data sheet CERAMIC / HERMETIC CMCM Ceramic Multi-Chip Module Package (CMCM) The MCM/CBGA and MCM/PBGA by Amkor Technology incorporates the latest technology in high-density Ceramic and Plastic IC packaging. The high-speed performance and thermal advantages of the CBGA and PBGA package provide the platform for increased enhancement for mixed semiconductor technologies such as: Analog/Digital, bipolar/CMOS, ASIC, DSP, etc. in a single IC package. Features: The MCM-CBGA offer a variety of features: • • • • • • • • • • • Improved thermal performance Superior electrical performance Controlled impedance Very low design and tooling cost Electroless Au (gold) plating process Standard and custom ball counts available Eutectic solder balls Flexible circuit designs Advanced in-house design capability Versatile substrate routing Choice of package body sizes Applications: This MCM technology allows existing and presently available ICs to be designed in a single, space-saving, low-cost system package. MCM-CBGAs and MCM-PBGAs provide the features required by laptops, portables, sub-notebooks, telecomm, wireless, PC cards and other applications. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS804 Rev Date: 08’02