DATA SHEET BAV301~BAV303 HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODES 100 to 200 Volts VOLTAGE POWER 300 mWatts MICRO-MELF Unit : inch (mm) FEATURES .049(1.25) .047(1.2)DIA. • Fast switching Speed. • Surface Mount Package Ideally Suited For Automatic Insertion. • Silicon Epitaxal Planar Construction. MECHANICAL DATA • Case: Micro Melf, Glass • Terminals: Solderable per MIL-STD-202E, Method 208 • Polarity: Cathode Band • Marking: Cathode Band Only • Weight: 0.01 grams • Packing information .043(1.1) .008(0.2) .008(0.2) .079(2.0) .071(1.8) T/R - 2.5K per 7" plastic Reel MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ =25°C unless otherwise noted) PARAMETER SYMBOL BAV301 BAV302 BAV303 UNITS Reverse Voltage VR 100 150 200 V Peak Reverse Voltage VRM 120 200 250 V Rectified Current (Average), Half Wave Rectification with Resistive Load and f >=50 Hz IO 200 mA Peak Forward Surge Current, t=1.0s IFSM 1.0 A Power Dissipation Derate Above at 25O C PD 300 mW Maximum Forward Voltage, IF = 100mA VF 1.0 V Maximum DC Reverse Current at Rated DC Blocking Voltage TJ= 25O C IR 0.1 uA Typical Junction Capacitance( Note 1) CJ 0.95 pF Maximum Reverse Recovery (Note 2) TRR 75 ns Maximum Thermal Resistance RθJA 350 Operation Junction Storage Temperature Range TSTG -65 TO +175 O C/W O C NOTE: 1. CJ at VR=0, f=1MHZ 2. From IF=10mA to IR=-1mA, VR=6Volts, RL=100Ω STAD-JAN.27.2004 PAGE . 1 RATING AND CHARACTERISTIC CURVES 1.1 CAPACITANCE, pF FORWARD CURRENT, mA 100 10 O -25 C O 25 C 1.0 O 75 C O T A =125 C 0.9 0.8 0.7 0.6 0.2 0 1.0 .4 .8 1.2 1.6 0 1 2 3 4 5 REVERSE VOLTAGE, VOLTS FORWARD VOLTAGE, VOLTS F i g . 1 FORWARD CHARACTERISTICS Fig.2 TYPICAL CAPACITANCE vs REVERSE VOLATGE SURGE CURRENT, A 14 12 10 8 6 4 2 0 0 1 10 100 1000 PULSE WIDTH, ms Fig. SURGE CURRENT CHARACTERISTIC STAD-JAN.27.2004 PAGE . 2