CY23S08 3.3V Zero Delay Buffer Features ■ Zero input-output propagation delay, adjustable by capacitive load on FBK input ■ Multiple configurations, see Table 3 on page 3 ■ Multiple low-skew outputs ❐ 45 ps typical output-output skew(–1) ❐ Two banks of four outputs, three-stateable by two select inputs ■ 10 MHz to 133 MHz operating range ■ 65 ps typical cycle-cycle jitter (–1, –1H) ■ Advanced 0.65μ CMOS technology ■ Space saving 16-pin 150-mil SOIC/TSSOP packages ■ 3.3V operation ■ Spread Aware™ The CY23S08 has two banks of four outputs each, which can be controlled by the Select inputs as shown in Table 2 on page 3. If all output clocks are not required, Bank B can be three-stated. The select inputs also allow the input clock to be directly applied to the output for chip and system testing purposes. The CY23S08 PLL enters a power down state when there are no rising edges on the REF input. In this mode, all outputs are three-stated and the PLL is turned off, resulting in less than 50 μA of current draw. The PLL shuts down in two additional cases as shown in Table 2 on page 3. Multiple CY23S08 devices can accept the same input clock and distribute it in a system. In this case, the skew between the outputs of two devices is guaranteed to be less than 700 ps. The CY23S08 is available in five different configurations, as shown in Table 3 on page 3. The CY23S08–1 is the base part, where the output frequencies equal the reference if there is no counter in the feedback path. The CY23S08–1H is the high-drive version of the –1, and rise and fall times on this device are much faster. The CY23S08–2 enables the user to obtain 2X and 1X frequencies on each output bank. The exact configuration and output frequencies depends on which output drives the feedback pin. The CY23S08–2H is the high-drive version of the –2, and rise and fall times on this device are much faster. Functional Description The CY23S08 is a 3.3V zero delay buffer designed to distribute high speed clocks in PC, workstation, datacom, telecom, and other high performance applications. The CY23S08–3 enables the user to obtain 4X and 2X frequencies on the outputs. The part has an on-chip PLL which locks to an input clock presented on the REF pin. The PLL feedback must be driven into the FBK pin, and can be obtained from one of the outputs. The input-to-output propagation delay is guaranteed to be less than 350 ps, and output-to-output skew is guaranteed to be less than 250 ps. The CY23S08–4 enables the user to obtain 2X clocks on all outputs. Thus, the part is extremely versatile, and can be used in a variety of applications. Logic Block Diagram /2 FBK PLL REF MUX CLKA1 CLKA2 Extra Divider (–3, –4) CLKA3 CLKA4 S2 Select Input Decoding S1 /2 CLKB1 CLKB2 CLKB3 Extra Divider (–2, –2H, –3) Cypress Semiconductor Corporation Document #: 38-07265 Rev. *G • 198 Champion Court CLKB4 • San Jose, CA 95134-1709 • 408-943-2600 Revised September 05, 2007 [+] Feedback CY23S08 Pinouts Figure 1. Pin Diagram - 16 Pin SOIC Package Top View REF CLKA1 1 16 2 15 CLKA2 VDD 3 GND CLKB1 CLKB2 S2 5 12 6 11 7 10 8 9 4 Table 1. Pin Definition - 16 Pin SOIC Package Pin Signal 14 SOIC 13 FBK CLKA4 CLKA3 VDD GND CLKB4 CLKB3 S1 Description 1 REF[2] Input reference frequency, 5V tolerant input 2 CLKA1[3] Clock output, Bank A 3 CLKA2[3] Clock output, Bank A 4 VDD 3.3V supply 5 GND Ground 6 CLKB1[3] Clock output, Bank B 7 CLKB2[3] Clock output, Bank B 8 S2[4] Select input, bit 2 9 S1[4] Select input, bit 1 10 CLKB3[3] Clock output, Bank B 11 CLKB4[3] Clock output, Bank B 12 GND Ground 13 VDD 3.3V supply 14 CLKA3[3] Clock output, Bank A 15 CLKA4[3] Clock output, Bank A 16 FBK PLL feedback input Notes 1. Output phase is indeterminant (0° or 180° from input clock). If phase integrity is required, use the CY23S08–2. 2. Weak pull down. 3. Weak pull down on all outputs. 4. Weak pull ups on these inputs. Document #: 38-07265 Rev. *G Page 2 of 10 [+] Feedback CY23S08 Table 2. Select Input Decoding S2 S1 CLOCK A1–A4 CLOCK B1–B4 Output Source PLL Shutdown 0 0 Three-State Three-State PLL Y 0 1 Driven Three-State PLL N 1 0 Driven Driven Reference Y 1 1 Driven Driven PLL N Table 3. Available CY23S08 Configurations Device Feedback From Bank A Frequency Bank B Frequency CY23S08–1 Bank A or Bank B Reference Reference CY23S08–1H Bank A or Bank B Reference Reference CY23S08–2 Bank A Reference Reference/2 CY23S08–2H Bank A Reference Reference/2 CY23S08–2 Bank B 2 X Reference Reference CY23S08–2H Bank B 2 X Reference Reference CY23S08–3 Bank A 2 X Reference Reference or Reference[1] CY23S08–3 Bank B 4 X Reference 2 X Reference CY23S08–4 Bank A or Bank B 2 X Reference 2 X Reference Spread Aware Many systems being designed now utilize a technology called Spread Spectrum Frequency Timing Generation. Cypress has been one of the pioneers of SSFTG development, and we designed this product so as not to filter off the Spread Spectrum feature of the Reference input, assuming it exists. When a zero delay buffer is not designed to pass the SS feature through, the result is a significant amount of tracking skew which may cause problems in systems requiring synchronization. For more details on Spread Spectrum timing technology, please see Cypress’s application note EMI Suppression Techniques with Spread Spectrum Frequency Timing Generator (SSFTG) ICs. Document #: 38-07265 Rev. *G Page 3 of 10 [+] Feedback CY23S08 Maximum Ratings Supply Voltage to Ground Potential................–0.5V to +7.0V Max. Soldering Temperature (10 sec.) ....................... 260°C DC Input Voltage (Except Ref) .............. –0.5V to VDD + 0.5V Junction Temperature ................................................. 150°C DC Input Voltage REF ........................................... –0.5 to 7V Static Discharge Voltage (per MIL-STD-883, Method 3015) ............................. >2000V Storage Temperature ................................. –65°C to +150°C Operating Conditions for CY23S08SC-XX Commercial Temperature Devices Parameter[5] Description Min Max Unit 3.0 3.6 V 0 70 °C VDD Supply Voltage TA Operating Temperature (Ambient Temperature) CL Load Capacitance, below 100 MHz — 30 pF Load Capacitance, from 100 MHz to 133 MHz — 15 pF Input Capacitance[6] — 7 pF CIN Electrical Characteristics for CY23S08SC-XX Commercial Temperature Devices Parameter Description Test Conditions Min Max Unit VIL Input LOW Voltage — 0.8 V VIH Input HIGH Voltage 2.0 — V IIL Input LOW Current VIN = 0V — 50.0 μA IIH Input HIGH Current VIN = VDD — 100.0 μA VOL Output LOW Voltage[7] IOL = 8 mA (–1, –2, –3, –4) IOL = 12 mA (-1H, -2H) — 0.4 V VOH Output HIGH Voltage[7] IOH = –8 mA (–1, –2, –3, –4) IOH = –12 mA (–1H, –2H) 2.4 — V IDD (PD mode) Power down Supply Current REF = 0 MHz — 12.0 μA IDD Supply Current Unloaded outputs, 100-MHz REF, Select inputs at VDD or GND — 45.0 mA — 70.0 (–1H, –2H) mA Unloaded outputs, 66-MHz REF (–1,–2,–3,–4) — 32.0 mA Unloaded outputs, 33-MHz REF (–1,–2,–3,–4) — 18.0 mA Switching Characteristics for CY23S08SC-XX Commercial Temperature Devices Parameter[8] t1 Name Output Frequency Test Conditions 30-pF load, –1, –1H, –2, –3 devices Min Typ. Max Unit 10 — 100 MHz t1 Output Frequency 30-pF load, –4 devices 15 — 100 MHz t1 Output Frequency 20-pF load, –1H device 10 — 133.3 MHz t1 Output Frequency 15-pF load, –1, –2, –3, devices 10 — 140.0 MHz t1 Output Frequency 15-pF load, –4 devices 15 — 140.0 MHz Duty = t2 ÷ t1 (–1,–2,–3,–4,–1H, -2H) Measured at VDD/2, FOUT = 66.66 MHz 30-pF load 40.0 50.0 60.0 % Duty Cycle[7] = t2 ÷ t1 (–1,–2,–3,–4,–1H, -2H) Measured at VDD/2, FOUT <66.66 MHz 15-pF load 45.0 50.0 55.0 % Cycle[7] Notes 5. Multiple Supplies: The voltage on any input or IO pin cannot exceed the power pin during power up. Power supply sequencing is NOT required. 6. Applies to both Ref Clock and FBK. 7. Parameter is guaranteed by design and characterization. Not 100% tested in production. 8. All parameters are specified with loaded outputs. Document #: 38-07265 Rev. *G Page 4 of 10 [+] Feedback CY23S08 Switching Characteristics for CY23S08SC-XX Commercial Temperature Devices (continued) Parameter[8] Name Test Conditions Min Typ. Max Unit t3 Rise Time[7] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 30-pF load — — 2.20 ns t3 Rise Time[7] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 15-pF load — — 1.50 ns t3 Rise Time[7] (–1H, -2H) Measured between 0.8V and 2.0V, 30-pF load — — 1.50 ns t4 Fall Time[7] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 30-pF load — — 2.20 ns t4 Fall Time[7] (–1, –2, –3, –4) Measured between 0.8V and 2.0V, 15-pF load — — 1.50 ns t4 Fall Time[7] (–1H, 2H) Measured between 0.8V and 2.0V, 30-pF load — — 1.25 ns t5 Output to Output Skew on same Bank (–1)[7] All outputs equally loaded 45 200 ps Output to Output Skew on same Bank (–1H,–2,–2H,–3)[7] All outputs equally loaded — 105 150 ps Output to Output Skew on same Bank (–4)[7] All outputs equally loaded — 70 100 ps Output to Output Skew (–1H, -2H) All outputs equally loaded — — 200 ps Output Bank A to Output Bank B Skew (–1,–2, –3) All outputs equally loaded — — 300 ps Output Bank A to Output Bank B Skew (–4) All outputs equally loaded — — 215 ps Output Bank A to Output Bank B Skew (–1H) All outputs equally loaded — — 250 ps –250 — +275 ps 700 ps t6 Delay, REF Rising Edge to Measured at VDD/2 FBK Rising Edge[7] t7 Device to Device Skew[7] Measured at VDD/2 on the FBK pins of devices — — t8 Output Slew Rate[7] Measured between 0.8V and 2.0V on –1H, –2H device using Test Circuit #2 1 — tJ Cycle to Cycle Jitter[7] (–1, –1H) Measured at 66.67 MHz, loaded outputs, 15, 30-pF loads: 133 MHz, 15-pF load — 65 125 ps Cycle to Cycle Jitter[7] (–2) Measured at 66.67 MHz, loaded outputs, 15-pF load — 85 300 ps Cycle to Cycle Jitter[7] (–2) Measured at 66.67 MHz, loaded outputs, 30-pF load — — 400 ps tJ Cycle to Cycle Jitter[7] (–3,–4) Measured at 66.67 MHz, loaded outputs 15, 30-pF loads — — 200 ps tLOCK PLL Lock Time[7] Stable power supply, valid clocks presented on REF and FBK pins — — 1.0 ms Document #: 38-07265 Rev. *G V/ns Page 5 of 10 [+] Feedback CY23S08 Switching Waveforms Figure 2. Duty Cycle Timing t1 t2 1.4V 1.4V 1.4V Figure 3. All Outputs Rise/Fall Time OUTPUT 2.0V 0.8V 2.0V 0.8V 3.3V 0V t4 t3 Figure 4. Output-Output Skew OUTPUT 1.4V 1.4V OUTPUT t5 Figure 5. Input-Output Propagation Delay INPUT VDD/2 VDD/2 FBK t6 Figure 6. Device-Device Skew VDD/2 FBK, Device 1 VDD/2 FBK, Device 2 t7 Document #: 38-07265 Rev. *G Page 6 of 10 [+] Feedback CY23S08 Test Circuits Figure 7. Test Circuit #1 VDD 0.1 μF CLK OUT OUTPUTS C LOAD V DD 0.1 μF GND GND Test Circuit for all parameters except t8 Figure 8. Test Circuit #2 Test Circuit # 2 V DD 0.1 μF 1 KΩ CLK out OUTPUTS 1 KΩ 10 pF V DD 0.1 μF GND GND Test Circuit for t8, Output slew rate on –1H device Document #: 38-07265 Rev. *G Page 7 of 10 [+] Feedback CY23S08 Ordering Information Ordering Code Package Type Operating Range Status CY23S08SC–1 16-pin 150-mil SOIC Commercial Obsolete CY23S08SC–1T 16-pin 150-mil SOIC–Tape and Reel Commercial Obsolete CY23S08SI–1 16-pin 150-mil SOIC Industrial Obsolete CY23S08SI–1T 16-pin 150-mil SOIC–Tape and Reel Industrial Obsolete CY23S08SC–1H 16-pin 150-mil SOIC Commercial Obsolete CY23S08SC–1HT 16-pin 150-mil SOIC–Tape and Reel Commercial Obsolete CY23S08SI–1H 16-pin 150-mil SOIC Industrial Not for new design CY23S08SI–1HT 16-pin 150-mil SOIC–Tape and Reel Industrial Not for new design CY23S08ZC–1H 16-pin 150-mil TSSOP Commercial Not for new design CY23S08ZC–1HT 16-pin 150-mil TSSOP–Tape and Reel Commercial Obsolete CY23S08SC–2 16-pin 150-mil SOIC Commercial Not for new design CY23S08SC–2T 16-pin 150-mil SOIC–Tape and Reel Commercial Not for new design CY23S08SI–2 16-pin 150-mil SOIC Industrial Not for new design CY23S08SI–2T 16-pin 150-mil SOIC–Tape and Reel Industrial Not for new design CY23S08SC–2H 16-pin 150-mil SOIC Commercial Obsolete CY23S08SC–2HT 16-pin 150-mil SOIC–Tape and Reel Commercial Active CY23S08SC–3 16-pin 150-mil SOIC Commercial Obsolete CY23S08SC–3T 16-pin 150-mil SOIC–Tape and Reel Commercial Obsolete CY23S08SC–4 16-pin 150-mil SOIC Commercial Obsolete CY23S08SC–4T 16-pin 150-mil SOIC–Tape and Reel Commercial Obsolete CY23S08SI–4 16-pin 150-mil SOIC Industrial Obsolete CY23S08SI–4T 16-pin 150-mil SOIC–Tape and Reel Industrial Obsolete CY23S08SXC–1 16-pin 150-mil SOIC Commercial Active CY23S08SXC–1T 16-pin 150-mil SOIC–Tape and Reel Commercial Active CY23S08SXI–1H 16-pin 150-mil SOIC Industrial Active CY23S08SXI–1HT 16-pin 150-mil SOIC–Tape and Reel Industrial Active CY23S08ZXC-1H 16-pin 150-mil TSSOP Commercial Active CY23S08SXC–2 16-pin 150-mil SOIC Commercial Active CY23S08SXC–2T 16-pin 150-mil SOIC–Tape and Reel Commercial Active CY23S08SXC–2H 16-pin 150-mil SOIC Commercial Active CY23S08SXC–2HT 16-pin 150-mil SOIC–Tape and Reel Commercial Active CY23S08SXI–2 16-pin 150-mil SOIC Industrial Active CY23S08SXI–2T 16-pin 150-mil SOIC–Tape and Reel Industrial Active CY23S08SXC-4 16-pin 150-mil SOIC Commercial Active CY23S08SXC-4T 16-pin 150-mil SOIC–Tape and Reel Commercial Active CY23S08SXI-4 16-pin 150-mil SOIC Industrial Active CY23S08SXI-4T 16-pin 150-mil SOIC–Tape and Reel Industrial Active Pb-free Document #: 38-07265 Rev. *G Page 8 of 10 [+] Feedback CY23S08 Package Drawings and Dimensions Figure 9. 16-Lead (150-Mil) SOIC S16 PIN 1 ID 8 1 DIMENSIONS IN INCHES[MM] MIN. MAX. REFERENCE JEDEC MS-012 PACKAGE WEIGHT 0.15gms 0.150[3.810] 0.157[3.987] 0.230[5.842] 0.244[6.197] PART # S16.15 STANDARD PKG. SZ16.15 LEAD FREE PKG. 9 16 0.386[9.804] 0.393[9.982] 0.010[0.254] 0.016[0.406] SEATING PLANE X 45° 0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.016[0.406] 0.035[0.889] 0°~8° 0.0138[0.350] 0.0192[0.487] 0.004[0.102] 0.0098[0.249] 0.0075[0.190] 0.0098[0.249] 51-85068-*B Figure 10. 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16 PIN 1 ID 1 6.25[0.246] 6.50[0.256] 4.30[0.169] 4.50[0.177] 16 0.65[0.025] BSC. 0.19[0.007] 0.30[0.012] 1.10[0.043] MAX. 0.25[0.010] BSC GAUGE PLANE 0°-8° 0.076[0.003] 0.85[0.033] 0.95[0.037] 4.90[0.193] 5.10[0.200] 0.05[0.002] 0.15[0.006] SEATING PLANE 0.50[0.020] 0.70[0.027] 0.09[[0.003] 0.20[0.008] 51-85091-*A Document #: 38-07265 Rev. *G Page 9 of 10 [+] Feedback CY23S08 Document History Page Document Title: CY23S08 3.3V Zero Delay Buffer Document Number: 38-07265 REV. ECN NO. Issue Date Orig. of Change ** 110530 12/02/01 SZV Change from Spec number: 38-01107 to 38-07265 *A 122863 12/20/02 RBI Added power up requirements to operating conditions information. *B 130951 11/26/03 RGL Corrected the Switching Characteristics parameters to reflect the W152 device and new characterization. *C 204201 See ECN RGL Corrected the Block Diagram *D 231100 See ECN RGL Fixed Typo in table 2. *E 378878 See ECN RGL Added Industrial Temp and Pb Free Devices Added typical char data Removed “Preliminary” *F 391564 See ECN RGL Changed output-to-output skew typical value from 90ps to 45ps Added cycle-to-cycle jitter (-2) typical value of 85ps *G 1442823 See ECN Description of Change WWZ/AESA Updated ordering info with status update. Added new Pb-free part numbers. © Cypress Semiconductor Corporation, 2001-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. 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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document #: 38-07265 Rev. *G Revised September 05, 2007 Page 10 of 10 Spread Aware is a trademark of Cypress Semiconductor. All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback