are “L,” OUT and OUT potentials
become open and the motor stops.
(2) LOADING CONT
Controlling the output voltage can vary voltage applied to the motor and can control the motor speed. By the voltage
entered to the CONT terminal, the output H voltage can be controlled (gain 6dB Typ.). Even if the voltage entered is
increased more than necessary (Vcc Max), the output voltage never exceeds the power supply voltage.
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5/8
2011.05 - Rev.B
Technical Note
BH6578FVM,BD7931F
●Notes for use
(1) Absolute maximum ratings
In the event that applied voltage (VCC, VM), working temperature range (Topr), and other absolute maximum rating are
exceeded, the IC may be destroyed. Because it is unable to identify the short-circuit mode, open mode, etc., if any
special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be
taken, such as fuses, etc.
(2) Reverse connection of power supply connector
Reverse connection of power supply connector may destroy the IC. Take necessary measures to protect the IC from
reverse connection breakage such as externally inserting diodes across power supply and IC power supply terminal as
well as across power supply and motor coil.
(3) Power supply line
Because return of current regenerated by reverse EMF of a motor occurs, take necessary measures such as inserting
capacitors across the power supply and GND as a path for regenerated current, and determine the capacity value after
thoroughly confirming that there would be no problems in various characteristics such as capacitance drop at low
temperature which may occur with electrolytic capacitors.
(4) Ground potential
Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check if there is
actually any terminal which provides voltage below GND including transient phenomena.
(5) Thermal design
Consider permissible dissipation (Pd) under actual working condition and carry out thermal design with sufficient margin
provided.
(6) Terminal-to-terminal short-circuit and erroneous mounting
When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the
event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter
that enters in a clearance between outputs or output and power-GND, the IC may be destroyed.
(7) Operation in strong electromagnetic field
The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken.
(8) ASO
When IC is used, design in such a manner that the output transistor to a motor does not exceed absolute maximum
ratings and ASO.
(9) Thermal shutdown circuit (TSD) (common)
When junction temperature (Tj) becomes thermal shutdown ON temperature 175°C, the thermal shutdown circuit (TSD
circuit) is activated and driver output current is shorted. There is 25°C temperature hysteresis. The thermal shutdown
protection circuit is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and
warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit
with the activation of the circuit premised.
(10) Capacitor across output and GND
In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or
GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a
capacitor smaller than 0.1 µF between output and GND.
(11) Inspection by set substrate
In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a
fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. Furthermore, when the
set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be
sure to turn OFF power supply to remove the jig. As electrostatic measures, provide grounding in the assembly
process, and take utmost care in transportation and storage.
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6/8
2011.05 - Rev.B
Technical Note
BH6578FVM,BD7931F
(12) IC terminal input
The present IC is a monolithic IC and has P+ isolation and a P substrate between elements to separate elements.
With this P layer and N layer of each element, PN junction is formed, and various parasitic elements are formed.
For example, when resistors and transistors are connected to terminals as is the case of Fig.20, where in the case of
resistor, the potential difference satisfies the relation of ground (GND)>(terminal A), and in the case of transistor (NPN),
the potential difference satisfies the relation of ground (GND)>(terminal B), PN junction works as a diode.
Furthermore, in the case of transistor (NPN), a parasitic NPN transistor operates by the N-layer of other elements
adjacent to the parasitic diode. The parasitic element is inevitably formed because of the IC construction.
The operation of the parasitic element gives rise to mutual interference between circuits and results in malfunction, and
eventually, breakdown. Consequently, take utmost care not to use the IC to operate the parasitic element such as
applying voltage lower than GND (P substrate) to the input terminal.
In addition, when the power supply voltage is not applied to IC, do not apply voltage to the input terminal, either.
Similarly, when the power supply voltage is applied, each input terminals shall be the voltage below the power supply
voltage or within the guaranteed values of electrical properties.
Resistor
Transistor(NPN)
Terminal B
Terminal A
C
Terminal B
B
E
Terminal A
N
P+
N
P
P+
N
Parasitic
element
N
P+
B
N
P
Parasitic element
Parasitic element
N
C
E
P-sub
P-sub
GND
P+
GND
GND
Parasitic element
GND
Fig.20 Example of the basic structure of a bipolar IC
(13) GND wiring pattern
If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current
GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage
at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for
GND wiring pattern of the component externally connected, pay special attention not to cause undesirable change to it.
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7/8
2011.05 - Rev.B
Technical Note
BH6578FVM,BD7931F
●Operating part numer
B
H
6
Part No
BH
BD
5
7
8
Part No
6578
7931
F
V
M
-
Package
FVM : MSOP8
F : SOP8
T
R
Packaging and forming specification
E2: Embossed tape and reel
(SOP8)
TR: Embossed tape and reel
(MSOP8)
MSOP8
<Tape and Reel information>
4.0±0.2
2.8±0.1
8 7 6 5
0.29±0.15
+6°
4° −4°
0.6±0.2
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
0.08±0.05
0.75±0.05
0.9MAX
S
+0.05
0.22 −0.04
0.08 S
Direction of feed
0.65
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
SOP8
<Tape and Reel information>
6
5
+6°
4° −4°
4.4±0.2
0.3MIN
7
1 2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
0.1
S
0.11
6.2±0.3
8
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
8/8
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
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R1120A
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