ORISTER RS103P

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RS103
Dual Operational Amplifier and
Voltage Reference
8-Lead Plastic DIP-8
Package Code: P
Description
The RS103 is a monolithic IC that includes one independent op-amp and another
op-amp for which the non inverting input is wired to a 2.5V fixed Voltage
Reference. This device is offering space and cost saving in many applications like
power supply management or data acquisition systems.
•
8-Lead Plastic SOP-8
Package Code: S
Operational Amplifier
• Low input offset voltage: 0.5mV typ.
• Low supply current: 350mA/op. (@ VCC = 5V)
• Medium bandwidth (unity gain): 0.9MHz
• Large output voltage swing: 0V to (VCC - 1.5V)
• Input common mode voltage range includes ground
• Wide power supply range: 3 to 32V ±1.5 to ±16V
Operational Amplifier
• Fixed output voltage reference 2.5V
• 0.5% and 1% voltage precision
• Sink current capability: 1 to 100mA
• Typical output impedance: 0.2Ω
Pin Configurations
DS-RS103-01
Nov, 2007
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Page No. : 2/2
Absolute Maximum Ratings
Symbol
Parameter
Range
Units
VCC
Power Supply Voltage
36
V
VID
Input Differential Voltage Range
36
V
VI
Input Voltage Range
TJ
-0.3 to +36
Maximum Junction Temperature
TOPER
150
Operating Free-air Temperature Range
C
-55 to +125
°C
175
°C/W
Thermal Resistance Junction to Ambient (SO package)
Rthja
V
o
Electrical Characteristics
Symbol
ICC
Parameter
Power Supply Current
Test Conditions
RS103
Unit
Min
Typ
Max
VCC=30V, Ta=Thigh to Tlow
-
1
2
mA
VCC=5V, Ta=Thigh to Tlow
-
0.6
1.2
mA
Operator 2 (independent op-amp)
VCC = +5V, VCC = Ground, Vo = 1.4V, Tamb = 25°C (unless otherwise specified)
Symbol
Parameter
Test Conditions
RS103
Min
Typ
Max
Unit
-
2
7
mV
Input Offset Voltage Drift
Tamb = 25°C
Tmin. ≤ Tamb ≤ Tmax.
---
-
7
-
uV/oC
IIO
Input Offset Current
Tmin. ≤ Tamb ≤ Tmax.
-
-
30
nA
IIB
Input Bias Current
-
35
200
nA
25
100
-
V/mV
65
100
-
dB
65
85
-
dB
-
-
VCC-2V
V
VCC=30V, RL=2KΩ
26
27
-
VCC=30V, RL=10KΩ
27
28
-
-
5
20
mV
VIO
DVIO
Input Offset Voltage
AVD
Large Signal Voltage Gain
SVR
Supply Voltage Rejection Ratio
Tmin. ≤ Tamb ≤ Tmax
VCC = 15V, RL = 2k, Vo = 1.4V to
11.4V. Tmin. ≤ Tamb ≤ Tmax.
VCC = 5V to 30V
CMR
Common-Mode Rejection Ratio
Tmin. ≤ Tamb ≤ Tmax.
VICR
Input Common Mode Voltage
Range
VCC = +30V - see note 1)
Tmin. ≤ Tamb ≤ Tmax.
VOH
Output Voltage (High Limit)
VOL
Output Voltage (Low Limit)
RL=10KΩ
Output Source Current
VCC = +15V, Vo = 2V, Vid = +1V
20
40
-
mA
ISink
Output Sink Current
VCC = +15V, Vo = 2V, Vid = -1V
10
20
-
mA
ISC
Output Short Circuit to Ground
-
40
60
mA
SR
Slew Rate at Unity Gain
0.2
0.4
-
V/us
GBP
Gain Bandwidth Product
0.5
0.9
-
MHz
THD
Total Harmonic Distortion
VCC=15V
Vi = 0.5 to 3V, VCC = 15V
RL = 2k, CL = 100pF, unity gain
VCC = 30V,RL = 2k, CL = 100pF
= 100kHz, Vin = 10mV
f = 1kHz
AV = 20dB,RL = 2k, VCC = 30V
CL = 100pF, Vo = 2Vpp
-
0.02
-
%
ISource
V
1. The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V. The
upper end of the common-mode voltage range is VCC + - 1.5V. But either of both inputs can go to +36V without damage.
DS-RS103-01
Nov, 2007
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Page No. : 3/3
Operator 1 (op-amp with non-inverting input connected to the internal Vref)
VCC+ = +5V, VCC- = Ground, Tamb = 25°C (unless otherwise specified)
Symbol
VIO
Parameter
Input Offset Voltage
DVIO
Input Offset Voltage Drift
IIB
Input Bias Current
Test Conditions
Tamb = 25°C
Tmin. ≤ Tamb ≤ Tmax.
--Tmin. ≤ Tamb ≤ Tmax
Vicm = 0V
VCC = 15V, RL = 2k
Vicm = 0V
VCC+ = 5V to 30V
RS103
Unit
Min
Typ
Max
-
2
7
mV
-
7
-
uV/oC
-
20
-
nA
-
100
-
V/mV
65
100
-
dB
27
28
-
V
-
5
20
mV
AVD
Large Signal Voltage Gain
SVR
Supply Voltage Rejection Ratio
VOH
Output Voltage (High Limit)
VCC=30V, RL=10KΩ
VOL
Output Voltage (Low Limit)
RL=10KΩ
Output Source Current
VCC = +15V, Vo = 2V, Vid = +1V
20
40
-
mA
ISink
Output Sink Current
VCC = +15V, Vo = 2V, Vid = -1V
10
20
-
mA
ISC
Output Short Circuit to Ground
-
40
60
mA
SR
Slew Rate at Unity Gain
0.2
0.4
-
V/us
GBP
Gain Bandwidth Product
0.5
0.9
-
MHz
THD
Total Harmonic Distortion
VCC=15V
Vi = 0.5 to 2V, VCC = 15V
RL = 2k, CL = 100pF, unity gain
VCC = 30V,RL = 2k, CL = 100pF
= 100kHz, Vin = 10mV
f = 1kHz
AV = 20dB,RL = 2k, VCC = 30V
CL = 100pF, Vo = 2Vpp
-
0.02
-
%
ISource
Voltage Reference
Symbol
Parameter
Cathode Current
IK
Symbol
VREF
ΔVREF
Imin
|ZKA|
Parameter
Reference Input Voltage
Reference Input Voltage Deviation Over
Temperature Range
Minimum Cathode Current for Regulation
Dynamic Impedance - note 1)
Test Conditions
Tamb = 25°C
Tmin. ≤ Tamb ≤ Tmax.
VKA = Vref; Ik = 10mA
Tmin. ≤ Tamb ≤ Tmax.
VKA = VREF
VKA = VREF, ΔIK = 1 to
100mA, f < 1kHz
Value
Units
1 to 100
mA
RS103
Unit
Min
Typ
Max
2.48
2.5
2.52
V
-
7
30
mV
-
0.5
1
mA
-
0.2
0.5
Ω
1. The dynamic impedance is defined as [ZKA| = ΔVKA/ΔIK
DS-RS103-01
Nov, 2007
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Page No. : 4/4
Operational Amplifiers
DS-RS103-01
Nov, 2007
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Page No. : 5/5
DS-RS103-01
Nov, 2007
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DS-RS103-01
Nov, 2007
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DIP-8 Dimension
Marking:
8
6
7
5
RS
1 0 3
A
1
2
3
4
Pin 1 Index
Date Code
B
F
E
M
H
D
I
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
α1 K
G
Control Code
Note: Green label is used for pb-free packing
J
C
P
DIM
Min.
Max.
A
6.29
6.40
B
9.22
9.32
C
-
*1.52
D
-
*1.27
E
-
*0.99
F
3.25
3.35
G
3.17
3.55
H
0.38
0.53
I
2.28
2.79
J
7.49
7.74
K
-
*3.00
L
8.56
8.81
M
0.229
o
94
0.381
o
97
α1
L
*: Typical, Unit: mm
8-Lead DIP-8
Plastic Package
Package Code: P
SOP-8 Dimension
A
7
8
B
6
3
RS
1 0 3
I
5
C
Pin1 Index
2
Marking:
G
Pin 1 Index
Date Code
H
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
K
E
Part A
Part A
Control Code
Note: Green label is used for pb-free packing
4
J
D
S
M
L
N
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Min.
4.85
3.85
5.80
1.22
0.37
3.74
1.45
4.80
0.05
0.30
0.19
0.37
0.23
0.08
0.00
Max.
5.10
3.95
6.20
1.32
0.47
3.88
1.65
5.10
0.20
0.70
0.25
0.52
0.28
0.13
0.15
*: Typical, Unit: mm
O
F
8-Lead SOP-8 Plastic
Surface Mounted Package
Package Code: S
Ordering Information
PART NUMBER
RS103P
RS103S
DS-RS103-01
Nov, 2007
PIN-PACKAGE
DIP-8
SOP-8
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Page No. : 8/8
Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
<3oC/sec
<3oC/sec
100oC
150oC
60~120 sec
150oC
200oC
60~180 sec
<3oC/sec
<3oC/sec
Time maintained above:
- Temperature (TL)
- Time (tL)
183oC
60~150 sec
217oC
60~150 sec
Peak Temperature (TP)
240oC +0/-5oC
260oC +0/-5oC
Time within 5oC of actual Peak
Temperature (tP)
10~30 sec
20~40 sec
Ramp-down Rate
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
Peak temperature
Dipping time
245 C ±5 C
5sec ±1sec
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time 25oC to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
o
Pb devices.
Pb-Free devices.
DS-RS103-01
Nov, 2007
o
o
o
260 C +0/-5 C
5sec ±1sec
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Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of Orister Corporation.
• Orister Corporation reserves the right to make changes to its products without notice.
• Orister Corporation products are not warranted to be suitable for use in Life-Support Applications, or systems.
• Orister Corporation assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DS-RS103-01
Nov, 2007
www.Orister.com