BOARD-TO-BOARD/WIRE-TO-BOARD CONNECTORS 1.25mm Wire-To-Board System DESCRIPTION FCI’s 1.25mm pitch wire-to-board connector series is designed for a wide variety of applications in Industrial, Automotive and Consumer. The range consists of terminals, crimp housings and PCB headers in straight and right angle, surface mount and through mount configurations. It is a single row design, available with from 2 to 15 circuits. A crimping application tool is also available for wire harness assembly. Unlike many other products for the same applications, FCI’s 1.25mm wire-to-board range conforms to the EU Industry Safety Standard, PCB header material meets halogen free requirements and the products can be operated in the temperature range from -40℃ to +105℃. FEATURES & BENEFITS TARGET MARKETS & APPLICATIONS Operating temperature: -40°C to +105°C Plating options：gold flash or tin Circuits: #2~#15 positions available, extension up to 20 positions Current rating: 1 Amp Polarized Mating Geometry: crimping housing is polarized to prevent mis-mating with PCB header Friction lock: crimping housing is equipped with friction locks to secure retention force with PCB header PCB header material (resin) meets halogen free requirement Housing meets EU Industry Safety Standard RoHS compliance and UL approved Tape and reel packaging befits pick and place of SMT production process. www.fciconnect.com 1.25mm Wire-To-Board System TECHNICAL INFORMATION MATERIALS ENVIRONMENTAL ELECTRICAL PERFORMANCE Contact Resistance: 20mΩ (maximum) Insulation Resistance: 100MΩ (minimum) Voltage Rating: 125 Volts AC,DC Current Rating: 1 Amp (0.8 A --32 AWG) Dielectric Withstand Voltage: 500 VAC/minute APPROVALS AND CERTIFICATIONS RoHS conforms to EU Directive 2002/95/EC UL approval Housing connector conforms to IEC 60695-2 Industry Safety Standard (Glow Wire test) PACKAGING PCB Header: tape and reel Crimping Housing: bag Terminal: reel Resistance to Reflow Soldering Heat: • Pre-heat: 150°C to 180°C, 60 - 90 seconds • Heat: 230°C minimum, 40 seconds minimum • Peak temperature: 260°C maximum, 10seconds maximum Resistance to Hand Soldering Heat: • Soldering iron: 350±10°C • Duration: 3 - 4 seconds minimum Thermal shock (temperature cycling): conforms to EIA-364-32A Humidity (temperature cycling): conforms to EIA-361-31A Temperature life (heat aging): conforms to EIA-361-17A, 105°C for 96 hours Salt spray: conforms to EIA-364-26B Solderability: solderable area to have minimum 95% solder coverage MECHANICAL PERFORMANCES Mating & un-mating force: conforms to EIA-364-13 Contact retention force: 0.5Kgf (minimum) Hold down/Housing retention force: 1.0Kgf (minimum) Wire retention force: 0.5Kgf (minimum) Terminal/ Housing retention force: 0.5Kgf (minimum) Vibration: 1µs (maximum), EIA-364-28 Condition I Shock: 1µs (maximum), EIA-364-27A Durability: 30 cycles SPECIFICATIONS ELXWTBSY0711EA4 Product Spec.: GS-12-675 Packaging Spec.: GS-14-1592; GS-14-1593 PART NUMBERS 101148XX-X X X XX LF 28 = SMT vertical header 29 = Through hole vertical header 30 = SMT right angle header 31 = Through hole right angle header Lead Free Total number of positions (2 to 15) Packing 1 = tape and reel Resin Material 1 = LCP Plating 0 = tin 1= gold flash 101148XX-00X 101148XX-X 0 X XX LF 26 = housing Resin Material 0 = PA66 Lead Free Total number of positions (2 to 15) Packing Printed on recyclable paper Contact: copper alloy Plating: matt tin or gold flash over nickel Housing: Thermoplastic or Thermoplastic high temperature, UL94V-0 Metal hold down: copper alloy Plating: matt tin 27 = Terminal 0 = Bulk Plating 1 = Matt Tin 2 = Gold Flash www.fciconnect.com/electronics For more information, please contact: [email protected]