PD - 95387
IRLL014PbF
HEXFET® Power MOSFET
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Surface Mount
Available in Tape & Reel
Dynamic dv/dt Rating
Logic-Level Gate Drive
RDS(on) Specified at VGS=4V & 5V
Fast Switching
Ease of Paralleling
Lead-Free
D
VDSS = 60V
RDS(on) = 0.20Ω
G
ID = 2.7A
S
Description
Third Generation HEXFETs from International Rectifier
provide the designer with the best combination of fast
switching, ruggedized device design, low on-resistance
and cost-effectiveness.
The SOT-223 package is designed for surface-mount using
vapor phase, infra red, or wave soldering techniques. Its
unique package design allows for easy automatic pick-andplace as with other SOT or SOIC packages but has the
added advantage of improved thermal performance due to
an enlarged tab for heatsinking. Power dissipation of
grreater than 1.25W is possible in a typical surface mount
application.
SOT-223
Absolute Maximum Ratings
Parameter
ID @ Tc = 25°C
ID @ Tc = 100°C
IDM
PD @Tc = 25°C
PD @TA = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ, TSTG
Max.
Continuous Drain Current, VGS @ 10 V
Continuous Drain Current, VGS @ 10 V
Pulsed Drain Current
Power Dissipation
Power Dissipation (PCB Mount)**
Linear Derating Factor
Linear Derating Factor (PCB Mount)**
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Soldewring Temperature, for 10 seconds
Units
2.7
1.7
22
3.1
2.0
0.025
0.017
-/+10
100
2.7
0.31
4.5
-55 to + 150
A
W
W/°C
V
mJ
A
mJ
V/ns
300 (1.6mm from case)
°C
Thermal Resistance
Parameter
RθJC
RθJA
Junction-to-PCB
Junction-to-Ambient. (PCB Mount)**
Typ.
Max.
–––
–––
40
60
Units
°C/W
** When mounted on 1'' SQUARE pcb (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994.
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IRLL014PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
∆V(BR)DSS/∆TJ
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Min.
60
–––
–––
–––
1.0
3.2
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
––
LD
Internal Drain Inductance
–––
4.0
–––
LS
Internal Source Inductance
–––
6.0
–––
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
400
170
42
–––
–––
–––
V(BR)DSS
Typ.
–––
0.073
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
9.3
110
17
26
Max. Units
Conditions
–––
V
VGS = 0V, I D = 250µA
––– V/°C Reference to 25°C, ID = 1mA
0.20
VGS = 5.0V, I D = 1.6A
0.28
Ω
VGS = 4.0V, ID = 1.4A
2.0
V
VDS = VGS, ID = 250µA
–––
S
VDS = 25V, ID = 1.6 A
25
VDS = 60V, VGS = 0V
µA
250
VDS = 48V, VGS = 0V, TJ = 125°C
100
VGS = 10V
nA
-100
VGS = -10V
8.4
ID = 10A
3.5
nC
VDS = 48V
6.0
VGS = 5.0V, See Fig. 6 and 13
–––
VDD = 30V
–––
ID = 10A
ns
–––
RG = 12 Ω
–––
RD = 2.8 Ω, See Fig. 10
nH
Between lead, 6mm(0.25in)
from package and center
of die contact.
D
G
S
pF
VGS = 0V
VDS = 25V
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
IS
ISM
VSD
trr
Qrr
ton
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
2.7
showing the
A
integral reverse
22
p-n junction diode.
––– ––– 1.6
V
TJ = 25°C, IS = 2.7A, VGS = 0V
––– 65 130
ns
TJ = 25°C, IF = 10A
––– 0.33 0.65
µC
di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
VDD=25V, starting TJ = 25°C, L =16 mH
RG = 25Ω, IAS = 2.7A. (See Figure 12)
2
ISD ≤ 10A, di/dt ≤ 90A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
Pulse width ≤ 300µs; duty cycle ≤ 2%.
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IRLL014PbF
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IRLL014PbF
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IRLL014PbF
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IRLL014PbF
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IRLL014PbF
SOT-223 (TO-261AA) Package Outline
Dimensions are shown in milimeters (inches)
SOT-223 (TO-261AA) Part Marking Information
HEXFET PRODUCT MARKING
T HIS IS AN IRFL014
PART NUMBER
INT ERNAT IONAL
RECT IFIER
LOGO
F L014
314P
T OP
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LOT CODE
AXXXX
A = AS S EMBLY S IT E
DAT E CODE
CODE
(YYWW)
YY = YEAR
WW = WEEK
P = DES IGNAT ES LEAD-FREE
PRODUCT (OPT IONAL)
BOT T OM
7
IRLL014PbF
SOT-223 (TO-261AA) Tape & Reel Information
Dimensions are shown in milimeters (inches)
2.05 (.080)
1.95 (.077)
TR
4.10 (.161)
3.90 (.154)
0.35 (.013)
0.25 (.010)
1.85 (.072)
1.65 (.065)
7.55 (.297)
7.45 (.294)
16.30 (.641)
15.70 (.619)
7.60 (.299)
7.40 (.292)
1.60 (.062)
1.50 (.059)
TYP.
FEED DIRECTION
12.10 (.475)
11.90 (.469)
2.30 (.090)
2.10 (.083)
7.10 (.279)
6.90 (.272)
NOTES :
1. CONTROLLING DIMENSION: MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
3. EACH O330.00 (13.00) REEL CONTAINS 2,500 DEVICES.
13.20 (.519)
12.80 (.504)
15.40 (.607)
11.90 (.469)
4
330.00
(13.000)
MAX.
NOTES :
1. OUTLINE COMFORMS TO EIA-418-1.
2. CONTROLLING DIMENSION: MILLIMETER..
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
50.00 (1.969)
MIN.
18.40 (.724)
MAX.
14.40 (.566)
12.40 (.488)
4
3
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 06/04
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