Rohm BD9478F-XX Pwm pulse generator for lcd panel Datasheet

BD9478F
Datasheet
LED Drivers series for LCD Backlights
PWM pulse Generator for
LCD Panels
BD9478F
●General Description
●Features
■The signal that the frequency synchronizes with the
VSYNC signal is output to PWMOUT.
■The PWM pulse is generated with the DC signal of a
BD9478F is PWM pulse generator for LCD panel. This
IC compares triangle waveform which is generated
inside IC and external DC signal, and generates a
PWM pulse. This PWM pulse is provided to LED driver
and controls LED grayscale. PWM pulse frequency
can be synchronized to external signal frequency
inputted to SYNC terminal. Even if this frequency gets
out of range, it works in the setting frequency, is
protected and it always provides stable PWM pulse to
LED driver.
triangular wave and PDIM generated with the LCT
capacitor.
When the VSYNC frequency exceeds the stipulated
range, it fixes by a set frequency.
(fSYNC<fPLLtyp*0.35 -> fPLL=0.36*fPLLtyp , fSYNC>
fPLLtyp*2.75 -> fPLL=2.75*fPLLtyp)
When VSYNC is a no signal input, the self-oscillation is
operated by set frequency decided on the CT capacitance.
When the pulse signal is input to the terminal EXTPWM,
it shifts automatically to external PWM mode.
■
■
■
●Key Specification
Operating power supply voltage range: 4.5V to 5.5V
Free Run frequency:
150Hz (CT=0.01µF)
Operating Current:
2mA (typ.)
Operating temperature range:
-40
to +85
℃
℃
●Package
SOP-8:
Pin Pitch:
●
Applications
LED backlight of monitor, TV, NOTE PC, etc.
W(Typ.) D(Typ.) H(Max.)
5.00mm x 6.20mm x 1.71mm
1.27mm
●Typical Application Circuit
CVCC
VIN
PDIM
1 VCC
ort
ce
nn
oC
CEXTPWM
CPDIM
fVSYNC
CVSYNC
2 EXTPWM
3 PDIM
PWMOUT 8
PWM signal out
(to LED driver)
GND 7
LPF 6
Figure 1.
SOP-8
CLPF1 CLPF2
RLPF2
4 VSYNC
Figure 2.
CT 5
CCT
Typical Application Circuit
○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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Datasheet
BD9478F
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Power supply voltage
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Power Dissipation
*1
Ratings
Unit
VCC
7
V
Ta(opr)
-40 ~ +85
°C
Tstg
-55 ~ +150
°C
Tjmax
150
689※1
Pd
°C
mW
Decreases 5.5mW/°C at Ta=25°C or higher (When mounting a one-layer 70.0mmx70.0mmx1.6mm board)
●Operating Ratings (Ta = 25℃)
Parameter
Symbol
Power supply voltage
Range
~ 5.5
0.040 ~ 0.8
FCT ~ 30
4.5
VCC
VSYNC input frequency range
F_VSYNC
EXTPWM input PWM signal frequency range
F_EXTPWM
Unit
V
kHz
kHz
The operating conditions written above are constants of the IC unit. Be careful enough when setting the constant in the actual set.
FCT is dimming frequency that oscillates itself when VSYNC terminal is input no signal
●External Components Recommended Range
Item
VCC capacitance
PLL Burst OSC oscillation frequency setting
capacitance
Symbol
Setting Range
Unit
CVCC
0.1 ~ 10
µF
CT
0.040
~ 0.8
µF
The operating conditions written above are constants of the IC unit. Be careful enough when setting the constant in the actual set.
8
7
6
5
GND
LPF
CT
●Marking diagram and physical dimension
PWMOUT
●Pin Configuration
VCC
EXTPWM
PDIM
VSYNC
D9478
1
2
3
4
Lot No.
SOP-8
Figure 3.
Pin Configuration
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Physical Dimension
TSZ02201-0F1F0C100010-1-2
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Datasheet
BD9478F
●Electrical Characteristics (Unless otherwise specified, Ta=25°C
,
VCC=5V)
Limit
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
ICC
―
2
4
mA
Release voltage
VUVLO
3.5
3.8
4.1
V
Hysteresis voltage
VUHYS
150
300
600
mV
VCC=SWEEP DOWN
Oscillation frequency when VSYNC is
input no signal
fCTNS
142
150
158
Hz
CT=0.01µF,LPF=0V
Triangle wave maximum voltage
VCTH
2.70
3.00
3.30
V
fCT=150Hz
VCTL
CT_SYNC
_DET1
CT_SYNC
_OKH
0.40
0.50
0.60
V
fCT=150Hz
2.612
2.750
2.888
V
LPF=2.0V→3.0V
2.517
2.650
2.783
V
LPF=3.0V→2.0V
[Whole Device]
Circuit Current during Operation
PDIM=3V,CT=0.01uF
VSYNC=EXTPWM=open
[UVLO Block]
VCC=SWEEP UP
[PLL Block]
Triangle wave minimum voltage
Synchronous signal abnormal judgment
voltage, (at High frequency input)
Synchronous signal normal judgment
voltage, (at High frequency input)
Internal RT voltage at Synchronous
signal, abnormal judgment when High
frequency input
Synchronous signal abnormal judgment
voltage, (at Low frequency input)
Synchronous signal normal judgment
voltage, (at Low frequency input)
Internal RT voltage at Synchronous
signal, abnormal judgment when High
frequency input
Switch voltage to internal fixed
frequency
Internal RT voltage at switched to
internal fixed, frequency
VRTFH
CT_SYNC
_DET2
CT_SYNC
_OKL
-
2.750
-
V
LPF=3V
0.331
0.350
0.389
V
LPF=1.0V→0.1V
0.414
0.450
0.486
V
LPF=0.1V→1.0V
VRTFL
-
0.360
-
V
LPF=0.25V
VINTF
0.10
0.15
0.20
V
LPF=1.0V→0.1V
VRTFI
-
0.900
-
V
LPF=0V
Input High level
VIH
2.0
-
20
V
Input Low level
VIL
-0.3
-
0.8
V
RIPD
0.5
1.0
2.0
MΩ
Output High level
VOH
4.3
4.85
-
V
Io=-1mA
Output Low level
VOL
-
0.1
0.5
V
Io=1mA
【Input pin (EXTPWM,PDIM,VSYNC)】
Pull down resistance
【Output pin (PWMOUT)】
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Datasheet
BD9478F
●Pin Descriptions
Pin No
Pin Name
1
In/Out
Function
Rating [V]
VCC
-
Power supply
-0.3~7
2
EXTPWM
In
External PWM signal input
-0.3~20
3
PDIM
In
DC signal input for Internal PWM
-0.3~20
4
VSYNC
In
Synchronous signal input
-0.3~20
5
CT
Out
Capacitance pin for VCO
-0.3~7
6
LPF
In/Out
LPF output for PLL
-0.3~7
7
GND
-
PWMOUT
Out
8
-
Ground
-0.3~7
PWM dimming signal output
●Pin ESD Type
VCC
EXTPWM / VSYNC /PDIM
CT
VCC
CT
7V
LPF
GND
Figure 5.
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PWMOUT
Pin ESD Type
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Datasheet
BD9478F
●Block Diagram
EXTPWM
Frequency lock comparator
VCC
+
f×2.75
GND
+
Pulse
signal
VSYNC
Phase
Comparetor
f×0.35
r
o
t
c
le
e
s
Voltage
Controlled
Oscillator
+
f×0.15
CT
Loop Filter
PDIM
DC
signal
Figure 6.
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PWMOUT
+
LPF
・ ・
PWM comparator
-
r
o
t
c
e
l
e
s
Block Diagram
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Datasheet
BD9478F
●Typical Performance Curve
Figure 7.
Operating Current (ICC) [mA] vs. VCC[V]
Figure 8.
frequency fCT[Hz] vs. CT[nF]
500
400
3
frequency fCT [Hz]
Operating current ICC [mA]
4
2
300
200
1
100
0
0
4.0
4.5
5.0
5.5
6.0
0
5
10
VCC [V]
Figure 9.
15
20
CCT [nF]
Figure 10.
PWM DUTY [%] vs. PDIM[V]
PWMOUT jitter [µs] vs. fCT[Hz]
4.0
120
3.5
100
PWMOUT jitter [us]
PWM DUTY [%]
3.0
80
60
40
2.5
2.0
1.5
1.0
20
0.5
0.0
0
0
1
2
3
100
4
150
250
300
350
400
fCT [Hz]
PDIM [V]
Figure 11.
200
Figure 12.
Start up waveform (Free Run mode)
VCC
EXTPWM mode waveform
PDIM
CT
PDIM
EXTPWM
CT
f-200Hz
PWMOUT
PWMOUT
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Datasheet
BD9478F
●Pin Function
○Pin 1: VCC
Power supply pin of the IC. Input range is from 4.5V to 5.5V
Operation starts at VCC=3.8V(TYP.) or higher and shuts down at VCC=3.5V(TYP.) or lower.
○Pin 2: EXTPWM
External PWM signal input terminal.
In case of the following equation, the signal input to EXTPWM is output directly to PWMOUT.
The equation ; f(PLL) < 2 * f(EXTPWM)
f(EXTPWM) ; frequency of signal input to EXTPWM
f(PLL) ; frequency of signal that synchronizes with VSYNC signal
○Pin 3: PDIM
DC signal input terminal to generate internal PWM signal.
The PWM signal is generated with compare it with a triangular waveform in IC.
If PDIM input DC level is changed, PWM Duty can be changed.
PDIM input DC voltage range is from 0.5V to 3.0V. (PWM Duty is changed from 0% to 100%)
○Pin 4: VSYNC
Synchronous signal input terminal.
The signal that synchronizes with the frequency of the signal input to VSYNC is generated with PLL.
A triangular wave is generated based on the frequency of this synchronized signal, and the PWM
pulse is generated with compare it with the PDIM signal
○Pin 5: CT
Capacitor connection terminal that decides the oscillation frequency of VCO..
Please adjust the capacity of CT by the following equation so that the voltage of the terminal LPF
may become 0.9V when the frequency of the signal that synchronizes is input.
CT =
1.5
f PLLtyp [ Hz]
[uF ]
○Pin 6: LPF
Low pass filter connection pin.
The pulse signal output from Phase Comparator is smoothed by Low path filter, and it inputs to Voltage.
Controlled Oscillator (VCO).
○Pin 7: GND
Ground pin of this IC.
○Pin 8: PWMOUT
PWM signal output pin.
The PWM signal generated in IC is output.
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Datasheet
BD9478F
●About Dimming Function
Burst Frequency Free Run Function
Because PLL is incorporated, Free Run operation is possible for burst frequency.
PLL circuit will operate like it synchronizes with the frequency of signal input to VSYNC pin.
Then, the voltage that is in proportion to the frequency will be generated in LPF pin.
When LPF pin voltage becomes 0.35V or lower, it will judge the external burst frequency is abnormal and clumps with the
frequency of fPLLmin. Then, PLL frequency is changed to Free Run frequency. (note1)
When the burst frequency becomes normal and LPF pin becomes over 0.9V, it will return to the state that synchronizes
with the burst frequency.(note2)
In the same way, when LPF pin becomes 2.75V or more, it will clump with the frequency of fPLLmax.
When the burst frequency becomes normal and LPF2 pin becomes 2.65V or lower, it will return to the state that
synchronizes with the burst frequency.
When LPF pin becomes 0.15V or lower, it will judge the external burst frequency is not inputted and switches to the
frequency of fPLLtyp.(Free Run mode)
Figure 13.
Note1
If fVSYNC is less than fPLLmin, the input of VCO is fixed to 0.36V inside IC, and PWM frequency is fixed
to fPLLmin. However, since it is fVSYNC<fPLLmin, a LPF terminal approaches 0V.
Then, it is set to LPF<0.15V, and it shifts to Free Run mode and PWM frequency is set to fPLLtyp.
Note2
In order to shift to PLL mode, it is necessary to input bigger frequency than Free Run frequency into VSYNC.
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Datasheet
BD9478F
gea
lto
V
2
F
P
L
Figure 14.
(Free Run Operation Explanation)
For example, if you set CT=0.01uF (At this time, fPLLtyp is adjusted to 150 Hz.) and f(VSYNC)=180Hz,
the LPF pin voltage becomes 1.2V.
The built-in VCO is proportional to the LPF pin voltage.
If VSYNC is inputted to low frequency and it becomes LPF<0.35V (at this time, f<58Hz),it will clump at fPLLmin=58Hz.
However, since it is fVSYNC<fPLLmin, a LPF terminal approaches 0V.
Then, it is set to LPF<0.15V, and it shifts to Free Run mode and PWM frequency is set to fPLLtyp.
(at this time, f=150Hz).If fSYNC is larger than fPLLtyp, PWM frequency will return to the frequency that
synchronizes with f(VSYNC).
If VSYNC is inputted high frequency and it becomes LPF>2.75V (at this time, f>343Hz),it will clump at fPLLmax=343Hz.
When synchronous signal is not inputted to VSYNC terminal, LPF voltage decreases and then it becomes
LPF<0.15V (at this time, f<19Hz), it oscillates typical frequency (at this time, f=150Hz).
Note:
Please set f(VSYNC) frequency to satisfy the following equations when you start up PLL mode.
And then, please change f(VSYNC) frequency.
f(VSYNC) > fPLLtyp , fPLLtyp = 1.5/(CT[uF]) [Hz]
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Datasheet
BD9478F
●Dimming Signal Automatic Selection Function
In this IC, even if either PWM dimming signal or DC dimming signal is inputted into the DUTY pin, it is automatically
distinguished as DC or PWM in the IC.
By detecting 4 cycles of the PWM signal within the 8 cycles of the burst frequency in the IC, it will switch automatically
to PWM dimming.
Therefore, set the burst frequency in the IC as follows:
2 X (Externally inputted PWM signal (fEXTPWM))
(Burst Frequency in the IC(same fSYNC))
Also, if you do not detect 4 cycles of the PWM signal within the 8 cycles of the burst frequency after switching to PWM
dimming, it will automatically switch to DC dimming.
<
(a) When (Burst Frequency in the IC)
<
2 X (Externally inputted PWM signal)
Burst frequency in the IC
Burst FF output in the IC
Burst frequency 8 cycles
Externally inputted PWM signal
PWM signal 4 cycles
Output dimming signal
Output comparator of
triangle wave and PWM signal
PWM dimming output
Figure 15.
(b)When (Burst Frequency in the IC ) ≧
2 X (Externally inputted PWM signal)
Burst frequency in the IC
Burst FF output in the IC
Burst frequency 8 cycles
External PWM signal
PWM signal 4 cycles
Burst dimming signal
Output comparator of
triangle wave and PWM signal
Figure 16.
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Datasheet
BD9478F
●Operational Notes
1.)
Although the quality of this product has been tightly controlled, deterioration or even destruction may occur if the absolute maximum
ratings, such as for applied pressure and operational temperature range, are exceeded. Furthermore, we are unable to assume short
or open mode destruction conditions. If special modes which exceed the absolute maximum ratings are expected, physical safely
precautions such as fuses should be considered.
2.) The IC can destruct from reverse connection of the power supply connector. Precautions, such as inserting a diode between t
he external power supply and IC power terminal, should be taken as protection against reverse connection destruction.
3.) When attaching to the printed substrate, pay special attention to the direction and proper placement of the IC. If the IC is att
ached incorrectly, it may be destroyed.
Destruction can also occur when there is a short, which can be caused by foreign objects entering between outputs or an output and the
power GND.
4.) Because there is a return of current regenerated by back EMF of the external coil, the capacity value should be determined af
ter confirming that there are no problems with characteristics such as capacity loss at low temperatures with electrolysis conde
nsers, for example by placing a condenser between the power supply and GND as a route for the regenerated current.
5.) The potential of the GND pin should be at the minimum potential during all operation status
6.) Heat design should consider power dissipation (Pd) during actual use and margins should be set with plenty of room.
7.) Exercise caution when operating in strong magnet fields, as errors can occur.
8.) When using this IC, it should be configured so that the output Tr should not exceed absolute maximum ratings and ASO. Wit
h CMOS ICs and ICs which have multiple power sources, there is a chance of rush current flowing momentarily, so exercise c
aution with power supply coupling capacity, power supply and width of GND pattern wiring and its layout.
9.) This IC has a built-in Temperature Protection Circuit (TSD circuit). The temperature protection circuit (TSD circuit) is only to cut
off the IC from thermal runaway, and has not been designed to protect or guarantee the IC. Therefore, the user should not
plan to activate this circuit with continued operation in mind.
10.) If a condenser is connected to a pin with low impedance when inspecting the set substrate, stress may be placed on the IC,
so there should be a discharge after each process. Furthermore, when connecting a jig for the inspection process, the power
must first be turned OFF before connection and inspection, and turned OFF again before removal.
11.) This IC is a monolithic IC, and between each element there is a P+ isolation and P substrate for element separation.
There is a P-N junction formed between this P-layer and each element’s N-layer, which makes up various parasitic elements.
For example, when resistance and transistor are connected with a terminal as in figure 15:
When GND>(terminal A) at the resistance, or GND>(terminal B) at the transistor (NPN), the P-N junction operates as a parasitic
diode.
Also, when GND>(terminal B) at the transistor, a parasitic NPN transistor operates by the N-layer of other elements close to the
aforementioned parasitic diode.
With the IC’s configuration, the production of parasitic elements by the relationships of the electrical potentials is inevitable. The operation
of the parasitic elements can also interfere with the circuit operation, leading to malfunction and even destruction. Therefore, uses which
cause the parasitic elements to operate, such as applying voltage to the input terminal which is lower than the GND (P-substrate), should
be avoided.
○
○
Transistor (NPN)
Resistor
B
(Pin A)
P
N
N
P
P
P
N
E
C
(Pin B)
N
GND
P
P
N
N
N
P substrate
P substrate
GND
Parasitic element
GND
Parasitic element
(Pin B)
(Pin A)
B
C
E
Parasitic element
GND
Figure 17.
GND
Adjacent other elements
Parasitic
Example of Simple Structure of Monolithic IC
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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Datasheet
BD9478F
●Ordering Information
B
D
9
4
7
8
F
Part Number
-
XX
Package
F:SOP
Packaging and forming specification
XX: Please confirm the formal name
to our sales.
●Physical Dimension Tape and Reel Information
SOP8
<Tape and Reel information>
5.0±0.2
(MAX 5.35 include BURR)
+6°
4° −4°
5
1 2
3
0.9±0.15
6
0.3MIN
7
4.4±0.2
6.2±0.3
8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
(Unit : mm)
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Datasheet
Notice
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notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
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1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
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7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
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