MAXIM 71M6103-IL

19-5704; Rev 6/11
71M6103/71M6113/
71M6201/71M6203/
71M6601/71M6603
Isolated Sensor ICs
A Maxim Integrated Products Brand
DATA SHEET
June 2011
GENERAL DESCRIPTION
FEATURES
The 71M6103/71M6113/71M6201/71M6203/71M6601/71M6603
(71M6xxx) isolated sensor ICs enable Teridian’s 4th-generation
polyphase-metering 71M654x systems-on-chips (SoCs) to use
nonisolating sensors such as resistive shunts without the need
for costly and nonlinear isolation transformers or CTs. Isolation is
provided by low-cost pulse transformers that form a bidirectional
digital communication link between the 71M654x and the
isolated sensor ICs.
• 0.1% Accuracy Over 2000:1 Current
Range
• Exceeds IEC 62053/ANSI C12.20
Standards
• Compatible with Shunt Resistors as Low
as 50µΩ
• On-Chip Temperature Sensor Enables
Localized Digital Temperature
Compensation by the 71M654x
• 22-Bit ADC
• Powered from the 71M654x Using Pulses
Sent Through the Transformer
• 3.3mW Typical Consumption
• On-Chip Power Monitoring
• Industrial Temperature Range
• 8-Pin Lead(Pb)-Free SO Package
The 71M6xxx isolated sensor ICs contain a 22-bit delta-sigma
ADC, an amplifier with differential inputs, a precision voltage
reference, a temperature sensor, and a supply voltage generator
that is energized by power pulses provided by the 71M654x.
In conjunction with the 71M654x metering SoCs, the isolated
sensor ICs offer unprecedented BOM cost reduction, immunity to
magnetic tampering, and enhanced reliability for single-phase
and polyphase applications.
C
Shunt Current Sensors
LOAD
NEUTRAL
B
A
POWER SUPPLY
Resistor Dividers
71M6xx3
71M6xx3
71M6xx3
NEUTRAL
Pulse Transformers
Note: This system is referenced to Neutral
3x TERIDIAN
71M6xx3
MUX and ADC
IADC0
IADC1 }IN*
VADC10 (VC)
IADC6
IADC7 }IC
VADC9 (VB)
IADC4
IADC5 }IB
VADC8 (VA)
IADC2
IADC3 }IA
V3P3A V3P3SYS GNDA GNDD
TERIDIAN
71M6543F/
71M6543H
AMR
IR
TX
RAM
COMPUTE
ENGINE
RX
MODUL- RX
ATOR TX
FLASH
MEMORY
MPU
POWER FAULT
COMPARATOR
HOST
RTC
TIMERS
BATTERY
VBAT
BATTERY
MONITOR
COM0...5
SEG
SEG/DIO
LCD DRIVER
DIO, PULSES
DIO
V3P3D
OSCILLATOR/
PLL
XIN
RTC
BATTERY
LCD DISPLAY
8888.8888
PULSES,
DIO
I2C or µWire
EEPROM
32 kHz
SPI INTERFACE
ICE
*IN = Neutral Current
v1.2
WAKE-UP
REGULATOR
VBAT_RTC
TEMPERATURE
SENSOR
VREF
SERIAL PORTS
PWR MODE
CONTROL
XOUT
9/17/2010
© 2008–2011 Teridian Semiconductor Corporation
1
PDS_6xxx_010
71M6xxx Data Sheet
Table of Contents
1
2
3
3.1
3.2
Hardware Description ............................................................................................................ 4
Functional Description .......................................................................................................... 4
Applications Information ....................................................................................................... 5
Product Selection.................................................................................................................. 5
External Components for the 71M6xxx ................................................................................ 6
3.2.1 Current Sensor Side .................................................................................................... 6
3.2.2 Pulse Transformer ....................................................................................................... 6
3.3
3.4
3.5
4
4.1
4.2
4.3
4.4
Connections to Sensors and to the 71M654x ...................................................................... 7
PCB Layout Considerations ................................................................................................. 9
Compatibility with the 71M654x.......................................................................................... 10
Specifications ...................................................................................................................... 11
Absolute Maximum Ratings................................................................................................ 11
Recommended External Components ............................................................................... 11
Recommended Operating Conditions................................................................................ 11
Performance Specifications ............................................................................................... 12
4.4.1 Supply Current .......................................................................................................... 12
4.4.2 Power and Data Pulses ............................................................................................. 12
4.4.3 VCC Voltage Monitor ................................................................................................. 12
4.4.4 Temperature Sensor.................................................................................................. 12
4.4.5 VREF Performance Specifications ............................................................................. 13
4.4.6 ADC Converter .......................................................................................................... 14
4.5
4.6
4.7
4.8
5
6
7
v1.2
Typical Performance Data .................................................................................................. 15
Package Outline Drawing ................................................................................................... 16
IC Pinout .............................................................................................................................. 17
Pin Description.................................................................................................................... 17
Ordering Information ........................................................................................................... 18
Related Information ............................................................................................................. 18
Contact Information ............................................................................................................. 18
© 2008–2011 Teridian Semiconductor Corporation
2
PDS_6xxx_010
71M6xxx Data Sheet
Figures
Figure 1: Block Diagram .......................................................................................................................... 4
Figure 2: External Components Connected to the 71M6xxx ..................................................................... 7
Figure 3: Current Sensors Connected to the 71M6541D/F Using One 71M6x01....................................... 8
Figure 4: Current Sensors Connected to the 71M6543F/H or 71M6545/H with Three 71M6xx3 ................ 9
Figure 5: Copper Separation and Signal Traces for a Polyphase PCB.................................................... 10
Figure 6: Wh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC) ................................. 15
Figure 7: VARh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC) ............................. 15
Figure 8: SOIC-8 Package Outline ......................................................................................................... 16
Figure 9: Pinout for 8-Pin SO Package .................................................................................................. 17
Tables
Table 1: Remote Interface Commands..................................................................................................... 5
Table 2: Product Variations...................................................................................................................... 6
Table 3: Absolute Maximum Ratings ...................................................................................................... 11
Table 4: Recommended External Components ...................................................................................... 11
Table 5: Recommended Operating Conditions ....................................................................................... 11
Table 6: Supply Current Performance Specifications.............................................................................. 12
Table 7: Timing Specifications for Power and Data Pulses ..................................................................... 12
Table 8: VCC Voltage Monitor Specifications ......................................................................................... 12
Table 9: Temperature Sensor Specifications .......................................................................................... 12
Table 10: VREF Performance Specifications.......................................................................................... 13
Table 11: ADC Converter Specifications ................................................................................................ 14
Table 12: Pin Description ....................................................................................................................... 17
Table 13: Product Variations.................................................................................................................. 18
Table 14: Packaging Information, Corresponding CE Codes, and Ordering Numbers ............................. 18
v1.2
© 2008–2011 Teridian Semiconductor Corporation
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PDS_6xxx_010
1
71M6xxx Data Sheet
HARDWARE DESCRIPTION
The 71M6103/71M6113/71M6201/71M6203/71M6601/71M6603 (71M6xxx) remote sensor ICs integrate
all functional blocks required to implement an isolated front-end with digital communication capability.
Figure 1 shows the 71M6xxx IC block diagram. The chip includes the following:
•
•
•
•
•
•
•
•
•
Preamplifier with a fixed gain
22-bit delta-sigma ADC
ADC voltage reference
Temperature sensor
VCC monitor
Power-on reset circuitry
Bidirectional pulse interface
Active rectifiers for supply-voltage generation from the power pulses provided by the 71M654x
Digital control section providing control registers for the selection of operation modes
INP
ADC
+
SHUNT
VREF
PREAMP
VBIAS
INN
+
CROSS
ADC_CLK
ADC_OUT
BUFFER
1:1.1
To
71M654X
Primary
VDD
SP
PLL
PULSEIO
BAND
GAP
IBIAS
TEMP/VCC
MONITOR
RD_CLK
SN
Secondary
CHOP
VCC
WR_DATA
RD_DATA
RD_DATA
POWER
ON
RESET
DIGITAL SECTION
RESET
DATA_IN[15:0]
OTP MEMORY
ACTIVE
RECTIFIERS
GND
VCC
TEST
Figure 1: Block Diagram
2
FUNCTIONAL DESCRIPTION
During normal operation, the SP and SN pins of the 71M6xxx are connected to the pulse transformer.
When PLL_FAST = 1 in the 71M654x, power pulses generated by the 71M654x arrive every 610.35ns.
The PLL in the 71M6xxx locks to these incoming power pulses. The communication between the
71M654x and the 71M6xxx is synchronized to the multiplexer frames of the 71M654x. The
communication protocol is Teridian-proprietary, and details are not described in this data sheet. All
aspects of the communication between the 71M654x and the 71M6xxx are managed on the hardware
level and they are completely transparent to the user.
The communication interface can run at two different data rates. Power pulses are generated every
610.35ns if the PLL_FAST register in the 71M654x is set to 1, and every 1.905µs if PLL_FAST is set to 0.
The power pulses are 101.7ns wide with PLL_FAST = 1, and 160ns wide with PLL_FAST = 0.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
4
PDS_6xxx_010
71M6xxx Data Sheet
The 71M6xxx isolated sensors provide a continuous data stream of ADC data plus an independent data
stream that contains auxiliary information as requested by the 71M654x. The ADC data is processed by
CE code in the 71M654x and stored in CE RAM. Auxiliary information is processed by the MPU of the
71M654x using I/O RAM registers.
Basic settings and functions of the 71M6xxx can be controlled by various I/O RAM registers in the
71M654x. The command sent towards the 71M6xxx is placed in the RCMD[4:2] register of the 71M654x,
with further specification contained in the TMUXRn[2:0] register. Refer to the 71M654x data sheets for
details.
Table 1 shows the allowable combinations of values in RCMD[4:2] and TMUXRn[2:0] , and the achieved
operation along with the type and format of data sent back by the 71M6xxx isolated sensors.
Table 1: Remote Interface Commands
RCMD[4:2]
TMUXRn[2:0]
001
001
001
00X
01X
10X
001
11X
010
010
010
110
00X
01X
10X
111
Read
Operation/Command
Chip-characteristic
temperature data
Temperature
Supply voltage
Chip version
Reset
R6K_RD [15:0]
TRIMT (see note), use bits [8:1]
TRIMBGC (see note), use bits [15:6]
TRIMBGA (see note), use bits [15:8]
TRIMBGB bits [15:8], TRIMBGD bits [7:0]
(see note)
Output of the temperature sensor, bits [10:0]
Supply voltage measurement , bits [7:0]
Chip version code, use bits [15:8]
—
Note: TRIMBGA to TRIMBGD and TRIMT are values used for characterizing the individual 71M6xxx over temperature. Availability
of TRIMBGA to TRIMBGD and TRIMT depends on the part number (see Table 10 for details).
The remote interface commands listed in Table 1 enable the 71M654x to gather the following information
from the 71M6xxx:
•
•
•
•
Output of the temperature sensor
Information on how the device is characterized over temperature
Supply voltage
Chip version code
The control commands listed in Table 1 enable the 71M654x to initiate the following actions in the
71M6xxx:
•
•
•
Read the 71M6xxx temperature sensor
Read the 71M6xxx VCC sensor
Hardware reset
With hardware and temperature characterization information on each connected 71M6xxx isolated sensor
available to the 71M654x host MPU, temperature compensation of the energy measurement can be
implemented based on the individual temperature characteristics of the 71M6xxx isolated sensors. For
example, when the 71M6xxx are used in a polyphase meter containing three shunt resistors, the
temperature increase in each 71M6xxx can be monitored and used to compensate for the temperature
coefficient of the 71M6xxx VREF and the corresponding shunt resistor.
3
APPLICATIONS INFORMATION
3.1
Product Selection
A low-noise differential-input preamplifier applies gain to the signal from the current sensor to the optimal
input range of the ADC. The current sensor is connected to the inputs of the preamplifier through INP and
INN. The output of the preamplifier connects directly to the input of the ADC. See 5 Ordering Information
for available part types. Shunt resistances from 736µΩ to as low as 50µΩ can be accommodated,
depending on desired current range and part type.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
5
PDS_6xxx_010
71M6xxx Data Sheet
The shunt resistance must be balanced with the maximum current range of the part type, as shown in
Table 2. Various combinations of current ranges and shunt resistance values are possible. However, the
shunt resistance for a given current has to be chosen carefully as not to exceed the maximum RMS
voltage at the INP/INN pins of the 71M6xxx. The maximum wattage of the shunt resistor is another
consideration that applies to the resistance range of the shunt.
Table 2: Product Variations
Part
Application
Maximum
Current
(A)
71M6601
71M6603
71M6103
71M6113
71M6201
71M6203
S
P
60
P
100
S
P
200
1
Accuracy
2
Class
(%)
Maximum
RMS
Voltage at
INP/INN
(mV)
Maximum
Shunt
3
Resistance
(µΩ)
Shunt
4
Power
(W)
Typical
Shunt
5
Resistance
(µΩ)
1
1
44
736
1.44
400
19.6
196
1.2
120
12.6
63
2.0
50
1
0.5
0.2
0.2
Note 1: S = single phase, P = polyphase.
Note 2: Accuracy over temperature (-40°C to +85°C for 71M620x parts, -20°C to +60° for all other parts), when combined with
71M654x or 71M654xH IC.
Note 3: Maximum resistance at maximum current.
Note 4: Power at maximum current and typical shunt resistance.
Note 5: Typical resistance values provide room for overhead while maintaining optimum dynamic range.
The inputs of the preamplifier are referenced to local ground (the GND pin of the 71M6xxx). This means
that in an isolated system, the INP and INN pins have to be biased towards this local GND. See 3.2.1
Current Sensor Side for details.
3.2
External Components for the 71M6xxx
3.2.1
Current Sensor Side
Figure 2 shows the external components required for the 71M6xxx. It is recommended to use the
following components:
•
•
•
3.2.2
1.0µF capacitor between the GND and VCC pins. This capacitor minimizes the VCC ripple
voltage.
One 1kΩ resistor each from the sensor output pins to GND. These resistors help to bias the input
voltage at the INP and INN pins towards GND.
In environments where EMC is a concern, ferrite beads can be placed between the sense pins of
the shunt resistor and the INP/INN pins of the 71M6xxx.
Pulse Transformer
A low-cost pulse transformer is used for the link between the 71M654x and the 71M6xxx. It is the
responsibility of the meter system designer to qualify the transformer used in the system over the required
operating temperature range. The following commercially available transformer is suitable for this
application:
•
v1.2
Würth Electronics Midcom Inc., P/N 750-11-0056 REV 2 (www.midcom-inc.com)
© 2008–2011 Teridian Semiconductor Corporation
6
PDS_6xxx_010
71M6xxx Data Sheet
Current Shunt
Sensor
Load
R1 1 kΩ
R2 1 kΩ
TERIDIAN
71M6xxx
INP
INN
VCC
SN
GND
1
SP
7
NC
6
TEST
Voltage
Sensing
5
8
2
3
4
C1
1. 0 µF
IAN
IAP
V3P3A
VA
Pulse
Transformer
TERIDIAN
71M654x
Figure 2: External Components Connected to the 71M6xxx
3.3
Connections to Sensors and to the 71M654x
Figure 3 shows the sensor connections for single-phase meter application using a 71M6541D/F and
71M6x01. This single-phase configuration uses one local shunt and one shunt isolated with a 71M6x01
device. Since the local shunt is connected to the LINE circuit, the meter is also referenced to the LINE
circuit.
Figure 4 shows the sensor connections for a polyphase meter application using a 71M6543F/H or
71M6545/H. This polyphase configuration uses three 71M6xx3 to isolate the shunt sensors for the three
phases, while a locally connected fourth shunt sensor can be optionally used to sense neutral current.
Since the local shunt is connected to the neutral circuit, the meter is also referenced to the neutral circuit.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
7
PDS_6xxx_010
NEUTRAL
71M6xxx Data Sheet
Shunt
LOAD
Note:
This system is referenced to LINE
Shunt
LINE
NEUTRAL
POWER SUPPLY
LINE
Resistor Divider
LINE
TERIDIAN
71M6x01
MUX and ADC
V3P3A V3P3SYS GNDA GNDD
PWR MODE
CONTROL
IAP
IAN
Pulse
Transformer
TERIDIAN
WAKE-UP
71M6541D/F
REGULATOR
BATTERY
VBAT
VA
VBAT_RTC
IBP
IBN
TEMPERATURE
SENSOR
VREF
SERIAL PORTS
AMR
IR
TX
COMPUTE
ENGINE
RX
MODUL- RX
ATOR TX
POWER FAULT
COMPARATOR
HOST
RAM
FLASH
MEMORY
MPU
RTC
TIMERS
BATTERY
MONITOR
COM0...5
SEG
SEG/DIO
LCD DRIVER
DIO, PULSES
DIO
V3P3D
OSCILLATOR/
PLL
XIN
RTC
BATTERY
LCD DISPLAY
8888.8888
PULSES,
DIO
I2C or µWire
EEPROM
32 kHz
SPI INTERFACE
ICE
XOUT
11/5/2010
Figure 3: Current Sensors Connected to the 71M6541D/F Using One 71M6x01
v1.2
© 2008–2011 Teridian Semiconductor Corporation
8
PDS_6xxx_010
C
71M6xxx Data Sheet
Shunt Current Sensors
LOAD
NEUTRAL
B
A
POWER SUPPLY
Resistor Dividers
71M6xx3
71M6xx3
71M6xx3
NEUTRAL
Pulse Transformers
Note: This system is referenced to Neutral
3x TERIDIAN
71M6xx3
MUX and ADC
IADC0
IADC1 }IN*
VADC10 (VC)
IADC6
IADC7 }IC
VADC9 (VB)
IADC4
IADC5 }IB
VADC8 (VA)
IADC2
IADC3 }IA
V3P3A V3P3SYS GNDA GNDD
TERIDIAN
71M6543F/
71M6543H
AMR
IR
TX
TEMPERATURE
SENSOR
RAM
COMPUTE
ENGINE
RX
MODUL- RX
ATOR TX
FLASH
MEMORY
POWER FAULT
COMPARATOR
HOST
WAKE-UP
REGULATOR
MPU
RTC
TIMERS
BATTERY
MONITOR
COM0...5
SEG
SEG/DIO
LCD DRIVER
DIO, PULSES
DIO
V3P3D
OSCILLATOR/
PLL
XIN
RTC
BATTERY
LCD DISPLAY
8888.8888
PULSES,
DIO
I2C or µWire
EEPROM
32 kHz
SPI INTERFACE
ICE
*IN = Neutral Current
BATTERY
VBAT
VBAT_RTC
VREF
SERIAL PORTS
PWR MODE
CONTROL
XOUT
9/17/2010
Figure 4: Current Sensors Connected to the 71M6543F/H or 71M6545/H with Three 71M6xx3
3.4
PCB Layout Considerations
To limit emissions and susceptibility to electromagnetic and magnetic fields, the signal wiring between the
shunt resistors and the 71M6xxx should be as short as possible and should consist of tightly twisted pair
cable. Similarly, the PCB traces between the 71M6xxx and the 71M654x should be routed as short as
possible and should be surrounded by grounded copper structures. The trace pairs should be routed as
close to each other as permitted by the PCB manufacturer.
The copper separation (gap) between the shunt side and the 71M654x side of the signal transformer
should be as wide as permitted by the footprint of the transformer, as shown in Figure 5.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
9
PDS_6xxx_010
71M6xxx Data Sheet
Signal traces
Isolation gap
Transformers
Figure 5: Copper Separation and Signal Traces for a Polyphase PCB
3.5
Compatibility with the 71M654x
The 71M6xxx isolated sensor ICs are designed to be operated in conjunction with the 71M654x energymetering ICs. Operation of the 71M6xxx isolated sensor ICs requires a 71M654x IC with CE code
capable of interfacing with the 71M6xxx. CE codes written for operation with CTs do not work with the
71M6xxx.
The 71M6xxx isolated sensor ICs are not arbitrarily interchangeable. Each type of the 71M6xxx must be
matched with its corresponding CE code in the 71M654x per Table 14. A 71M6xxx remote sensor IC
generates unpredictable results when paired with a CE code for a different part number. All 71M6xxx
isolated sensor ICs used in a polyphase system must be of the same part number.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
10
PDS_6xxx_010
71M6xxx Data Sheet
4
SPECIFICATIONS
4.1
Absolute Maximum Ratings
Table 3 shows the absolute maximum ranges for the device. Stresses beyond Absolute Maximum
Ratings may cause permanent damage to the device. These are stress ratings only and functional
operation at these or any other conditions beyond those indicated under recommended operating
conditions (4.3 Recommended Operating Conditions) is not implied. Exposure to absolute maximum
ratings conditions for extended periods may affect device reliability. All voltages are with respect to GND.
Table 3: Absolute Maximum Ratings
SUPPLIES AND GROUND PINS:
VCC
GND
ANALOG INPUT PINS:
-0.5V to 4.6V
-0.1V to +0.1V
-10mA to +10mA,
-0.5V to (VCC + 0.5V)
INP, INN, SP, SN
TEMPERATURE:
Operating Junction Temperature (Peak, 100ms)
+140°C
Operating Junction Temperature (Continuous)
+125°C
Storage Temperature Range
-45°C to +165°C
Soldering Temperature (10s duration)
+250°C
4.2
Recommended External Components
Table 4: Recommended External Components
NAME
FROM
TO
C1
VCC
GND
Bypass capacitor for supply
R1, R2
Sensor
GND
To establish proper bias for INP/INN pins
4.3
FUNCTION
VALUE
UNITS
1.0
µF
1
kΩ
Recommended Operating Conditions
Table 5: Recommended Operating Conditions
PARAMETER
VCC Supply Voltage
Operating Temperature Range
v1.2
CONDITIONS
MIN
2.5
-40
© 2008–2011 Teridian Semiconductor Corporation
TYP
MAX
3.6
UNITS
V
+85
⁰C
11
PDS_6xxx_010
4.4
71M6xxx Data Sheet
Performance Specifications
Unless otherwise specified, all parameters listed in this section are valid over the Recommended
Operating Conditions provided in Table 5.
4.4.1
Supply Current
Table 6: Supply Current Performance Specifications
PARAMETER
CONDITIONS
VCC Current, Normal Operation
4.4.2
MIN
VCC = 3.3V
TYP
MAX
UNITS
0.77
1.05
mA
Power and Data Pulses
Table 7: Timing Specifications for Power and Data Pulses
PARAMETER
CONDITIONS
Normal operation
71M654x (PLL_FAST = 0)
Pulse Frequency
4.4.3
MIN
TYP
1.638
0.5249
MAX
TYP
MAX
UNITS
MHz
VCC Voltage Monitor
Table 8: VCC Voltage Monitor Specifications
PARAMETER
CONDITIONS
MIN
BNOM: Nominal Value, TA = +22°C
VCC = 3.2V
VCC Voltage (Note: This is a definition—
it is not a measured quantity.)
VCC = 3.195 + (BSENSE - 138) x 0.0246 + STEMP x
0.000104
BE: Measurement Error
VCC = 3.195 + (BSENSE - 138) x 0.0246
+ STEMP x 0.000104
VCC = 2.5V
-5
+5
VCC = 2.8V to 3.6V
-5
+5
4.4.4
138
UNITS
LSB
V
%
Temperature Sensor
Table 9: Temperature Sensor Specifications
PARAMETER
TNOM: Nominal Value, TA = +22°C
Temperature Equation for:
71M6601, 71M6603, 71M6103 and
71M6113
(Note: This is a definition—it is not a
measured quantity.)
Temperature Equation for:
71M6201 and 71M6203
(Note: This is a definition—it is not a
measured quantity.)
Temperature Error (Note 1)
TETIME: Duration of Temperature
Measurement
CONDITIONS
VCC = 3.2V
MIN
TYP
870
MAX
2
TEMP = STEMP x 0.33 - STEMP x 3E-5 + 22
ºC
If STEMP < 0:
TEMP = STEMP x 0.33 - STEMP2 x 3E-5 + 22
If STEMP ≥ 0:
TEMP = STEMP x (63 / TRIMBGA) + 22
VCC =
2.8V to
-5
Temperature = 3.6V
-40°C, -10°C,
VCC =
+55°C, +85°C
2.5V to
-6.5
2.79V
VCC = 3.0V
UNITS
LSB
⁰C
+5
ºC
+6.5
15
30
ms
Note 1: Guaranteed by design; not production tested.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
12
PDS_6xxx_010
4.4.5
71M6xxx Data Sheet
VREF Performance Specifications
Table 10 shows the performance specifications for the ADC reference voltage (VREF).
Table 10: VREF Performance Specifications
PARAMETER
CONDITIONS
71M6201, 71M6203,
71M6113: TA = +22°C
VREF Output Voltage
MIN
TYP
MAX
1.193
1.195
1.197
UNITS
V
71M6601, 71M6603,
71M6103: TA = +22°C
1.180
1.195
ILOAD = 10µA, -10µA
on TMUXOUT
VREF Output Impedance
1.210
8
kΩ
VCC = 2.8V to 3.6V
-1.5
+1.5
VCC = 2.5V to 3.6V
-2
+2
VREF Chop Step (Trimmed)
VREF(CROSS = 1) VREF(CROSS = 0)
-22
VNOM Definition
VNOM(T) = VREF(22) + (T - 22)TC1 + (T - 22) TC2
VREF Power-Supply Sensitivity:
ΔVREF/ΔVCC
mV/V
0
+22
2
mV
V
71M6201 AND 71M6203 (0.2% ACCURACY CLASS)
VNOM Temperature Coefficients:
TC1, TC2
VREF(T) Deviation from VNOM(T) (Note 1)
TC1 = 0.0538 x TRIMT + 1.587(TRIMBGB - TRIMBGD) +
27.279
µV/°C
TC2 = -0.433 - TRIMT x 0.000854
µV/°C2
VREF (T ) − VNOM (T ) 10 6
VNOM (T )
62
-15
+15
ppm/°C
71M6113 (0.5% ACCURACY CLASS)
VNOM Temperature Coefficients:
TC1, TC2
VREF(T) Deviation from VNOM(T) (Note 1)
TC1 = 251 - TRIMT x 4.60
µV/°C
TC2 = -0.433 - TRIMT x 0.000854
µV/°C2
VREF (T ) − VNOM (T ) 10 6
VNOM (T )
62
-50
+50
ppm/°C
71M6601, 71M6603, AND 71M6103 (1% ACCURACY CLASS)
VNOM Temperature Coefficients:
TC1, TC2
VREF(T) Deviation from VNOM(T) (Note 1)
TC1 = -34.8
µV/°C
TC2 = -0.599
µV/°C2
VREF (T ) − VNOM (T ) 10 6
VNOM (T )
45
-100
+100
ppm/°C
Note 1: Guaranteed by design; not production tested.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
13
PDS_6xxx_010
4.4.6
71M6xxx Data Sheet
ADC Converter
Table 11: ADC Converter Specifications
PARAMETER
Input Current
THD (First 10 Harmonics)
v1.2
CONDITIONS
INP and INN at INP
GND potential
INN
VIN = 65Hz, 64kpts
FFT, Blackman-Harris
window
MIN
TYP
22
22
-85
© 2008–2011 Teridian Semiconductor Corporation
MAX
UNITS
µA
dB
14
PDS_6xxx_010
4.5
71M6xxx Data Sheet
Typical Performance Data
Wh Polyphase Load Line with 50µΩ Shunts
0.5
0.4
0°
0.3
60°
0.2
300 °
0.1
180°
0
-0.1
-0.2
-0.3
-0.4
-0.5
0.1
1
10
100
Figure 6: Wh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC)
VARh Polyphase Load Line with 150µΩ Shunt
0.5
0.4
0.3
90°
0.2
150°
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
0.1
1
10
100
Figure 7: VARh Error at Room Temperature (71M6203, 100A/0.1A, 60Hz/240V AC)
v1.2
© 2008–2011 Teridian Semiconductor Corporation
15
PDS_6xxx_010
4.6
71M6xxx Data Sheet
Package Outline Drawing
Controlling dimensions are in mm.
10
9
2.465
5.99
+0.21
-0.05
1.97
0.41
+0.08
-0.06
1.47
+0.08
-0.07
SEE
DETAIL A
4
SIDE VIEW
3
0.15
+0.1 0.023
SEATING
PLANE
0.64
+0.25 5
-0.23
DETAIL A
0.33
±0.08
x 45°
8
1.63 +0.10 -0.08
4.93 -0.13
+0.05
5°
+3°
-5°
COO
BOTTOM VIEW
TOP VIEW
1.27 BSC
PARTING
LINE
3.94 4
+0.05
-0.13
END VIEW
0.20
+0.05
-0.01
NOTES:
3
4
REFERENCE DATUM
LENGTH AND WIDTH ARE REFERENCE DATUMS AND DO NOT
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT INCLUDE MOLD
MISMATCH. MEASURED AT THE MOLD PARTING LINE.
PROTRUSIONS DO NOT EXCEED 0.1524 mm AT END AND 0.254
mm AT WINDOW.
5
LENGTH OF TERMINAL FOR SOLDERING TO SUBSTRATE
8
FORMED LEADS ARE PLANAR WITH RESPECT TO EACH OTHER
WITHIN 0.735 mm AT SEATING PLANE.
9
THE APPEARANCE OF PIN #1 I.D. IS OPTIONAL.
10
COUNTRY OF ORIGIN LOCATION ON PACKAGE BOTTOM IS
OPTIONAL AND DEPENDS ON ASSEMBLY LOCATION.
PACKAGE IS COMPLIANT WITH JEDEC STANDARD MS-012.
DIMENSIONING AND TOLERANCES PER ANSI Y14.5 M - 1982
Figure 8: SOIC-8 Package Outline
v1.2
© 2008–2011 Teridian Semiconductor Corporation
16
PDS_6xxx_010
4.7
71M6xxx Data Sheet
IC Pinout
1
2
3
4
VCC
TEST
SP
INN
SN
INP
GND
NC
8
7
6
5
Figure 9: Pinout for 8-Pin SO Package
4.8
Pin Description
Table 12: Pin Description
v1.2
Pin
1
Name
VCC
2
SP
3
SN
4
GND
5
NC
6
INP
7
INN
8
TEST
Function
Supply Voltage Output. A 1.0µF capacitor to GND should be provided.
Positive Bidirectional Communication Port for the Connection of the Pulse
Transformer
Negative Bidirectional Communication Port for the Connection of the Pulse
Transformer
Ground (Local Ground). The voltage at the INP and INN pins references to
this pin.
No Connection. No connections must be made to this pin.
Positive Analog Input from Sensor. This input must be biased towards
GND with a 1kΩ resistor.
Negative Analog Input from Sensor. This input must be biased towards
GND with a 1kΩ resistor.
Input Used in Factory for Test Purposes. This pin must be connected to
GND.
© 2008–2011 Teridian Semiconductor Corporation
17
PDS_6xxx_010
5
71M6xxx Data Sheet
ORDERING INFORMATION
Table 13: Product Variations
Part
Application
71M6601
1-phase
71M6603
3-phase
71M6103
3-phase
71M6113
3-phase
71M6201
1-phase
71M6203
3-phase
Rated Current
(A)
Max Input
Voltage at
INP-INN Pins
(mV)
60
44
100
19.6
200
12.6
Temp Range
(°C)
Recommended
Typ Operating
Meter Accuracy
Temp Range
Class
(°C)
(%)
-20 to +60
Max Shunt
Resistance
(µΩ)
1
736
1
-40 to +85
-20 to +60
-40 to +85
0.5
0.2
196
63
Table 14: Packaging Information, Corresponding CE Codes, and Ordering Numbers
Part
71M6601
Packaging
bulk
71M6601
71M6603
tape and reel
71M6603
71M6103
tape and reel
71M6103
71M6113
tape and reel
71M6113
tape and reel
71M654x CE Code
EQU0-60
bulk
EQU5-60
bulk
EQU5-100
bulk
EQU5-100
71M6201* bulk
71M6201* tape and reel
EQU1-200, EQU2-200
71M6203* bulk
71M6203* tape and reel
EQU5-200
Ordering Number
71M6601-IL/F
71M6601-ILR/F
71M6603-IL/F
71M6603-ILR/F
71M6103-IL/F
71M6103-ILR/F
71M6113-IL/F
71M6113-ILR/F
71M6201-IL/F
71M6201-ILR/F
71M6203-IL/F
71M6203-ILR/F
Note: All devices are lead(Pb)-free/RoHS-compliant packages.
*Future product—contact factory for availability.
6
RELATED INFORMATION
The following documents related to the 71M6xxx are available from Teridian:
71M6543F/H Data Sheet
71M6541D/F-71M6542F Data Sheet
71M6545/H Data Sheet
7
CONTACT INFORMATION
For technical support or more information about Maxim products, contact technical support at
www.maxim-ic.com/support.
v1.2
© 2008–2011 Teridian Semiconductor Corporation
18
PDS_6xxx_010
71M6xxx Data Sheet
REVISION HISTORY
REVISION
NUMBER
1.0
REVISION
DATE
12/10
1.1
3/11
1.2
6/11
DESCRIPTION
Initial release
Figure 1, page 4 (transformer turns ratio 1:1.1)
Table 9, page 12
Table 14, page 18
Removed future status from the 71M6113 parts in
Table 14
PAGES
CHANGED
—
4, 12, 18
18
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit
patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
 2011 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products.