ZETEX 835A

830 series
Silicon 25V hyperabrupt varactor diodes
ZC829, ZDC833, ZMV829, ZMDC830 and ZV831
Description
A range of silicon varactor diodes for use in
frequency control and filtering. Featuring
closely controlled CV characteristics and high
Q. Low reverse current ensures very low phase
noise performance. Available in single or dual
common cathode format in a wide rage of
miniature surface mount packages.
SOT23
SOT323
SOD523
SOD323
Features
•
Close tolerance CV characteristics
•
High tuning ratio
•
Low IR (typically 200pA)
•
Excellent phase noise performance
•
High Q
•
Range of miniature surface mount packages
Applications
•
VCXO and TCXO
•
Wireless communications
•
Pagers
•
Mobile radio
Where steeper CV slopes are required there is the 12V hyperabrupt range:
ZC930, ZMV930, ZV930 and ZV931
Issue 11 - January 2007
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830 series
Order codes and device marking
SOT23
Order code
ZC829ATA
ZC829BTA
ZC830ATA
ZC830BTA
ZC831ATA
ZC831BTA
ZC832ATA
ZC832BTA
ZC833ATA
ZC833BTA
ZC834ATA
ZC834BTA
ZC835ATA
ZC835BTA
ZC836ATA
ZC836BTA
SOD323
Mark
J9A
J9B
J1A
J1B
J3A
J3B
J4A
J4B
J2A
J2B
J5A
J5B
J6A
J6B
J7A
J7B
Order code
ZMV829ATA
ZMV829BTA
ZMV830ATA
ZMV830BTA
ZMV831ATA
ZMV831BTA
ZMV832ATA
ZMV832BTA
ZMV833ATA
ZMV833BTA
ZMV834ATA
ZMV834BTA
ZMV835ATA
ZMV835BTA
SOD523
Mark
AA
CA
AB
CB
AC
CC
AD
CD
AE
CE
AF
CF
AG
CG
Order code
SOT23
Mark
ZV831BV2TA
81
ZV832BV2TA
82
Order code
SOT323
Mark
ZDC833ATA
C2A
ZDC834ATA
C5A
Order code
Mark
ZMDC831BTA
CC
ZMDC832BTA
CD
Note:
The order codes are shown as TA which is for 7 inch reels. For 13 inch reels substitute TC in place of TA in the order code.
Tape and reel information
Reel code
Reel size
(inches)
Tape width
(millimeters)
Quantity per reel
TA
7
8
3,000
TC
13
8
10,000
Issue 11 - January 2007
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830 series
Tuning characteristics at Tamb = 25°C
Part
829A
829B
830A
830B
831A
831B
832A
832B
833A
833B
834A
834B
835A
835B
836A
836B
Capacitance (pF)
VR=2V, f=1MHz
Min.
7.38
7.79
9.0
9.5
13.5
14.25
19.8
20.9
29.7
31.35
42.3
44.65
61.2
64.6
90.0
95.0
Nom.
8.2
8.2
10.0
10.0
15.0
15.0
22.0
22.0
33.0
33.0
47.0
47.0
68.0
68.0
100.0
100.0
Min Q
VR = 3V
f = 50MHz
Max.
9.02
8.61
11.0
10.5
16.5
15.75
24.2
23.1
36.3
34.65
51.7
49.35
74.8
71.4
110.0
105.0
Capacitance ratio
C2 / C20
@ f = 1MHz
Min.
Max.
4.3
5.8
4.3
5.8
4.5
6.0
4.5
6.0
4.5
6.0
4.5
6.0
5.0
6.5
5.0
6.5
5.0
6.5
5.0
6.5
5.0
6.5
5.0
6.5
5.0
6.5
5.0
6.5
5.0
6.5
5.0
6.5
250
250
300
300
300
300
200
200
200
200
200
200
100
100
100
100
Absolute maximum ratings
Parameter
Forward current
Symbol
IF
Max.
200
Unit
mA
Power dissipation at Tamb = 25°C SOT23
Ptot
330
mW
Power dissipation at Tamb = 25°C SOD323
Ptot
330
mW
Power dissipation at Tamb = 25°C SOD523
Ptot
250
mW
-55 to +150
°C
Operating and storage temperature range
Electrical characteristics at Tamb = 25°C
Paramater
Reverse breakdown voltage
Conditions
IR = 10␮A
Min.
25
Typ.
Max.
Unit
V
Reverse voltage leakage
VR = 20V
0.2
20
nA
Temperature coefficient of
capacitance
VR = 3V, f = 1MHz
300
400
ppCm/°C
Issue 11 - January 2007
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830 series
Typical characteristics
Issue 11 - January 2007
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830 series
Package outline - SOT23
E
e
e1
b
3 leads
L1
D
E1
A
L
A1
Dim.
c
Millimeters
Min.
Max.
2.67
3.05
1.20
1.40
1.10
0.37
0.53
0.085
0.15
1.90 NOM
A
B
C
D
F
G
Inches
Min.
Max.
0.105
0.120
0.047
0.055
0.043
0.015
0.021
0.0034
0.0059
0.075 NOM
Dim.
H
K
L
M
N
-
Millimeters
Min.
Max.
0.33
0.51
0.01
0.10
2.10
2.50
0.45
0.64
0.95 NOM
-
Inches
Max.
Max.
0.013
0.020
0.0004
0.004
0.083
0.0985
0.018
0.025
0.0375 NOM
-
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Package outline - SOT323
b
e
e
L
Q1
E1
E
e1
D
⍜
C
A A2
Dim.
A
A1
A2
b
C
D
E
A1
Millimeters
Min.
Max.
0.80
1.10
0
0.10
0.80
1.00
0.25
0.40
0.10
0.26
1.80
2.20
1.80
2.40
Inches
Min.
Max.
0.0315
0.0433
0
0.0039
0.0315
0.394
0.0098
0.0158
0.0039
0.0102
0.0709
0.0866
0.0709
0.0945
Dim.
E1
e
e1
L
Q1
⍜
-
Millimeters
Min.
Max.
1.15
1.35
0.65 BSC
1.30 BSC
0.10
0.30
0.10
0.40
0°
30°
-
Inches
Max.
Max.
0.0453
0.0532
0.0256 BSC
0.0512 BSC
0.0039
0.0118
0.0039
0.0158
0°
30°
-
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 11 - January 2007
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830 series
Package outline - SOD523
Cathode
Mark
D
c
L1
E1
E
L
b1
⍜
A2
A
A1
DIM
Millimeters
Inches
Min.
Max.
Min.
Max.
A
–
0.800
–
0.0314
A1
0.000
0.100
0.000
A2
0.600
0.800
b1
0.160
c
D
DIM
Millimeters
Inches
Min.
Max.
Min.
Max.
E
1.500
1.700
0.0590
0.0669
0.0039
E1
1.100
1.300
0.0433
0.0511
0.0236
0.0314
L
0.200
0.400
0.0078
0.0157
0.300
0.0062
0.0118
L1
0.170
0.230
0.0066
0.0090
0.080
0.220
0.0031
0.0086
U
4°
10°
4°
10°
0.700
0.900
0.0275
0.0354
-
-
-
-
-
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 11 - January 2007
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830 series
Package outline - SOD323
Top mark
A
H
YZ
C
Partmark as example only
for orientation
Top view
G
D
F
C
A
B
DIM
E
Millimeters
Min.
Max.
A
0.91
1.16
B
0.00
C
D
DIM
Millimeters
Min.
Max.
E
0.127
0.200
0.10
F
1.52
1.77
-
-
G
1.11
1.37
0.33
0.40
H
2.46
2.71
Issue 11 - January 2007
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830 series
Definitions
Product change
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
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opportunity or consequential loss in the use of these circuit applications, under any circumstances.
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Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labelling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or to affect its safety or effectiveness.
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ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.
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Product status key:
“Preview”
Future device intended for production at some point. Samples may be available
“Active”
Product status recommended for new designs
“Last time buy (LTB)”
Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs” Device is still in production to support existing designs and production
“Obsolete”
Production has been discontinued
Datasheet status key:
“Draft version”
This term denotes a very early datasheet version and contains highly provisional information, which
may change in any manner without notice.
“Provisional version”
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
However, changes to the test conditions and specifications may occur, at any time and without notice.
“Issue”
This term denotes an issued datasheet containing finalized specifications. However, changes to
specifications may occur, at any time and without notice.
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© 2007 Published by Zetex Semiconductors plc
Issue 11 - January 2007
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