MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre ST SMA FC SC PT Note: The rated Responsivity applies to all options. Description The very high speed and low capacitance of this GaAs PIN Photodiode makes it ideal for datacom and general purpose applications. Its double-lens optical system collects power from fibers with up to 100mm without loss in responsivity and a reverse voltage of only 3.3 Volts makes interfacing to a preamplifier easy. TO-46 Package with Lens Optical and Electrical Characteristics - Case Temperature -40 to +85˚C Parameter Symbol Min. Typ. Max. Unit Responsivity (Fig. 1 & 2) (Table 1) R 0.35 0.45 A/W VR=3.3V, 5V λ=850nm Bandwidth ƒc 1.5 GHz VR=3.3V, 5V RL=50Ω Capacitance (Fig. 4) C 0.8 pF VR=3.3V, 5V, f=1MHz Dark Current Id nA VR=3.3V, 5V 0.4 Test Condition Fiber: 62.5/ 125µm Graded Index NA=0.275 Ø4.7 Ø1.5 0.6 CATHODE 3.7 14 2.5 0.4 5.4 BOTTOM VIEW The diode chip is isolated from the case All dimensions in mm CASE ANODE 1 MF446 Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125˚C Operating Temperature Top -40 to +85˚C Reverse Voltage VR 30V Soldering Temperature (2mm from the case for 10 sec) Tsld 260˚C Thermal Characteristics Parameter Symbol Temp. Coefficient - Dark Current Min. Typ. d1/dTj Max. 5 Unit %/˚C Typical Responsivity Core Diameter/Cladding Diameter Numberical Aperture 10/125 µm 0.11 50/125 µm 0.20 62.5/125 µm 0.275 0.45 A/W 0.45 A/W 0.45 A/W % 100 80 80 RELATIVE RESPONSIVITY RELATIVE RESPONSIVITY % 100 60 40 r r = opt. Øc = 62.5µm 20 60 40 r z = opt. Øc = 62.5µm 20 z z 0 0 0.5 1.0 2.0 1.5 2.5 3.0 mm 0 z - AXIAL DISPLACEMENT OF FIBER Figure 1 80 120 µm pF % 2.0 CAPACITANCE RELATIVE RESPONSIVITY 60 40 Figure 2 100 50 1.0 0 0 600 700 80 0 WAVELENGTH Figure 3 2 20 r - RADIAL DISPLACEMENT OF FIBER 900 1000 nm 0 5 REVERSE VOLTAGE Figure 4 10 V BOTTOM VIEW ( 10 : 1 ) SIDE VIEW 13,46`0,76 3,8 2,54 0,6 0,03 (3x) n0,45 + - 0,05 (3x) n1,17 + - 0,04 n4,7 0 R2,7 45° R0,2 max (4x) 0,3 max glass overmould (2x) R0,4 max 2` 0, 3 3, 6 1, 0 Lens n1.5`0.05 NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm. Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN JS004 076R1 A DATE 22-MAR-03 APPRD. TD/BE Previous package codes TB Drawing type Package drawing, TO-46 with lens Title JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. 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