www.fairchildsemi.com ILC7010/7011 80mA SC70 Low Noise CMOS RF-LDO™ Regulator Features General Description • • • • • • • • The ILC7010/7011 is an 80mA, Ultra Low Noise, Low Dropout (LDO) linear regulator, designed and processed in CMOS technology. This process combines the best CMOS features of low quiescent current, small size and low dropout voltage with the best bipolar features of high ripple rejection, ultra low noise and power handling capability. The ILC7010/ 7011 offers a quiescent current of less than 100µA, a logic level enable (regulator EN) pin, a footprint that is half the size of the industry standard SOT-23, and a low dropout voltage of 25mV at 10mA. With better than 70 dB (1kHz) of ripple rejection, low noise of 40µV RMS and 1% output voltage accuracy, the ILC7010/7011 sets a new standard in linear regulators for communications and personal electronics applications. 1% output voltage accuracy Low noise Only 75µA ground current at 80mA load Ripple rejection up to 75dB at 1kHz Excellent line and load transient response Guaranteed to 80mA output current Industry standard five lead SC70 packages Fixed 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V, 3.3V and custom output voltage options Applications • • • • Cellular phones Wireless communicators PDAs / palmtops / organizers Battery powered portable electronics Block Diagram VIN Error Amplifier CN (ILC7011 only) Voltage Reference Transconductance Amplifier + VOUT – EN Thermal Shut Down GND REV. 1.0.5 3/21/02 ILC7010/7011 PRODUCT SPECIFICATION Test circuit VIN VIN VOUT CIN COUT EN GND RL (CN) CN Figure 1. Pin Configuration VIN VOUT CN EN 5 4 5 4 3 1 ILC7010 1 2 ILC7011 2 3 VOUT GND VIN EN N/C GND SC70 Pin Definition ILC7010 Pin Number Pin Name 1 EN Enable input. High level enables VOUT while Low level commands shutdown mode and discharge COUT to GND Pin Function Description 2 N/C Not connected 3 GND Ground of the IC 4 VOUT 5 VIN Voltage output. Regulated output voltage Supply voltage input Pin Definition ILC7011 2 Pin Number Pin Name Pin Function Description 1 VOUT Voltage output. Regulated output voltage 2 GND Ground of the IC 3 VIN Supply voltage input 4 EN Enable input. High level enables VOUT while Low level commands shutdown mode and discharge COUT to GND 5 CN Optional noise bypass capacitor REV. 1.0.5 3/21/02 PRODUCT SPECIFICATION ILC7010/7011 Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Parameter Min. Max. 10 V EN Input Voltage -0.3 VIN + 0.3 V Output Voltage -0.3 VIN + 0.3 V 150, Internally limited °C 150 °C Supply Voltage Junction Temperature (TJ) Storage Temperature -40 Units Lead Soldering Temperature, 10 seconds 300 °C Power Dissipation (PD) 150 mW Recommended Operating Conditions Parameter Supply Voltage VDD Peak Output Current Ambient Operating Temperature REV. 1.0.5 3/21/02 Conditions VIN to GND Min. VOUT+VDO IOUT to GND, tpw=2mS TA -40 Typ. VOUT+1 Max. VOUT+4 Units V 120 mA 85 °C 3 ILC7010/7011 PRODUCT SPECIFICATION Electrical Specifications VIN=VOUT+1V, IOUT=1mA, VEN=2V and TA = +25°C using circuit in Figure 1 with CIN=COUT=1µF, CN=0, unless otherwise specified Parameter Symbol Output Voltage VOUT Ground pin Current IGND Conditions Min. Typ. Max. Units 0.99 VOUTnom VOUTnom 1.01 VOUTnom V IOUT=10mA 70 90 µA IOUT=80mA 90 110 Line Regulation ∆VOUT/VOUT/ ∆VIN VIN: VOUT+1V to VOUT+2V 0.017 0.075 %/V Load Regulation ∆VOUT/VOUT IOUT=1 to 80mA 0.12 0.2 % Dropout Voltage1,2 VDO IOUT=10mA, VOUT>2.8V 25 30 mV IOUT=20mA, VOUT>2.8V 50 60 IOUT=80mA, VOUT>2.8V 220 250 10 40 Shutdown (OFF) current IOFF VEN=0 EN Input Voltage VEN High = ON state Low = OFF state VEN=0.6V 2 nA V 0.6 0.3 µA EN Input Current IEN VEN=2V 1 Output Noise Voltage ILC7011 eN BW=300Hz to 50kHz CIN=COUT=2.2uF, CN=10nF IOUT=10mA 40 µV RMS Ripple Rejection PSRR COUT=4.7uF, 120Hz IOUT=80mA 65 dB Dynamic Line Regulation ∆VOUT (line) ∆VIN=1V,IOUT=80mA, tr/tf=2uS 10 mV Dynamic Load Regulation ∆VOUT (load) ∆IOUT=80mA, tr<5mS 15 mV Resistance Discharge in OFF state RDISC VEN=0 1.5 kΩ Notes: 1. For 2.5V < VOUT < 2.8V refer to diagram “Dropout Voltage vs. Output Voltage.” 2. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 2% below the nominal value measured with 1V differential. 4 REV. 1.0.5 3/21/02 PRODUCT SPECIFICATION ILC7010/7011 Typical Applications Diagrams Thermal Protection VIN = VOUTnom+1V Output to GND, IOUT=0.5A/div Load Transient Response VIN = VOUT+1V, CN=0 ∆IOUT=80mA VOUT(AC) IOUT (0.1A/div) Line Transient Response ∆VIN = VOUT+1V to VOUT+2V Load=10mA, COUT=2.2µF VIN ON/OFF Transient Response Load=80mA, COUT=1µF, CN=0 VEN VOUT(AC) VOUT REV. 1.0.5 3/21/02 5 ILC7010/7011 PRODUCT SPECIFICATION ON/OFF Transient Response Load=10mA, COUT=1µF CN=10nF(ILC7011) ON/OFF Transient Response Load=10mA, COUT=1µF, CN=0 VEN VEN VOUT VOUT Ground Current (µA) Ground Current 120 110 100 90 80 70 60 50 40 30 20 10 0 80mA Load No Load 0 1 2 3 4 5 6 7 8 Input Voltage (V) Output Voltage Dropout Voltage 2.830 300 Dropout Voltage (mV) Output Voltage (V) 1mA Load 2.825 2.820 80mA Load 2.815 2.810 2.805 -40 25°C 200 85°C 150 -40°C 100 50 0 -20 0 20 40 Temperature (C) 6 250 60 80 0 20 40 60 80 100 Load Current (mA) REV. 1.0.5 3/21/02 PRODUCT SPECIFICATION ILC7010/7011 Ripple Rejection Load=10mA, COUT=4.7µF Ripple Rejection Load=80mA, COUT=4.7µF Maxium VDO (mV) Dropout Voltage vs. Output Voltage 400 350 300 250 200 150 100 50 0 80mA load 10mA load 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 VOUT (V) REV. 1.0.5 3/21/02 7 ILC7010/7011 Application Information Capacitor Selection In general ceramic capacitors are preferred due to their superior ESR performance.Those with X5R dielectric offer the best temperature coefficient. An input capacitor of 1µF or greater, connected between Input and Ground, located in close proximity to the device will improve the transient response and the noise rejection. An output capacitor of at least 1µF is required to maintain regulator loop stability. Stable operation will be achieved with a wide variety of capacitors with ESR ranging from 10mΩ to 10Ω. An optional capacitor connected between the CN pin and ground can significantly reduce noise on the output.Values ranging from 470pF to 10nF can be used, depending upon the sensitivity to output noise in the application. Care should be taken to prevent noise from external sources to enter into the CN pin, which is a very sensitive, high impedance pin. Leakage currents into this pin will directly affect the regulator accuracy and should be kept as low as possible. Control Functions Enable Pin Applying a voltage of 0.6V or less at the Enable pin will disable the output, reducing the quiescent output current to less than 1µA, while a voltage of 2V or greater will enable the device. If this shutdown function is not needed,the pin can simply be connected to the VIN pin. Allowing this pin to float will cause erratic operation. Thermal Protection The ILC7010/7011 is designed to supply high peak output currents for brief periods, however this output load will cause the device temperature to increase and exceed maximum ratings due to power dissipation.During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 125 °C, onboard thermal protection will disable the output until the temperature drops below this limit, at which point the output is then re-enabled. During a thermal shutdown situation the user may assert the power-down function at the Enable pin, reducing power consumption to the minimum level. 8 PRODUCT SPECIFICATION Thermal Characteristics ILC7010/7011 is designed to supply up to 80mA at the specified output voltage with an operating die (junction) temperature of up to 125 °C. While the power dissipation is calculated from known electrical parameters, the thermal resistance is a result of the thermal characteristics of the compact SC70 surface-mount package and the surrounding PC Board copper to which it is mounted. The relationship describing the thermal behavior of the package is: T J ( max ) – T A P D ( max ) = -------------------------------Θ JA where TJ(max) is the maximum junction temperature of the die, which is 125 °C, and TA is the ambient operating temperature. ΘJA is dependent on the surrounding PC board layout and can be empirically obtained. While the ΘJC (junction-to-case) of the SC70 package is specified at 224 °C /W, the ΘJA of the minimum PWB footprint will be at least 235 °C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PCB. Depending on the size of the copper area, the resulting ΘJA can range from approximately 180 °C /W for one square inch, to nearly 130 °C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations. Once the limiting parameters in the thermal relationship have been determined, the electrical design should be verified to ensure that the device remains within specified operating conditions. If overload conditions are not considered, it is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down repeatedly due to an unmanaged fault condition. REV. 1.0.5 3/21/02 PRODUCT SPECIFICATION General PCB Layout Considerations To achieve the full performance of the device, careful circuit layout and grounding technique must be observed. Establishing a small local ground, to which the GND pin, the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. ILC7010/7011 The proximity of the output capacitor is especially important to achieve optimal noise compensation from the onboard error amplifier, especially during high load conditions. A large copper area in the local ground will provide the heat sinking discussed above when high power dissipation significantly increases the temperature of the device. Component-side copper provides significantly better thermal performance for this surface-mount device, compared to that obtained when using only copper planes on the underside. In general, the high frequency compensation components (input, bypass, and output capacitors)should be located as close to the device as possible. REV. 1.0.5 3/21/02 9 ILC7010/7011 PRODUCT SPECIFICATION Mechanical Dimensions 5 Lead SC70 0.65 -A- 2.00±0.20 0.65 5 .5 min 4 1.9 -B- 1.25±0.10 1 0.25 2 2.10±0.10 3 0.4 min +0.10 0.20 -0.05 LAND PATTERN RECOMMENDATION max 0.1 M SEE DETAIL A 0.9±.10 0.25 0.10 0.95±.15 0.10 0.00 6.00° max 0.1 R0.14 GAGE PLANE R0.10 0°-30° 0.20 6.00° 0.45 0.10 0.425 NOMINAL DETAIL A NOTES: A. CONFORMS TO EIAJ REGISTERED OUTLINE DRAWING SC88A. B. DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. C. DIMENSIONS ARE IN MILLIMETERS. 10 REV. 1.0.5 3/21/02 ILC7010/7011 PRODUCT SPECIFICATION Ordering Information Output Voltage Part Number Temperature Range Package 2.5 ILC7010AIC525X -40 to 85 °C SC70 2.6 ILC7010AIC526X -40 to 85 °C SC70 2.7 ILC7010AIC527X -40 to 85 °C SC70 2.8 ILC7010AIC528X -40 to 85 °C SC70 2.85 ILC7010AIC5285X -40 to 85 °C SC70 2.9 ILC7010AIC529X -40 to 85 °C SC70 3.0 ILC7010AIC530X -40 to 85 °C SC70 3.1 ILC7010AIC531X -40 to 85 °C SC70 3.3 ILC7010AIC533X -40 to 85 °C SC70 Output Voltage Part Number Temperature Range Package 2.5 ILC7011AIC525X -40 to 85 °C SC70 2.6 ILC7011AIC526X -40 to 85 °C SC70 2.7 ILC7011AIC527X -40 to 85 °C SC70 2.8 ILC7011AIC528X -40 to 85 °C SC70 2.85 ILC7011AIC5285X -40 to 85 °C SC70 2.9 ILC7011AIC529X -40 to 85 °C SC70 3.0 ILC7011AIC530X -40 to 85 °C SC70 3.1 ILC7011AIC531X -40 to 85 °C SC70 3.3 ILC7011AIC533X -40 to 85 °C SC70 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 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A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 3/21/02 0.0m 002 Stock#DS30007010 2002 Fairchild Semiconductor Corporation