Datasheet EARTH LEAKAGE CURRENT DETECTOR EARTH LEAKAGE CURRENT DETECTOR IC BD9584F ●General Description BD9584F integrates leakage detector and amplifier. Especially, it is suitable for high sensitivity and a highspeed operation use, and since the operating temperature range is wide, it can be used for various uses. ●Key Specifications ■ Operating supply voltage range： 8V to 20V ■ Operating temperature range： －20°C to ＋90°C ■ Supply current： 250μA(typ.) ■ Trip voltage： 6.4mV to 12.0mV ■ Output current ability(Ta=－20℃)： 250μA(min.) ●Features ■ Small temperature fluctuation and high input sensitivity ■ Wide operating temperature range ●Packages SOP8 W(Typ.) x D(Typ.) x H(Max.) 5.00mm x 6.20mm x 1.71mm ●Applications ■ Earth leakage circuit breaker ■ Earth leakage circuit relay Reference voltage output block Current source ●Typical Application Circuit Example ○Product structure：Silicon monolithic integrated circuit www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays. 1/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●Pin Configurations ●Block Diagrams SOP8 (TOP VIEW) 8 7 6 8 7 VS 5 6 OS 5 NR TRC2 VCC Reset Ctrl Ctrl 1 2 3 4 GND 1 IN 2 Latch Block VR 3 TRC1 4 ●Pin Descriptions Pin No. Symbol Function 1 GND 2 IN Input 3 VR Reference voltage 4 TRC1 Capacitor connection for negative side detection 5 TRC2 Capacitor connection for positive side detection 6 NR Capacitor connection for false signal detection 7 OS Output 8 VS Power supply Ground ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit IS 12.5 mA VS 36 V VVR/IN 25 V VTRC1/TRC2/NR/OS 8 V Power dissipation Pd 680 *2 mW Storage temperature Tstg －55 to ＋150 ℃ Supply current *1 Supply voltage Input terminal voltage TRC1/TRC2/NR/OS terminal voltage *1 *2 The power-supply voltage is limited by the internal clamping circuit. To use at temperature above Ta＝25℃ reduce 5.5mW/℃. Mounted on a glass epoxy PCB (70mm×70mm×1.6mm) ●Recommended Operating Ratings Parameter Symbol Limits Unit Supply voltage VS 8 to 20 V Operating temperature Topr －20 to ＋90 ℃ www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●Electrical Characteristics (Unless otherwise specified, VS=12V, GND=0V, Ta=25℃) Limits Symbol Temperature Range Min. Typ. Max. Supply Current(Standby) IS 25℃ - 250 340 μA Trip Voltage VT －20℃ to +90℃ 6.4 9.2 12.0 mV OS HIGH Voltage VOSH 25℃ 3 - - V OS LOW Voltage VOSL 25℃ - - 200 mV IOS=－100μF, VS=8V to 20V OS Source Current IOS 25℃ 250 - - μA VOS=0.8V IN Input Bias Current IIN 25℃ - 100 - nA VVR=VIN VVR 25℃ 2.1 2.4 2.7 V VS=8V to 20V NR Source Current INRSO 25℃ 6.9 9.9 12.9 μA VNR=2.7V, VVR=VIN NR Threshold Voltage VTHNR 25℃ 2.1 2.4 2.7 V TW3 25℃ 53.7 80.0 129.1 ms CNR=0.33μF IRC1SO 25℃ 35.9 51.3 66.7 μA VTRC1=2.0V, ΔVIN=VIN－VVR=－0.3V TRC1 Threshold Voltage VTH1 25℃ 2.1 2.4 2.7 V TW1 Pulse Width TW1 25℃ 1.48 2.20 3.53 ms CTRC=0.047μF IRC2SO 25℃ 35.9 51.3 66.7 μA VTRC2=2.0V, ΔVIN=VIN－VVR=+0.3V TRC2 Threshold Voltage VTH2 25℃ 2.1 2.4 2.7 V TW2 Pulse Width TW2 25℃ 1.48 2.20 3.53 ms VS Clamp Voltage VSM 25℃ 27.8 29.4 31.0 V Parameter VR Voltage TW3 Pulse Width TRC1 Source Current TRC2 Source Current Unit Conditions CTRC=0.047μF IOS=250μF, VS=8V to 20V CTRC=0.047μF IS=10.5mA 100Ω 100Ω www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100Ω 100Ω 100Ω ●Test circuits 3/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet 100Ω 100Ω 100Ω 100Ω 100Ω BD9584F ●Timing Chart VT＋ Input voltage between IN and VR ΔVIN(IN-VR) VT－ VTH1=VVR TRC1 terminal voltage VTRC1 TW1 VTH2=VVR TRC2 terminal voltage VTRC2 TW2 VTHNR=VVR NR terminal voltage VNR TW3 OS terminal voltage VOS ＜Negative side detection mode *3＞ ＜Positive side detection mode *4＞ VT＋ ΔVIN(IN-VR) VT－ VTH1 VTRC1 VTRC2 TW1 VNR TW1 VTHNR VOS *3 TRC2=GND www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/11 *4 TRC1=GND TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●Typical Performance Curves(reference data) 1.0 300 -20℃ 0.9 250 S U P P LY C U R R E N T [uA ] P O W E R D IS S IP A T IO N [W ] 0.8 0.7 0.6 0.5 0.4 0.3 0.2 25℃ 90℃ 200 150 100 50 0.1 0.0 0 25 50 75 90 0 100 125 0 150 5 10 Figure 1 Derating curve 25 30 Figure 2 Supply current - Supply voltage 3.0 60 25℃ 90℃ T R C 1 /2 S O U R C E C U R R E N T [u A ] 2.5 V R T E R M IN A L V O L T A G E [V ] 20 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [℃] 25℃ 2.0 15 -20℃ 1.5 1.0 0.5 50 -20℃ 90℃ 40 30 20 10 0 0.0 0 5 10 15 20 SUPPLY VOLTAGE [V] 5 10 15 20 SUPPLY VOLTAGE [V] Figure 3 VR terminal voltage - Supply voltage www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 4 TRC1/2 terminal source current - Supply voltage 5/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F 400 30 -20℃ O S S O U R C E C U R R E N T [u A ] R A T E O F V O LT A G E F LU C T U A T IO N [% ] 40 20 10 0 -10 -20 300 25℃ 90℃ 200 100 -30 0 -40 -60 -40 -20 0 20 40 60 80 100 0 120 5 AMBIENT TEMPERATURE [℃] 15 20 SUPPLY VOLTAGE [V] Figure 5 Trip voltage fluctuation rate - Ambient temperature 500 10 Figure 6 OS terminal source current - Supply voltage 400 25℃ 400 O S S IN K C U R R E N T [uA ] T R C 1/2 S IN K C U R R E N T [u A ] 90℃ -20℃ 300 200 100 0 300 90℃ 25℃ 200 -20℃ 100 0 0 5 10 15 20 0 5 10 15 SUPPLY VOLTAGE [V] SUPPLY VOLTAGE [V] Figure 7 TRC1/2 terminal source current - Supply voltage Figure 8 OS terminal sink current - Supply voltage www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/11 20 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated by this thermal resistance. Fig.9(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below θja = (Tj - Ta) / Pd ℃/W ・・・・・ (Ⅰ) Derating curve in Fig.9(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.10(a) shows a derating curve for an example of BD9584F. LSIの 消 費 力 [W] Power dissipation of 電 LSI Pd (max) θja=(Tj-Ta)/P ℃/W P2 θja2 < θja1 周囲温度 Ta [℃] Ambient temperature θ' ja2 P1 θ ja2 Tj ' (max) Tj (max) θ' ja1 Chip surfaceチップ temperature 表面温度 Tj [℃] 0 消費電力Pd[W] P [W] Power dissipation 25 50 θ ja1 75 100 Ambient temperature 周 囲 温 度 Ta [℃ ] 125 150 (b) Derating curve (a) Thermal resistance Figure 9. Thermal resistance and derating 1.0 0.9 P O W E R D IS S IP A T IO N [W ] 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 90 100 125 150 AMBIENT TEMPERATURE [℃] (a) BD9584F BD9584F Derating curve slope UNIT 5.5 mW/℃ When using the unit above Ta=25℃, subtract the value above per degree℃ Permissible dissipation is a value when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted. Figure 10. Derating curve www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●I/O equivalence circuit www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●Operational Notes 1) Absolute maximum ratings Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely charged to the terminal. However, it does not guarantee the circuit operation. 2) Power dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 3) Terminal short-circuits When the output and power supply terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 4) Ground terminal voltage All time, Ground terminal voltage should keep lowest voltage. In addition, please confirm whether there is not really a terminal becoming the voltage that is lower than GND including a transitional phenomenon. 5) Operation in a strong electromagnetic field Operation in a strong electromagnetic field may cause malfunctions. 6) Short-circuit between pins and erroneous mounting Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power supply, or the output and GND may result in IC destruction. 7) IC handing Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. 8) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned off before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●Ordering Information B D 9 5 8 4 F Part Number E2 Packaging and forming specification E2: Embossed tape and reel (SOP8) Package F: SOP8 ●Physical Dimension Tape and Reel Information SOP8 <Tape and Reel information> 5.0±0.2 (MAX 5.35 include BURR) 5 0.3MIN 6 1 2 3 0.9±0.15 7 4.4±0.2 6.2±0.3 8 +6° 4° −4° Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.42±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagrams SOP8 (TOP VIEW) 9 5 8 4 LOT Number １PIN MARK www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet BD9584F ●Revision History Date Revision 2012.10.30 001 Changes New Release www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/11 TSZ02201-0RCR1GZ00030-1-2 2012.10.30 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. 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Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. 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