MAXIM MAX1963ETT

19-3040; Rev 0; 10/03
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
Features
♦ Low 1.62V Minimum Input Voltage
♦ Guaranteed 300mA Output Current
♦ ±1.5% Accuracy Over Load/Line/Temp
♦ Low 100mV Dropout at 300mA Load
♦ 2.2ms (MAX1963) or 70ms (MAX1976)
RESET Output Flag
♦ Supply Current Independent of Load and
Dropout Voltage
♦ Logic-Controlled Shutdown
♦ Thermal-Overload and Short-Circuit Protection
♦ Preset Output Voltages (0.75V to 3.0V)
♦ Tiny 6-Pin Thin SOT23 Package (<1.1mm High)
♦ Thin 6-Pin TDFN Package (<0.8mm High)
Applications
Ordering Information
Notebook Computers
PART*
TEMP RANGE
PIN-PACKAGE
Cellular and PCS Telephones
MAX1963EZT_ _ _-T
-40°C to +85°C
6 Thin SOT23-6
Personal Digital Assistants (PDAs)
MAX1963ETT_ _ _-T
-40°C to +85°C
6 TDFN
Hand-Held Computers
MAX1976EZT_ _ _-T
-40°C to +85°C
6 Thin SOT23-6
Digital Cameras
MAX1976ETT_ _ _-T
-40°C to +85°C
6 TDFN
*Insert the desired three-digit suffix (see the Selector Guide) into
the blanks to complete the part number. Contact the factory for
other output voltages.
PCMCIA Cards
CD and MP3 Players
Typical Operating Circuit
Pin Configurations
TOP VIEW
INPUT
1.62V TO 3.6V
IN 1
GND 2
6 OUT
MAX1963
MAX1976
5 I.C.
6 IN
OUT 1
I.C. 2
CIN
1µF
MAX1963
MAX1976
IN
OUT
OUTPUT
0.75V TO 3.0V
COUT LOGIC
4.7µF SUPPLY
MAX1963
MAX1976
5 SHDN
300mA
100kΩ
ON
RESET 3
4 RESET
SHDN 3
THIN SOT23
4 GND
TDFN
3mm x 3mm
RESET
SHDN
TO µC
OFF
GND
Selector Guide appears at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX1963/MAX1976
General Description
The MAX1963/MAX1976 low-dropout linear regulators
operate from a +1.62V to +3.6V supply and deliver a
guaranteed 300mA continuous load current with a low
100mV dropout. The high-accuracy (±0.5%) output
voltage is preset to an internally trimmed voltage in the
+0.75V to +3.0V range. An active-low, open-drain reset
output remains asserted for at least 2.2ms (MAX1963)
or 70ms (MAX1976) after the output voltage reaches
regulation. These devices are offered in 6-pin thin
SOT23 and 6-pin 3mm x 3mm thin DFN packages.
An internal PMOS pass transistor allows the low supply
current to remain independent of load and dropout voltage, making these devices ideal for portable battery-powered equipment such as personal digital assistants
(PDAs), cell phones, cordless phones, and notebook computers. Other features include logic-controlled shutdown,
short-circuit protection, and thermal-overload protection.
MAX1963/MAX1976
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
ABSOLUTE MAXIMUM RATINGS
IN, SHDN, RESET to GND .....................................-0.3V to +4.0V
OUT to GND ................................................-0.3V to (VIN + 0.3V)
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (TA = +70°C)
6-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW
6-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ..................................................... +150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = (VOUT + 0.5V) or 1.8V, whichever is greater; SHDN = IN, CIN = 1µF, COUT = 4.7µF, TA = -40°C to +85°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
Input Voltage
Input Undervoltage Lockout
SYMBOL
CONDITIONS
MAX
UNITS
1.62
MIN
3.60
V
VIN rising or falling
(180mV typical hysteresis)
1.30
1.60
V
IOUT = 150mA, TA = +25°C
-0.5
+0.5
IOUT = 1mA to 300mA,
VIN = (VOUT + 0.5V) to +3.6V
-1.5
+1.5
VIN
VUVLO
Output Voltage Accuracy
Maximum Output Current
IOUT
Continuous
300
Current Limit
ILIM
VOUT = 96% of nominal value
450
Ground Current
Dropout Voltage
Load Regulation
Line Regulation
IQ
650
No load
70
140
IOUT = 300mA
90
Dropout (Note 2)
70
VIN = (VOUT + 0.5V) to +3.6V, IOUT = 1mA
100
-0.15
%
mARMS
550
VIN - VOUT IOUT = 300mA, VOUT ≥ 1.8V (Note 2)
∆VLDR
IOUT = 1mA to 300mA
∆VLNR
TYP
mA
µA
200
mV
0.02
0.3
%
+0.01
+0.15
% /V
Output Noise
10Hz to 100kHz, IOUT = 10mA, VOUT = 1.5V
86
µVRMS
PSRR
f < 1kHz, IOUT = 10mA
70
dB
SHUTDOWN
Shutdown Supply Current
SHDN Input Logic Levels
SHDN Input Bias Current
Turn-On Delay
2
IOFF
SHDN = GND
VIH
VIN = 1.62V to 3.6V
VIL
VIN = 1.62V to 3.6V
ISHDN
VSHDN = 0 or 3.6V
TA = +25°C
0.001
TA = +85°C
0.01
1
1.4
0.6
TA = +25°C
1
TA = +85°C
5
From SHDN high to OUT high, VOUT = 1.8V
90
_______________________________________________________________________________________
100
µA
V
nA
µs
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
(VIN = (VOUT + 0.5V) or 1.8V, whichever is greater; SHDN = IN, CIN = 1µF, COUT = 4.7µF, TA = -40°C to +85°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
80
MAX
UNITS
%VOUT
RESET OUTPUT
Reset Threshold Accuracy
82.5
85
I RESET = 100µA
VOUT falling, (1.7% typical hysteresis)
1
100
VIN = +1.0V, I RESET = 100µA
30
400
1
RESET Output Low Voltage
VOL
RESET Output High Leakage
IOH
V RESET = 3.6V,
RESET not asserted
TA = +25°C
0.001
TA = +85°C
0.01
Reset Delay
tRP
From VOUT high to RESET
rising
MAX1963
2.2
3.2
5.5
MAX1976
70
100
160
mV
µA
ms
THERMAL PROTECTION
Thermal-Shutdown Temperature
Thermal-Shutdown Hysteresis
T SHDN
+165
°C
∆T SHDN
15
°C
Note 1: Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design.
Note 2: The dropout voltage is defined as VIN - VOUT, when VOUT is 4% lower than the value of VOUT when VIN = VOUT + 0.5V.
Typical Operating Characteristics
(VIN = (VOUT + 0.5V) or 1.8V, whichever is greater; SHDN = IN, CIN = 1µF, COUT = 4.7µF, TA = +25°C, unless otherwise noted.)
0
VOUT = +0.75V
-0.1
-0.2
VOUT = 1.5V
0.25
IOUT = 0mA
0
IOUT = 100mA
-0.25
IOUT = 300mA
50
100
150
200
LOAD CURRENT (mA)
250
300
VOUT = +1.5V
1.0
0.5
IOUT = 0mA, 100mA, 300mA
0
-0.5
-1.0
-1.5
-0.50
0
1.5
OUTPUT VOLTAGE ACCURACY (%)
VOUT = +1.5V
MAX1963/76 toc02
0.1
0.50
OUTPUT VOLTAGE ACCURACY (%)
MAX1963/76 toc01
OUTPUT VOLTAGE ACCURACY (%)
0.2
VOUT = +3.0V
OUTPUT VOLTAGE ACCURACY
vs. TEMPERATURE
OUTPUT VOLTAGE ACCURACY
vs. INPUT VOLTAGE
MAX1963/76 toc03
OUTPUT VOLTAGE ACCURACY
vs. LOAD CURRENT
1.4
1.8
2.2
2.6
3.0
INPUT VOLTAGE (V)
3.4
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
3
MAX1963/MAX1976
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(VIN = (VOUT + 0.5V) or 1.8V, whichever is greater; SHDN = IN, CIN = 1µF, COUT = 4.7µF, TA = +25°C, unless otherwise noted.)
GROUND-PIN CURRENT
vs. INPUT VOLTAGE
100
VOUT = +1.5V
90
VOUT = +0.75V
80
70
IOUT = 100mA
100
IOUT = 300mA
80
60
IOUT = 0mA
40
120
MAX1963/76 toc06
MAX1963/76 toc05
GROUND-PIN CURRENT (µA)
VOUT = +3.0V
110
120
MAX1963/76 toc04
120
GROUND-PIN CURRENT
vs. TEMPERATURE
110
IOUT = 100mA
GROUND-PIN CURRENT (µA)
GROUND-PIN CURRENT
vs. LOAD CURRENT
GROUND-PIN CURRENT (µA)
100
90
IOUT = 300mA
80
IOUT = 0mA
70
20
60
VOUT = 1.5V
0
0.01
0.1
1
10
100
1000
50
1.6
1.2
LOAD CURRENT (mA)
2.0
2.4
2.8
3.2
3.6
-40
-20
INPUT VOLTAGE (V)
DROPOUT VOLTAGE
vs. LOAD CURRENT
20
40
POWER-SUPPLY REJECTION RATIO
vs. FREQUENCY
80
MAX1963/76 toc07
120
100
80
0
TEMPERATURE (°C)
VOUT = +0.75V
70
60
60
VOUT = +3.0V
VOUT = +1.5V
50
PSRR (dB)
VOUT = +1.8V
MAX1963/76 toc08
60
VDROPOUT (mV)
MAX1963/MAX1976
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
VOUT = +3.0V
40
30
40
20
20
10
IOUT = 10mA
0
0
0
50
100
150
200
250
0.1
300
10
MAX1963/76 toc09
1000
MAX1963/76 toc10
500mV/div
500mV/div
VIN
1.8V
VOUT
1.5V
1.5V
VOUT
10mV/div
AC-COUPLED
40µs/div
4
100
LINE-TRANSIENT RESPONSE
NEAR DROPOUT
LINE-TRANSIENT RESPONSE
VIN
3.5V
1
FREQUENCY (kHz)
LOAD CURRENT (mA)
10mV/div
AC-COUPLED
40µs/div
_______________________________________________________________________________________
60
80
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
LOAD-TRANSIENT RESPONSE
NEAR DROPOUT
LOAD-TRANSIENT RESPONSE
MAX1963/76 toc11
MAX1963/76 toc12
200mA
IOUT
20mA
200mA/div
VOUT
20mV/div
AC-COUPLED
VIN = 3.6V
VOUT = 1.5V
200mA
IOUT
20mA
200mA/div
VOUT
20mV/div
AC-COUPLED
20µs/div
VIN = 1.8V
VOUT = 1.5V
20µs/div
MAX1976
SHUTDOWN/RESET RESPONSE
SHUTDOWN RESPONSE
MAX1963/76 toc13
MAX1963/76 toc14
VSHDN
VSHDN
1V/div
0
1V/div
0
VOUT
VOUT
1V/div
0
1V/div
VRESET
500mV/div
0
0
100µs/div
40ms/div
MAX1976
LINE/RESET RESPONSE
MAX1963/76 toc15
VIN
2V/div
0
VOUT
1V/div
0
VRESET
1V/div
0
200ms/div
_______________________________________________________________________________________
5
MAX1963/MAX1976
Typical Operating Characteristics (continued)
(VIN = (VOUT + 0.5V) or 1.8V, whichever is greater; SHDN = IN, CIN = 1µF, COUT = 4.7µF, TA = +25°C, unless otherwise noted.)
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
MAX1963/MAX1976
Pin Description
PIN
NAME
FUNCTION
SOT23
TDFN
1
6
IN
2
—
GND
Ground. GND also functions as a heatsink. Solder to a large pad or circuit-board ground plane to
maximize SOT23 power dissipation.
—
4
GND
Ground
3
5
SHDN
Active-Low Shutdown Input. A logic low reduces supply current to below 1µA. Connect to IN or
logic high for normal operation.
4
3
RESET
Open-Drain, Active-Low Reset Output. RESET rises 3.2ms (MAX1963) or 100ms (MAX1976) after
the output has achieved regulation. RESET falls immediately if VOUT drops below 82.5% of its
nominal voltage, or if the MAX1963/MAX1976 are shut down.
5
2
I.C.
6
1
OUT
—
Exposed
Pad
EP
Regulator Input. Supply voltage can range from +1.62V to +3.6V. Bypass IN with at least a 1µF
ceramic capacitor to GND (see the Capacitor Selection and Regulator Stability section).
Internally Connected. Leave floating or connect to GND.
Regulator Output. Sources up to 300mA. Bypass with a 4.7µF low-ESR ceramic capacitor to GND.
Ground. EP also functions as a heatsink. Solder EP to a large pad or circuit-board ground plane
to maximize TDFN power dissipation.
Detailed Description
The reference is connected to the error amplifier, which
compares this reference with the feedback voltage and
amplifies the difference. If the feedback voltage is
lower than the reference voltage, the pass-transistor
gate is pulled lower, which allows more current to pass
to the output and increases the output voltage. If the
feedback voltage is too high, the pass-transistor gate is
pulled up, allowing less current to pass to the output.
The MAX1963/MAX1976 are low-dropout, high-accuracy,
low-quiescent-current linear regulators designed primarily
for battery-powered applications. These devices supply
loads up to 300mA and are available with preset output
voltages from +0.75V to +3.0V. As illustrated in Figure 1,
the MAX1963/MAX1976 consist of a reference, an error
amplifier, a P-channel pass transistor, an internal feedback voltage-divider, and a power-good comparator.
IN
SHDN
SHUTDOWN
LOGIC
ERROR
AMP
MOS DRIVER
WITH ILIMIT
P
OUT
MAX1963
MAX1976
THERMAL
SENSOR
REF
82.5%
REF
RESET
TIMER
GND
Figure 1. Functional Diagram
6
_______________________________________________________________________________________
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
RESET Output
The MAX1963/MAX1976 microprocessor (µP) supervisory
circuitry asserts a guaranteed logic-low reset during
power-up, power-down, and brownout conditions down
to +1V. RESET asserts when VOUT is below the reset
threshold and remains asserted for at least tRP after VOUT
rises above the reset threshold of regulation.
MAXIMUM OUTPUT CURRENT
vs. INPUT VOLTAGE
(POWER DISSIPATION LIMIT)
400
MAXIMUM OUTPUT CURRENT (mA)
Shutdown
Pull SHDN low to enter shutdown. During shutdown, the
output is disconnected from the input, an internal 1.5kΩ
resistor pulls OUT to GND, RESET is actively pulled
low, and the supply current drops below 1µA.
TA = +85°C
TA = +70°C
300
MAXIMUM RECOMMENDED
OUTPUT CURRENT 6-PIN SOT23
200
100
0
0
1.0
1.5
2.0
2.5
3.0
Figure 2. Power Operating Regions for the 6-Pin SOT23:
Maximum Output Current vs. Input Voltage
MAXIMUM OUTPUT CURRENT
vs. INPUT VOLTAGE
(POWER DISSIPATION LIMIT)
400
MAXIMUM OUTPUT CURRENT (mA)
Thermal-Overload Protection
Thermal-overload protection limits total power dissipation in the MAX1963/MAX1976. When the junction temperature exceeds TJ = +165°C, a thermal sensor turns
off the pass transistor, allowing the IC to cool. The thermal sensor turns the pass transistor on again after the
junction temperature cools by 15°C, resulting in a
pulsed output during continuous thermal-overload conditions. Thermal-overload protection safeguards the
MAX1963/MAX1976 in the event of fault conditions. For
continuous operation, do not exceed the absolute maximum junction-temperature rating of TJ = +150°C.
0.5
(VIN - VOUT) (V)
Current Limit
The MAX1963/MAX1976 monitor and control the pass
transistor’s gate voltage, limiting the output current to
450mA (min). If the output exceeds ILIM, the MAX1963/
MAX1976 output voltage drops.
MAX1963/MAX1976
Internal P-Channel Pass Transistor
The MAX1963/MAX1976 feature a 0.33Ω (R DS(ON) )
P-channel MOSFET pass transistor. Unlike similar
designs using PNP pass transistors, P-channel
MOSFETs require no base drive, which reduces quiescent current. PNP-based regulators also waste considerable current in dropout when the pass transistor
saturates and use high base-drive currents under large
loads. The MAX1963/MAX1976 do not suffer from these
problems and consume only 90µA (typ) of quiescent
current under heavy loads, as well as in dropout.
MAXIMUM RECOMMENDED
OUTPUT CURRENT 6-PIN TDFN
TA = +85°C
300
200
100
0
0
0.5
1.0
1.5
2.0
2.5
3.0
(VIN - VOUT) (V)
Figure 3. Power Operating Regions for the 6-Pin TDFN:
Maximum Output Current vs. Input Voltage
Operating Region and Power Dissipation
The MAX1963/MAX1976 maximum power dissipation
depends on the thermal resistance of the IC package
and circuit board, the temperature difference between
the die junction and ambient air, and the rate of airflow.
The power dissipated in the device is P = IOUT ✕ (VIN VOUT). The maximum allowed power dissipation is:
PMAX = (TJ(MAX) - TA) / (θJC + θCA)
where (T J(MAX) - T A ) is the temperature difference
between the MAX1963/MAX1976 die junction and the
surrounding air, θJC is the thermal resistance of the
junction to the case, and θCA is the thermal resistance
from the case through the PC board, copper traces,
and other materials to the surrounding air. For best
heatsinking, expand the copper connected to the
exposed paddle or GND.
_______________________________________________________________________________________
7
MAX1963/MAX1976
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
The MAX1963/MAX1976 deliver up to 300mA and operate with an input voltage up to +3.6V. However, when
using the 6-pin SOT23 version, high output currents
can only be sustained when the input-output differential
voltage is less than 2V, as shown in Figure 2.
The maximum allowed power dissipation for the 6-pin
TDFN is 1.951W at TA = +70°C. Figure 3 shows that the
maximum input-output differential voltage is not limited
by the TDFN package power rating.
Applications Information
Capacitor Selection and
Regulator Stability
Capacitors are required at the MAX1963/MAX1976
input and output for stable operation over the full temperature range and with load currents up to 300mA.
Connect a 1µF ceramic capacitor between IN and GND
and a 4.7µF low-ESR ceramic capacitor between OUT
and GND. The input capacitor (CIN) lowers the source
impedance of the input supply. Use larger output
capacitors to reduce noise and improve load-transient
response, stability, and power-supply rejection.
The output capacitor’s equivalent series resistance
(ESR) affects stability and output noise. Use output
capacitors with an ESR of 30mΩ or less to ensure stability and optimize transient response. Surface-mount
ceramic capacitors have very low ESR and are commonly available in values up to 10µF. Connect CIN and
COUT as close to the MAX1963/MAX1976 as possible
to minimize the impact of PC board trace inductance.
Noise, PSRR, and Transient Response
The MAX1963/MAX1976 are designed to operate with
low dropout voltages and low quiescent currents in battery-powered systems while still maintaining good
noise, transient response, and AC rejection. See the
Typical Operating Characteristics for a plot of PowerSupply Rejection Ratio (PSRR) versus Frequency.
When operating from noisy sources, improved supplynoise rejection and transient response can be achieved
by increasing the values of the input and output bypass
capacitors and through passive filtering techniques.
The MAX1963/MAX1976 load-transient response (see
the Typical Operating Characteristics) shows two components of the output response: a near-zero DC shift
from the output impedance due to the load-current
8
change, and the transient response. A typical transient
response for a step change in the load current from 20mA
to 200mA is 20mV. Increasing the output capacitor’s value
and decreasing the ESR attenuates the overshoot.
Input-Output (Dropout) Voltage
A regulator’s minimum input-output voltage difference
(dropout voltage) determines the lowest usable supply
voltage. In battery-powered systems, this determines the
useful end-of-life battery voltage. Because the
MAX1963/MAX1976 use a P-channel MOSFET pass transistor, the dropout voltage is a function of drain-to-source
on-resistance (RDS(ON) = 0.33Ω) multiplied by the load
current (see the Typical Operating Characteristics).
VDROPOUT = VIN - VOUT = 0.33Ω ✕ IOUT
The MAX1963/MAX1976 ground current reduces to 70µA
in dropout.
Selector Guide
MAX1963
TOP MARK
MAX1976
TOP MARK
VOUT
(V)
SUFFIX
SOT
TDFN
SOT
TDFN
0.75
075
AABA
AFQ
AAAQ
AGA
0.85
085
—
—
AABP
AHD
1.00
100
—
—
AABL
AGC
1.10
110
—
—
AABM
AGD
1.20
120
AABE
AFU
AAAK
AGE
1.30
130
AABF
AFV
AABN
AGF
1.50
150
AABG
AFW
AAAL
AGG
1.60
160
—
—
AABO
AHC
1.80
180
AABH
AFX
AAAM
AGH
2.50
250
AABI
AFY
AAAN
AGI
2.85
285
—
—
AAAO
AGJ
3.00
300
AABJ
AFZ
AAAP
AGK
Chip Information
TRANSISTOR COUNT: 2556
PROCESS: BiCMOS
_______________________________________________________________________________________
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
_______________________________________________________________________________________
9
MAX1963/MAX1976
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
MAX1963/MAX1976
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
10
______________________________________________________________________________________
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
6, 8, &10L, DFN THIN.EPS
L
A
D
D2
A2
PIN 1 ID
1
N
1
C0.35
b
E
PIN 1
INDEX
AREA
[(N/2)-1] x e
REF.
E2
DETAIL A
e
k
A1
CL
CL
L
L
e
e
A
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
D
1
2
______________________________________________________________________________________
11
MAX1963/MAX1976
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
MAX1963/MAX1976
Low-Input-Voltage, 300mA LDO Regulators
with RESET in SOT and TDFN
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
COMMON DIMENSIONS
SYMBOL
A
MIN.
MAX.
0.70
0.80
D
2.90
3.10
E
2.90
3.10
A1
0.00
0.05
L
k
0.20
0.40
0.25 MIN.
A2
0.20 REF.
PACKAGE VARIATIONS
PKG. CODE
N
D2
E2
e
JEDEC SPEC
b
T633-1
6
1.50–0.10
2.30–0.10
0.95 BSC
MO229 / WEEA
0.40–0.05
1.90 REF
T833-1
8
1.50–0.10
2.30–0.10
0.65 BSC
MO229 / WEEC
0.30–0.05
1.95 REF
T1033-1
10
1.50–0.10
2.30–0.10
0.50 BSC
MO229 / WEED-3
0.25–0.05
2.00 REF
[(N/2)-1] x e
DALLAS
SEMICONDUCTOR
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 6, 8 & 10L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
APPROVAL
DOCUMENT CONTROL NO.
21-0137
REV.
D
2
2
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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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