BGO827; BGO827/FC0; BGO827/SC0 870 MHz optical receivers Rev. 5 — 29 September 2010 Product data sheet 1. Product profile 1.1 General description High dynamic range optical receiver amplifier modules in a standard SOT115 package where the non-jacketed fiber has either no connector or has an FC/APC or SC/APC connector. The amplifier supply voltage pin and the photodiode bias voltage pin both connect to 24 V (DC). The modules have a mono mode optical input suitable for 1290 nm to 1600 nm wavelengths, a terminal to monitor the photodiode current and an electrical output having a characteristic impedance of 75 Ω. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Excellent linearity Low noise Excellent flatness Standard CATV outline Rugged construction Gold metallization ensures excellent reliability High optical input power range 1.3 Applications CATV optical node systems operating in the 40 MHz to 870 MHz frequency range. BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions f frequency range s22 output return losses f = 40 MHz to 870 MHz optical input return losses Min Typ Max Unit 40 - 870 MHz 11 - - dB 45 - - dB d2 second order distortion f = 854.5 MHz - - −57 dB F equivalent noise input f = 40 MHz to 870 MHz - - 8.5 pA/√Hz Itot total current consumption (DC) VB = 24 V 175 - 205 mA 2. Pinning information Table 2. Pin Pinning Description Simplified outline Graphic symbol BGO827 (SOT115T) 1 monitor current 2, 3 common 4 +VB of the photodiode 5 +VB of the amplifier 7, 8 common 9 output 1 5 7 9 4 5 9 1 2, 3, 7, 8 sym098 BGO827/FC0 (SOT115X) 1 monitor current 2, 3 common 4 +VB of the photodiode 5 +VB of the amplifier 7, 8 common 9 output 1 5 7 9 4 5 9 1 2, 3, 7, 8 sym098 BGO827/SC0 (SOT115Y) 1 monitor current 2, 3 common 4 +VB of the photodiode 5 +VB of the amplifier 7, 8 common 9 output BGO827_FC0_SC0 Product data sheet 1 5 7 9 4 5 9 1 2, 3, 7, 8 sym098 All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 2 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGO827 - rectangular single-ended package; aluminium flange; 2 vertical mounting SOT115T holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads BGO827/FC0 - rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads SOT115X BGO827/SC0 - rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads SOT115Y 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit f frequency range Conditions 40 870 MHz Tstg storage temperature −40 +85 °C Tmb mounting base temperature −20 +85 °C Pin optical input power continuous - 5 mW ESD ESD sensitivity human body model; R = 1.5 kΩ; C = 100 pF 500 - V Conditions Min Typ Max Unit λ = 1300 nm 800 - - V/W 750 - - V/W 5. Characteristics Table 5. Characteristics Bandwidth 40 MHz to 870 MHz; VB = 24 V; Tmb = 30 °C; ZL = 75 Ω. Symbol Parameter S responsivity BGO827 BGO827/FC0; BGO827/SC0 ΔS responsivity difference responsivity at Tmb = 85 °C − responsivity at Tmb = 30 °C; f = 870 MHz - −50 - V/W FL flatness straight line (peak to valley) f = 40 MHz to 870 MHz - - 1 dB SL slope straight line f = 40 MHz to 870 MHz 0 - 2 dB ΔSL slope difference slope at Tmb = 85 °C − slope at Tmb = 30 °C - −0.35 - dB s22 output return losses f = 40 MHz to 870 MHz 11 - - dB 45 - - dB optical input return losses BGO827_FC0_SC0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 3 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers Table 5. Characteristics …continued Bandwidth 40 MHz to 870 MHz; VB = 24 V; Tmb = 30 °C; ZL = 75 Ω. Symbol d2 Parameter Conditions second order distortion Min Typ Max Unit fm = 446.5 MHz [1][2] - - −68 dB fm = 746.5 MHz [1][3] - - −63 dB fm = 854.5 MHz [1][4] second order distortion difference d2 at Tmb = 85 °C − d2 at Tmb = 30 °C Δd2 d2 at Tmb = −20 °C − d2 at Tmb = 30 °C [5][6] - - −57 dB - 2.5 - dB - −1.5 - dB - - −73 dB d3 third order distortion fm = 853.25 MHz Δd3 third order distortion difference d3 at Tmb = 85 °C − d3 at Tmb = 30 °C - 1 - dB d3 at Tmb = −20 °C − d3 at Tmb = 30 °C - −1 - dB f = 40 MHz to 450 MHz - - 7 pA/√Hz f = 450 MHz to 750 MHz - - 8 pA/√Hz F equivalent noise input f = 750 MHz to 870 MHz - - 8.5 pA/√Hz λ = 1310 ±20 nm 0.85 - - A/W λ = 1550 ±20 nm 0.9 - - A/W 1290 - 1600 nm BGO827 1 - - m BGO827/FC0; BGO827/SC0 746 - 861 mm Itot total current consumption (DC) 175 - 205 mA Ibias diode bias current at pin 4 (DC) - - 25 mA spectral sensitivity sλ λ optical wavelength L length of optical fiber SM type; 9/125 μm [1] Two laser test; each laser with a modulation index of 40 %; Popt = 1 mW (total) [2] fm = 446.5 MHz; fp = 97.25 MHz; fq = 349.25 MHz [3] fm = 746.5 MHz; fp = 133.25 MHz; fq = 613.25 MHz [4] fm = 854.5 MHz; fp = 133.25 MHz; fq = 721.25 MHz [5] Three laser test; each laser with a modulation index of 60 %; Popt = 1 mW (total) [6] fm = 853.25 MHz; fp = 133.25 MHz; fq = 265.25 MHz; fr = 721.25 MHz Pin 1 10 kΩ photo current 1 kΩ mlb151 Fig 1. BGO827_FC0_SC0 Product data sheet Monitor current pin All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 4 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads D N1 N2 E S2 SOT115T N Z p M M1 M2 A2 1 2 3 4 5 7 8 9 A S1 L F S W c e b w M e1 d U2 B q2 Q y M B q1 x M B y M B p U1 q 0 5 S1 10 mm U1 U2 16.7 4.95 44.75 16.1 4.55 44.25 scale optical input S2 8.2 7.8 x y Z max. 6-32 0.25 UNC 0.7 0.1 12 q1 q2 S W w DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.5 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L min. M M1 M2 N min. N1 N2 p Q max. 8.8 2.5 1.6 0.9 1000 10.7 0.0 5 0 4.15 3.85 2.4 REFERENCES IEC JEDEC JEITA 38.1 25.4 10.2 4.2 ISSUE DATE 04-02-04 10-06-18 SOT115T Fig 2. EUROPEAN PROJECTION q Package outline SOT115T BGO827_FC0_SC0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 5 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads E SOT115X N1 N2 M M1 D S2 Z p M2 A2 1 2 3 4 5 7 8 9 A S1 L F S c W e b d U2 B w M e1 Q q2 y M B q1 y M B x M B p N R U1 q 0 25 mm Scale 0 5 10 mm S scale 4.2 connector S1 S2 U1 U2 16.7 4.95 44.75 16.1 4.55 44.25 8.2 7.8 DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.5 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L min. M M1 M2 8.8 2.5 1.6 0.9 N 861 10.7 746 0.0 REFERENCES IEC JEDEC JEITA y Z max. 6-32 0.25 UNC 0.7 0.1 12 q1 q2 R min. N2 p Q max. 5 0 4.15 3.85 2.4 EUROPEAN PROJECTION w q 38.1 25.4 10.2 35 ISSUE DATE 04-02-04 10-06-18 SOT115X Fig 3. N1 x W Package outline SOT115X BGO827_FC0_SC0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 6 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads E SOT115Y N1 N2 M M1 D S2 Z p M2 A2 1 2 3 4 5 7 8 9 A S1 L F S c W e b d U2 B w M e1 Q q2 y M B q1 y M B x M B p N R U1 q 0 25 mm Scale 0 5 10 mm S scale connector S1 S2 U1 x y Z max. 8.2 6-32 0.25 7.8 UNC 0.7 0.1 12 q1 q2 R min. U2 4.2 16.7 4.95 44.75 16.1 4.55 44.25 W w DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.5 OUTLINE VERSION b c D d E max. max. max. e e1 F 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 L min. M M1 M2 8.8 2.5 1.6 0.9 N 861 10.7 746 0.0 REFERENCES IEC JEDEC JEITA N2 p Q max. 5 0 4.15 3.85 2.4 EUROPEAN PROJECTION q 38.1 25.4 10.2 35 ISSUE DATE 04-02-05 10-06-18 SOT115Y Fig 4. N1 Package outline SOT115Y BGO827_FC0_SC0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 7 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers 7. Handling information Fiberglass optical coupling: maximum tensile strength = 5 N; minimum bending radius = 35 mm. 8. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes BGO827_FC0_SC0 v.5 20100929 Product data sheet - BGO827_FC0_SC0 v.4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Package outline and simplified outline drawings have been updated to the latest version. BGO827_FC0_SC0 v.4 (9397 750 14436) 20050329 Product data sheet - BGO827_FC0_SC0 v.3 BGO827_FC0_SC0 v.3 (9397 750 13061) 20040407 Product specification - BGO827_FC0_SC0 v.2 BGO827_FC0_SC0 v.2 (9397 750 10522) 20021210 Product specification - BGO827_FC0_SC0 v.1 BGO827_FC0_SC0 v.1 (9397 750 09934) 20020627 Product specification - - BGO827_FC0_SC0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 8 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. BGO827_FC0_SC0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 9 of 11 BGO827; BGO827/FC0/SC0 NXP Semiconductors 870 MHz optical receivers Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGO827_FC0_SC0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 29 September 2010 © NXP B.V. 2010. All rights reserved. 10 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Handling information. . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 29 September 2010 Document identifier: BGO827_FC0_SC0