VISHAY BAS20

BAS19–BAS21
Vishay Telefunken
Surface Mount Switching Diode
Features
D Silicon planar epitaxial high speed diode
D For switching and general purpose applications
94 8550
Absolute Maximum Ratings
Tj = 25_C
Parameter
Working
g peak reverse voltage
g
=DC Blocking voltage
Test Conditions
Repetitive peak reverse voltage
g
Peak forward surge
g current
Repetitive peak forward current
Average forward current
Forward current
Power dissipation
t=1ms
t=1s
tp<0.3ms
TCase=TL (8mm from Case)
=Tamb
TCase=TL (8mm from Case)
=Tamb
Junction and storage
temperature range
Type
BAS19
BAS20
BAS21
BAS19
BAS20
BAS21
Symbol
VRWM
=VR
VRRM
VRRM
VRRM
IFSM
IFSM
IFRM
IFAV
IF
Value
100
150
200
120
200
250
2.5
0.5
625
200
400
Unit
V
V
V
V
V
V
A
A
mA
mA
mA
Ptot
250
mW
Tj=Tstg
–55...+150
°C
Maximum Thermal Resistance
Tj = 25_C
Parameter
Junction ambient
Document Number 85540
Rev. 1, 01-Apr-99
Test Conditions
Symbol
RthJA
Value
500
Unit
K/W
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BAS19–BAS21
Vishay Telefunken
Electrical Characteristics
Tj = 25_C
Parameter
Forward voltage
g
Test Conditions
IF=100mA
IF=200mA
Reverse current
VR=VRmax
VR=VRmax, Tj= 150°C
Reverse breakdown voltage
g
IR=100mA, tp<0.3ms
IR=100mA
IR=100mA, VR<275V
Reverse recovery time
IF=IR=10mA, RL=100W,
VR=6V to IR=1mA. RL=100W
Diode capacitance
VR=0, f= 1MHz
Dynamic forward resistance IF=10mA
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Type
BAS19
BAS20
BAS21
Symbol
VF
VF
IR
IR
V(BR)R
V(BR)R
V(BR)R
trr
CD
rf
Min
120
200
250
Typ Max Unit
1.0
V
1.25
V
100 nA
100 mA
V
V
V
50
ns
5
5
pF
W
Document Number 85540
Rev. 1, 01-Apr-99
BAS19–BAS21
Vishay Telefunken
Dimensions in mm
top view
14370
Case: SOT–23, plastic
Terminals: Solderable per MIL–STD–202, Method 208
Approx. weight: 0.008 grams
Marking: BAS19 K80,
BAS20 K81,
BAS21 K82
Document Number 85540
Rev. 1, 01-Apr-99
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BAS19–BAS21
Vishay Telefunken
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known
as ozone depleting substances ( ODSs ).
The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA ) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized
application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out
of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
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Document Number 85540
Rev. 1, 01-Apr-99