CY2308 3.3V Zero Delay Buffer Features ■ Zero input-output propagation delay, adjustable by capacitive load on FBK input ■ Multiple configurations, see Available CY2308 Configurations on page 3 ■ Multiple low skew outputs ■ Two banks of four outputs, three-stateable by two select inputs ■ 10 MHz to 133 MHz operating range ■ 75 ps typical cycle-to-cycle jitter (15 pF, 66 MHz) ■ Space saving 16-pin 150 mil SOIC package or 16-pin TSSOP ■ 3.3V operation ■ Industrial temperature available The CY2308 has two banks of four outputs each that is controlled by the select inputs as shown in the table Select Input Decoding on page 2. If all output clocks are not required, Bank B is three-stated. The input clock is directly applied to the output for chip and system testing purposes by the select inputs. The CY2308 PLL enters a power down state when there are no rising edges on the REF input. In this mode, all outputs are three-stated and the PLL is turned off resulting in less than 50 μA of current draw. The PLL shuts down in two additional cases as shown in the table Select Input Decoding on page 2. Multiple CY2308 devices accept the same input clock and distribute it in a system. In this case, the skew between the outputs of two devices is less than 700 ps. Functional Description The CY2308 is a 3.3V Zero Delay Buffer designed to distribute high speed clocks in PC, workstation, datacom, telecom, and other high performance applications. The part has an on-chip PLL that locks to an input clock presented on the REF pin. The PLL feedback is driven into the FBK pin and obtained from one of the outputs. The input-to-output skew is less than 350 ps and output-to-output skew is less than 200 ps. The CY2308 is available in five different configurations as shown in the table Available CY2308 Configurations on page 3. The CY2308–1 is the base part where the output frequencies equal the reference if there is no counter in the feedback path. The CY2308–1H is the high drive version of the –1 and rise and fall times on this device are much faster. The CY2308–2 enables the user to obtain 2X and 1X frequencies on each output bank. The exact configuration and output frequencies depend on the output that drives the feedback pin. The CY2308–3 enables the user to obtain 4X and 2X frequencies on the outputs. The CY2308–4 enables the user to obtain 2X clocks on all outputs. Thus, the part is extremely versatile and is used in a variety of applications. The CY2308–5H is a high drive version with REF/2 on both banks. Logic Block Diagram /2 REF FBK PLL MUX /2 CLKA1 CLKA2 Extra Divider (–3, –4) CLKA3 Extra Divider (–5H) CLKA4 S2 Select Input Decoding S1 /2 CLKB1 CLKB2 CLKB3 Extra Divider (–2, –3) Cypress Semiconductor Corporation Document Number: 38-07146 Rev. *H • 198 Champion Court CLKB4 • San Jose, CA 95134-1709 • 408-943-2600 Revised March 12, 2009 [+] Feedback CY2308 Pinouts Figure 1. Pin Diagram - 16 Pin SOIC (Top view) REF CLKA1 1 16 2 15 CLKA2 VDD 3 14 4 13 GND CLKB1 CLKB2 S2 5 12 6 11 7 10 8 9 FBK CLKA4 CLKA3 VDD GND CLKB4 CLKB3 S1 Table 1. Pin Definitions - 16 Pin SOIC Pin 1 2 Signal Description [1] Input reference frequency, 5V tolerant input REF [2] Clock output, Bank A [2] Clock output, Bank A CLKA1 3 CLKA2 4 VDD 3.3V supply 5 GND Ground 6 CLKB1[2] Clock output, Bank B 7 CLKB2[2] Clock output, Bank B 8 S2[3] Select input, bit 2 9 S1[3] Select input, bit 1 10 CLKB3[2] [2] Clock output, Bank B 11 CLKB4 Clock output, Bank B 12 GND Ground 13 VDD 3.3V supply 14 CLKA3[2] Clock output, Bank A 15 CLKA4[2] Clock output, Bank A 16 FBK PLL feedback input Select Input Decoding S2 S1 CLOCK A1–A4 CLOCK B1–B4 Output Source PLL Shutdown 0 0 Tri-State Tri-State PLL Y 0 1 Driven Tri-State 1 0 Driven[4] 1 1 Driven [4] Driven Driven PLL N Reference Y PLL N Notes 1. Weak pull down. 2. Weak pull down on all outputs. 3. Weak pull ups on these inputs. 4. Outputs inverted on 2308–2 and 2308–3 in bypass mode, S2 = 1 and S1 = 0. Document Number: 38-07146 Rev. *H Page 2 of 15 [+] Feedback CY2308 Available CY2308 Configurations Device Feedback From Bank A Frequency Bank B Frequency CY2308–1 Bank A or Bank B Reference Reference CY2308–1H Bank A or Bank B Reference Reference CY2308–2 Bank A Reference Reference/2 CY2308–2 Bank B 2 X Reference Reference CY2308–3 Bank A 2 X Reference Reference or Reference[5] CY2308–3 Bank B 4 X Reference 2 X Reference CY2308–4 Bank A or Bank B 2 X Reference 2 X Reference CY2308–5H Bank A or Bank B Reference /2 Reference /2 Zero Delay and Skew Control Figure 2. REF. Input to CLKA/CLKB Delay Versus Difference in Loading between FBK Pin and CLKA/CLKB Pins To close the feedback loop of the CY2308, the FBK pin is driven from any of the eight available output pins. The output driving the FBK pin drives a total load of 7 pF plus any additional load that it drives. The relative loading of this output to the remaining outputs adjusts the input-output delay. This is shown in the Figure 2. If input-output delay adjustments are required, use the Zero Delay and Skew Control graph to calculate loading differences between the feedback output and remaining outputs. For zero output-output skew, outputs are loaded equally. For further information on using CY2308, refer to the application note “CY2308: Zero Delay Buffer.” For applications requiring zero input-output delay, all outputs including the one providing feedback is equally loaded. Note 5. Output phase is indeterminant (0° or 180° from input clock). If phase integrity is required, use the CY2308–2. Document Number: 38-07146 Rev. *H Page 3 of 15 [+] Feedback CY2308 Maximum Ratings Supply Voltage to Ground Potential................–0.5V to +7.0V Junction Temperature .................................................. 150°C DC Input Voltage (Except Ref) .............. –0.5V to VDD + 0.5V Static Discharge Voltage (MIL-STD-883, Method 3015).................................... >2000V DC Input Voltage REF ........................................... –0.5 to 7V Storage Temperature .................................. –65°C to +150°C Operating Conditions for Commercial Temperature Devices Parameter Description Min Max Unit 3.0 3.6 V 0 70 °C VDD Supply Voltage TA Operating Temperature (Ambient Temperature) CL Load Capacitance, below 100 MHz – 30 pF Load Capacitance, from 100 MHz to 133 MHz – 15 pF CIN Input Capacitance[6] tPU Power up time for all VDDs to reach minimum specified voltage (power ramps must be monotonic) – 7 pF 0.05 50 ms Min Max Unit Electrical Characteristics for Commercial Temperature Devices Parameter Description Test Conditions VIL Input LOW Voltage – 0.8 V VIH Input HIGH Voltage 2.0 – V IIL Input LOW Current VIN = 0V – 50.0 μA IIH Input HIGH Current VIN = VDD – 100.0 μA VOL Output LOW Voltage[7] IOL = 8 mA (–1, –2, –3, –4) IOL = 12 mA (–1H, –5H) – 0.4 V VOH Output HIGH Voltage[7] IOH = –8 mA (–1, –2, –3, –4) IOH = –12 mA (–1H, –5H) 2.4 – V IDD (PD mode) Power Down Supply Current REF = 0 MHz – 12.0 μA IDD Supply Current Unloaded outputs, 100 MHz REF, Select inputs at VDD or GND – 45.0 mA – 70.0 (–1H,–5H) mA Unloaded outputs, 66 MHz REF (–1, –2, –3, –4) – 32.0 mA Unloaded outputs, 33 MHz REF (–1, –2, –3, –4) – 18.0 mA Switching Characteristics for Commercial Temperature Devices Parameter[8] Min Typ. Max Unit t1 Output Frequency Name 30 pF load, All devices 10 – 100 MHz t1 Output Frequency 20 pF load, –1H, –5H devices[9] 10 – 133.3 MHz t1 Output Frequency 15 pF load, –1, –2, –3, –4 devices 10 – 133.3 MHz tPD Duty = t2 ÷ t1 (–1, –2, –3, –4, –1H, –5H) Measured at 1.4V, FOUT = 66.66 MHz 30 pF load 40.0 50.0 60.0 % tPD Duty Cycle[7, 8] = t2 ÷ t1 (–1, –2, –3, –4, –1H, –5H) Measured at 1.4V, FOUT < 50 MHz 15 pF load 45.0 50.0 55.0 % Cycle[7, 8] Test Conditions Notes 6. Applies to both Ref Clock and FBK. 7. Parameter is guaranteed by design and characterization. Not 100% tested in production. 8. All parameters are specified with loaded outputs. 9. CY2308–5H has maximum input frequency of 133.33 MHz and maximum output of 66.67 MHz. Document Number: 38-07146 Rev. *H Page 4 of 15 [+] Feedback CY2308 Switching Characteristics for Commercial Temperature Devices (continued) Parameter[8] Name [7, 8] Test Conditions Min Typ. Max Unit t3 Rise Time (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 30 pF load – – 2.20 ns t3 Rise Time[7, 8] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 15 pF load – – 1.50 ns t3 Rise Time[7, 8] (–1H, –5H) Measured between 0.8V and 2.0V, 30 pF load – – 1.50 ns t4 Fall Time[7, 8] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 30 pF load – – 2.20 ns t4 Fall Time[7, 8] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 15 pF load – – 1.50 ns t4 Fall Time[7, 8] (–1H, –5H) Measured between 0.8V and 2.0V, 30 pF load – – 1.25 ns t5 Output to Output Skew on same Bank (–1, –2, –3, –4)[7, 8] All outputs equally loaded – – 200 ps Output to Output Skew (–1H, All outputs equally loaded –5H) – – 200 ps Output Bank A to Output Bank B Skew (–1, –4, –5H) All outputs equally loaded – – 200 ps Output Bank A to Output Bank B Skew (–2, –3) All outputs equally loaded – – 400 ps t6 Delay, REF Rising Edge to FBK Rising Edge[7, 8] Measured at VDD/2 – 0 ±250 ps t7 Device to Device Skew[7, 8] Measured at VDD/2 on the FBK pins of devices – 0 700 ps t8 Output Slew Rate[7, 8] Measured between 0.8V and 2.0V on –1H, –5H device using Test Circuit 2 1 – tJ Cycle to Cycle Jitter[7, 8] (–1, –1H, –4, –5H) Measured at 66.67 MHz, loaded outputs, 15 pF load – 75 200 ps Measured at 66.67 MHz, loaded outputs, 30 pF load – – 200 ps Measured at 133.3 MHz, loaded outputs, 15 pF load – – 100 ps Measured at 66.67 MHz, loaded outputs 30 pF load – – 400 ps Measured at 66.67 MHz, loaded outputs 15 pF load – – 400 ps Stable power supply, valid clocks presented on REF and FBK pins – – 1.0 ms tJ tLOCK Cycle to Cycle Jitter[7, 8] (–2, –3) PLL Lock Time[7, 8] Document Number: 38-07146 Rev. *H V/ns Page 5 of 15 [+] Feedback CY2308 Operating Conditions for Industrial Temperature Devices Parameter Description Min Max Unit VDD Supply Voltage 3.0 3.6 V TA Operating Temperature (Ambient Temperature) –40 85 °C CL Load Capacitance, below 100 MHz – 30 pF Load Capacitance, from 100 MHz to 133 MHz – 15 pF [6] CIN Input Capacitance tPU Power up time for all VDDs to reach minimum specified voltage (power ramps must be monotonic) – 7 pF 0.05 50 ms Min Max Unit – 0.8 V Electrical Characteristics for Industrial Temperature Devices Parameter Description Test Conditions VIL Input LOW Voltage VIH Input HIGH Voltage IIL Input LOW Current VIN = 0V IIH Input HIGH Current Voltage[7, 8] 2.0 – V – 50.0 μA VIN = VDD – 100.0 μA IOL = 8 mA (–1, –2, –3, –4) IOL = 12 mA (–1H, –5H) – 0.4 V 2.4 – V 25.0 μA VOL Output LOW VOH Output HIGH Voltage[7, 8] IOH = –8 mA (–1, –2, –3, –4) IOH = –12 mA (–1H, –5H) IDD (PD mode) Power Down Supply Current REF = 0 MHz – IDD Supply Current Unloaded outputs, 100 MHz, Select inputs at VDD or GND – 45.0 mA – 70(–1H,–5H) mA Unloaded outputs, 66 MHz REF (–1, –2, –3, –4) – 35.0 mA Unloaded outputs, 66 MHz REF (–1, –2, –3, –4) – 20.0 mA Switching Characteristics for Industrial Temperature Devices Parameter[8] Name Test Conditions Min Typ Max Unit 10 10 – 100 MHz – 133.3 MHz 10 – 133.3 MHz t1 Output Frequency t1 Output Frequency 20 pF load, –1H, –5H devices t1 Output Frequency 15 pF load, –1, –2, –3, –4 devices tPD Duty Cycle = t2 ÷ t1 (–1, –2, –3, –4, –1H, –5H) Measured at 1.4V, FOUT = 66.66 MHz 30 pF load 40.0 50.0 60.0 % tPD Duty Cycle[7, 8] = t2 ÷ t1 (–1, –2, –3, –4, –1H, –5H) Measured at 1.4V, FOUT < 50 MHz 15 pF load 45.0 50.0 55.0 % t3 Rise Time[7, 8] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 30 pF load – – 2.50 ns t3 Rise Time[7, 8] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 15 pF load – – 1.50 ns t3 Rise Time[7, 8] (–1H, –5H) Measured between 0.8V and 2.0V, 30 pF load – – 1.50 ns t4 Fall Time[7, 8] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 30 pF load – – 2.50 ns t4 Fall Time[7, 8] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 15 pF load – – 1.50 ns [7, 8] Document Number: 38-07146 Rev. *H 30 pF load, All devices [9] Page 6 of 15 [+] Feedback CY2308 Switching Characteristics for Industrial Temperature Devices (continued) Parameter[8] Name Test Conditions [7, 8] Min Typ Max Unit – – 1.25 ns t4 Fall Time (–1H, –5H) t5 All outputs equally loaded Output to Output Skew on same Bank (–1, –2, –3, –4)[7, 8] – – 200 ps Output to Output Skew (–1H, –5H) All outputs equally loaded – – 200 ps Output Bank A to Output Bank All outputs equally loaded B Skew (–1, –4, –5H) – – 200 ps Output Bank A to Output Bank All outputs equally loaded B Skew (–2, –3) – – 400 ps t6 Delay, REF Rising Edge to FBK Rising Edge[78] Measured at VDD/2 – 0 ±250 ps t7 Device to Device Skew[7, 8] Measured at VDD/2 on the FBK pins of devices – 0 700 ps t8 Output Slew Rate[7, 8] Measured between 0.8V and 2.0V on –1H, –5H device using Test Circuit 2 1 – – V/ns tJ Cycle to Cycle Jitter[7, 8] (–1, –1H, –4, –5H) Measured at 66.67 MHz, loaded outputs, 15 pF load – 75 200 ps Measured at 66.67 MHz, loaded outputs, 30 pF load – – 200 ps Measured at 133.3 MHz, loaded outputs, 15 pF load – – 100 ps Measured at 66.67 MHz, loaded outputs 30 pF load – – 400 ps Measured at 66.67 MHz, loaded outputs 15 pF load – – 400 ps Stable power supply, valid clocks presented on REF and FBK pins – – 1.0 ms tJ tLOCK Measured between 0.8V and 2.0V, 30 pF load Cycle to Cycle Jitter[7, 8] (–2, –3) PLL Lock Time[7, 8] Switching Waveforms Figure 3. Duty Cycle Timing t1 t2 1.4V 1.4V 1.4V Figure 4. All Outputs Rise/Fall Time OUTPUT 2.0V 0.8V t3 Document Number: 38-07146 Rev. *H 2.0V 0.8V 3.3V 0V t4 Page 7 of 15 [+] Feedback CY2308 Switching Waveforms (continued) Figure 5. Output-Output Skew OUTPUT 1.4V 1.4V OUTPUT t5 Figure 6. Input-Output Propagation Delay INPUT VDD/2 VDD/2 FBK t6 Figure 7. Device-Device Skew VDD/2 FBK, Device 1 VDD/2 FBK, Device 2 t7 Document Number: 38-07146 Rev. *H Page 8 of 15 [+] Feedback CY2308 Typical Duty Cycle[10] and IDD Trends[11] for CY2308–1,2,3,4 Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) 60 60 58 58 56 56 54 52 33 MHz 50 66 MHz 48 100 MHz 46 44 Duty Cycle (% ) Duty Cycle (% ) Duty Cycle Vs VDD (for 30 pF Loads over Frequency - 3.3V, 25C) 54 33 MHz 52 66 MHz 50 100 MHz 48 133 MHz 46 44 42 42 40 3 3.1 3.2 3.3 3.4 3.5 40 3.6 3 VDD (V) 3.1 3.2 3.3 3.4 3.5 3.6 VDD (V) Duty Cycle Vs Frequency (for 30 pF Loads over Temperature - 3.3V) Duty Cycle Vs Frequency (for 15 pF Loads over Temperature - 3.3V) 60 60 58 58 56 54 -40C 52 0C 50 25C 48 70C 46 85C 44 Duty Cycle (%) Duty Cycle (%) 56 54 -40C 52 0C 50 25C 48 70C 46 85C 44 42 42 40 40 20 40 60 80 100 120 140 20 40 60 Frequency (MHz) 80 100 120 140 Frequency (MHz) IDD vs Number of Loaded Outputs (for 15 pF Loads over Frequency - 3.3V, 25C) IDD vs Number of Loaded Outputs (for 30 pF Loads over Frequency - 3.3V, 25C) 140 140 120 120 100 100 80 33 M Hz 66 M Hz 60 80 33 M Hz 60 66 M Hz 100 M Hz 100 M Hz 40 40 20 20 0 0 0 2 4 6 N umb er o f Lo ad ed Out p ut s 8 0 2 4 6 8 N umb er o f Lo ad ed Out p ut s Notes 10. Duty cycle is taken from typical chip measured at 1.4V. 11. IDD data is calculated from IDD = ICORE + nCVf, where ICORE is the unloaded current. (n = number of outputs; C = Capacitance load per output (F); V = Voltage Supply (V); f = frequency (Hz). Document Number: 38-07146 Rev. *H Page 9 of 15 [+] Feedback CY2308 Typical Duty Cycle[10] and IDD Trends[11] for CY2308–1H, 5H Duty Cycle Vs VDD (for 15 pF Loads over Frequency - 3.3V, 25C) 60 60 58 58 56 56 54 52 33 MHz 50 66 MHz 48 100 MHz 46 Duty Cycle (% ) Duty Cycle (% ) Duty Cycle Vs VDD (for 30 pF Loads over Frequency - 3.3V, 25C) 54 66 MHz 50 100 MHz 48 133 MHz 46 44 44 42 42 40 33 MHz 52 40 3 3.1 3.2 3.3 3.4 3.5 3.6 3 3.1 3.2 VDD (V) 3.4 3.5 3.6 Duty Cycle Vs Frequency Duty Cycle Vs VDD (for 15 15pF pFLoads Loadsover overFrequency Temperature - 3.3V) (for - 3.3V, 25C) Duty Cycle Vs Frequency (for 30 pF Loads over Temperature - 3.3V) 60 60 60 58 58 58 56 56 54 -40C 52 0C 50 25C 48 70C 46 85C Duty Cycle (% Duty Cycle (%)) 56 Duty Cycle (%) 3.3 VDD (V) 54 54 -40C 33 M Hz 0C 52 52 66 MHz 25C 100 MHz 70C 133 MHz 85C 50 50 48 48 46 46 44 44 44 42 42 42 40 40 40 20 40 60 80 100 120 320 140 40 3.1 60 3.2 80 3.3 100 3.4 120 3.5 140 3.6 Frequency VDD (V) (MHz) Frequency (MHz) IDD vs Number of Loaded Outputs (for 15 pF Loads over Frequency - 3.3V, 25C) IDD vs Number of Loaded Outputs (for 30 pF Loads over Frequency - 3.3V, 25C) 140 140 120 120 100 100 33 MHz 80 60 33 MHz 80 66 MHz 60 100 MHz 66 MHz 100 MHz 40 40 20 20 0 0 0 0 2 4 6 N u m b e r o f L o a d e d Ou t p u t s Document Number: 38-07146 Rev. *H 2 4 6 8 8 N u m b e r o f L o a d e d Ou t p u t s Page 10 of 15 [+] Feedback CY2308 Test Circuits Test Circuit 1 Test Circuit 2 VDD V DD 0.1 μF Outputs CLK OUT 0.1 μF 10 pF V DD V DD GND CLK out Outputs 1 KΩ C LOAD 0.1 μF 1 KΩ 0.1 μF GND Test Circuit for all parameters except t8 GND GND Test Circuit for t8, Output slew rate on –1H, –5 device Ordering Information Ordering Code CY2308SC–1[12] [12] Package Type Operating Range 16-pin 150 mil SOIC Commercial 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SI–1[12] 16-pin 150 mil SOIC Industrial CY2308SI–1T[12] 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308SC–1T [12] 16-pin 150 mil SOIC Commercial CY2308SC–1HT[12] 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SI–1H[12] 16-pin 150 mil SOIC Industrial CY2308SC–1H [12] 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308ZC–1H[12] 16-pin 4.4mm TSSOP Commercial CY2308ZC–1HT[12] 16-pin 4.4mm TSSOP - Tape and Reel Commercial CY2308SI–1HT [12] 16-pin 4.4mm TSSOP Industrial CY2308ZI–1HT[12] 16-pin 4.4mm TSSOP - Tape and Reel Industrial CY2308SC–2[12] 16-pin 150 mil SOIC Commercial 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308ZI–1H CY2308SC–2T [12] CY2308SI–2[12] 16-pin 150 mil SOIC Industrial [12] 16-pin 150 mil SOIC - Tape and Reel Industrial [12] 16-pin 150 mil SOIC Commercial 16-pin 150 mil SOIC - Tape and Reel Commercial 16-pin 150 mil SOIC Commercial 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SI–2T CY2308SC–3 CY2308SC–3T[12] CY2308SC–4 [12] CY2308SC–4T [12] Note 12. Not recommended for new designs. Document Number: 38-07146 Rev. *H Page 11 of 15 [+] Feedback CY2308 Ordering Information (continued) Ordering Code Package Type Operating Range Pb-Free CY2308SXC–1 16-pin 150 mil SOIC Commercial CY2308SXC–1T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI–1 16-pin 150 mil SOIC Industrial CY2308SXI–1T 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308SXC–1H 16-pin 150 mil SOIC Commercial CY2308SXC–1HT 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI–1H 16-pin 150 mil SOIC Industrial CY2308SXI–1HT 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308ZXC–1H 16-pin 4.4mm TSSOP Commercial CY2308ZXC–1HT 16-pin 4.4mm TSSOP - Tape and Reel Commercial CY2308ZXI–1H 16-pin 4.4mm TSSOP Industrial CY2308ZXI–1HT 16-pin 4.4mm TSSOP - Tape and Reel Industrial CY2308SXC–2 16-pin 150 mil SOIC Commercial CY2308SXC–2T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI–2 16-pin 150 mil SOIC Industrial CY2308SXI–2T 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308SXC–3 16-pin 150 mil SOIC Commercial CY2308SXC–3T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI–3 16-pin 150 mil SOIC Industrial CY2308SXI–3T 16-pin 150 mil SOIC -Tape and Reel Industrial CY2308SXC–4 16-pin 150 mil SOIC Commercial CY2308SXC–4T 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI–4 16-pin 150 mil SOIC Industrial CY2308SXI–4T 16-pin 150 mil SOIC - Tape and Reel Industrial CY2308SXC–5H] 16-pin 150 mil SOIC Commercial CY2308SXC–5HT 16-pin 150 mil SOIC - Tape and Reel Commercial CY2308SXI–5H 16-pin 150 mil SOIC Industrial CY2308SXI–5HT 16-pin 150 mil SOIC - Tape and Reel Industrial Document Number: 38-07146 Rev. *H Page 12 of 15 [+] Feedback CY2308 Package Drawings and Dimensions 16 Lead (150 Mil) SOIC Figure 7. 16-Pin (150 Mil) SOIC S16.15 PIN 1 ID 8 1 DIMENSIONS IN INCHES[MM] MIN. MAX. REFERENCE JEDEC MS-012 PACKAGE WEIGHT 0.15gms 0.150[3.810] 0.157[3.987] 0.230[5.842] 0.244[6.197] PART # S16.15 STANDARD PKG. SZ16.15 LEAD FREE PKG. 9 16 0.386[9.804] 0.393[9.982] 0.010[0.254] 0.016[0.406] SEATING PLANE X 45° 0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.0075[0.190] 0.0098[0.249] 0.016[0.406] 0.035[0.889] 0°~8° 0.0138[0.350] 0.0192[0.487] 0.004[0.102] 0.0098[0.249] 51-85068-*B Figure 8. 16-Pin TSSOP 4.40 mm Body Z16.173 PIN 1 ID DIMENSIONS IN MM[INCHES] MIN. MAX. 1 REFERENCE JEDEC MO-153 6.25[0.246] 6.50[0.256] PACKAGE WEIGHT 0.05 gms PART # 4.30[0.169] 4.50[0.177] Z16.173 STANDARD PKG. ZZ16.173 LEAD FREE PKG. 16 0.65[0.025] BSC. 0.19[0.007] 0.30[0.012] 1.10[0.043] MAX. 0.25[0.010] BSC GAUGE PLANE 0°-8° 0.076[0.003] 0.85[0.033] 0.95[0.037] 4.90[0.193] 5.10[0.200] 0.05[0.002] 0.15[0.006] SEATING PLANE 0.50[0.020] 0.70[0.027] 0.09[[0.003] 0.20[0.008] 51-85091-*A Document Number: 38-07146 Rev. *H Page 13 of 15 [+] Feedback CY2308 Document History Page Document Title: CY2308 3.3V Zero Delay Buffer Document Number: 38-07146 Orig. of Change Submission Date Rev. ECN Description of Change ** 110255 SZV 12/17/01 Changed from Specification number: 38-00528 to 38-07146 *A 118722 RGL 10/31/02 Added Note 1 in page 2. *B 121832 RBI 12/14/02 Power up requirements added to Operating Conditions Information *C 235854 RGL 06/24/04 Added Pb-Free Devices *D 310594 RGL 02/09/05 Removed obsolete parts in the ordering information table Specified typical value for cycle-to-cycle jitter *E 1344343 KVM/VED 08/20/07 Brought the Ordering Information Table up to date: removed three obsolete parts and added two parts Changed titles to tables that are specific to commercial and industrial temperature ranges *F 2568575 AESA 09/19/08 Updated template. Added Note “Not recommended for new designs.” Changed IDD (PD mode) from 12.0 to 25.0 μA for Commercial and Industrial Temperature Devices Deleted Duty Cycle parameters for Fout < 50 MHz Removed CY2308SI-4, CY2308SI-4T and CY2308SC-5HT. *G 2632364 KVM 01/08/09 Corrected TSSOP package size (from 150 mil to 4.4 mm) in Ordering Information table *H 2673353 KVM/PYRS 03/13/09 Reverted IDD (PD mode) and Duty Cycle parameters back to the values in revision *E: Changed IDD (PD mode) from 25 to 12 μA for commercial temperature devices Added Duty Cycle parameters for Fout < 50 MHz for commercial and industrial devices. Document Number: 38-07146 Rev. *H Page 14 of 15 [+] Feedback CY2308 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products PSoC Clocks & Buffers PSoC Solutions psoc.cypress.com clocks.cypress.com General Low Power/Low Voltage psoc.cypress.com/solutions psoc.cypress.com/low-power Wireless wireless.cypress.com Precision Analog Memories memory.cypress.com LCD Drive psoc.cypress.com/lcd-drive image.cypress.com CAN 2.0b psoc.cypress.com/can USB psoc.cypress.com/usb Image Sensors psoc.cypress.com/precision-analog © Cypress Semiconductor Corporation, 2001-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-07146 Rev. *H Revised March 12, 2009 Page 15 of 15 All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback