MOTOROLA MC74HC109N

SEMICONDUCTOR TECHNICAL DATA
!
High–Performance Silicon–Gate CMOS
The MC74HC109 is identical in pinout to the LS109. The device inputs are
compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
This device consists of two J–K flip–flops with individual set, reset, and
clock inputs. Changes at the inputs are reflected at the outputs with the next
low–to–high transition of the clock. Both Q and Q outputs are available from
each flip–flop.
1
1
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 148 FETs or 37 Equivalent Gates
ORDERING INFORMATION
MC74HCXXXN
MC74HCXXXD
CLOCK 1
J1
RESET 1
5
3
6
Plastic
SOIC
PIN ASSIGNMENT
LOGIC DIAGRAM
K1
D SUFFIX
SOIC PACKAGE
CASE 751B–05
16
•
•
•
•
•
•
SET 1
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
16
RESET 1
1
16
VCC
J1
2
15
RESET 2
K1
3
14
J2
CLOCK 1
4
13
K2
SET 1
5
12
CLOCK 2
Q1
6
11
SET 2
Q1
7
10
Q2
GND
8
9
Q2
Q1
4
2
7
Q1
1
FUNCTION TABLE
Inputs
SET 2
K2
CLOCK 2
J2
RESET 2
Set
11
13
10
L
H
L
H
H
H
H
H
Q2
12
14
9
Q2
15
H
L
L
H
H
H
H
H
X
X
X
L
Outputs
J
K
X
X
X
L
H
L
H
X
X
X
X
L
L
H
H
X
Q
Q
H
L
L
H
H*
H*
L
H
Toggle
No Change
H
L
No Change
* Both outputs will remain high as long as Set and
Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously.
PIN 16 = VCC
PIN 8 = GND
10/95
 Motorola, Inc. 1995
Reset Clock
1
REV 6
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MC74HC109
MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
V
Vin
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air
750
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
Plastic DIP†
SOIC Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
_C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
260
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25_C
85_C
125_C
Unit
VIH
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
Minimum High–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
4.5
6.0
3.98
5.48
3.84
5.34
3.70
5.20
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
VOH
Vin = VIH or VIL |Iout|
|Iout|
VOL
Maximum Low–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
Vin = VIH or VIL |Iout|
|Iout|
Iin
ICC
4.0 mA
5.2 mA
4.0 mA
5.2 mA
V
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 µA
6.0
4
40
80
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
2
High–Speed CMOS Logic Data
DL129 — Rev 6
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MC74HC109
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
VCC
V
– 55 to
25_C
85_C
125_C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
4.5
6.0
6.0
30
35
4.8
24
28
4.0
20
24
MHz
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q or Q
(Figures 1 and 4)
2.0
4.5
6.0
175
35
30
220
44
37
265
53
45
ns
tPLH,
tPHL
Maximum Propagation Delay, Set or Reset to Q or Q
(Figures 2 and 4)
2.0
4.5
6.0
230
46
39
290
58
49
345
69
59
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
Maximum Input Capacitance
—
10
10
10
pF
Symbol
Cin
Parameter
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Flip–Flop)*
pF
40
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* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
– 55 to
25_C
85_C
125_C
Unit
tsu
Minimum Setup Time, J or K to Clock
(Figure 3)
2.0
4.5
6.0
100
20
17
125
25
21
150
30
26
ns
th
Minimum Hold Time, Clock to J or K
(Figure 3)
2.0
4.5
6.0
5
5
5
5
5
5
5
5
5
ns
Minimum Recovery Time, Set or Reset Inactive to Clock
(Figure 2)
2.0
4.5
6.0
5
5
5
5
5
5
5
5
5
ns
tw
Minimum Pulse Width, Set or Reset
(Figure 2)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
tw
Minimum Pulse Width, Clock
(Figure 1)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
Maximum Input Rise and Fall Times
(Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
ns
trec
tr, tf
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
MC74HC109
SWITCHING WAVEFORMS
tw
tr
CLOCK
VCC
tf
SET OR
RESET
VCC
90%
50%
10%
GND
tPHL
GND
tw
Q OR Q
1/fmax
tPLH
Q or Q
50%
50%
tPHL
tPLH
90%
50%
10%
50%
Q OR Q
tTLH
trec
tTHL
CLOCK
VCC
50%
Figure 1.
GND
Figure 2.
TEST POINT
VALID
J or K
VCC
50%
OUTPUT
GND
tsu
DEVICE
UNDER
TEST
th
VCC
CL*
50%
CLOCK
GND
Figure 3.
* Includes all probe and jig capacitance
Figure 4. Test Circuit
EXPANDED LOGIC DIAGRAM
SET
5, 11
6, 10
CLOCK
J
Q
4, 12
2, 14
7, 9
Q
K
3, 13
RESET
MOTOROLA
1, 15
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HC109
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
–A
–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T
–
SEATING
PLANE
K
H
D 16 PL
0.25 (0.010)
M
M
J
G
T A
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A
–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B
–
1
P 8 PL
0.25 (0.010)
8
M
B
M
G
K
F
R X 45°
C
–T
SEATING
–
PLANE
J
M
D 16 PL
0.25 (0.010)
M
T
B
S
A
S
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.740 0.770 18.80 19.55
6.35
0.250 0.270
6.85
3.69
0.145 0.175
4.44
0.39
0.015 0.021
0.53
1.02
0.040 0.070
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.21
0.008 0.015
0.38
2.80
0.110 0.130
3.30
7.50
0.295 0.305
7.74
0°
0°
10°
10°
0.020 0.040
0.51
1.01
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80 10.00
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
6.20
5.80
0.50
0.25
INCHES
MIN
MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0°
7°
0.229 0.244
0.010 0.019
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High–Speed CMOS Logic Data
DL129 — Rev 6
◊
CODELINE
5
*MC74HC109/D*
MC74HC109/D
MOTOROLA