SEMICONDUCTOR TECHNICAL DATA High–Performance Silicon–Gate CMOS The MC54/74HC154 is identical in pinout to the LS154. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device, when enabled, selects one of 16 active–low outputs. Two active–low Chip Selects are provided to facilitate the chip–select, demultiplexing, and cascading functions. When either Chip Select is high, all outputs are high. The demultiplexing function is accomplished by using the Address inputs to select the desired device output. Then, while holding one chip select input low, data can be applied to the other chip select input (see Application Note). The HC154 is primarily used for memory address decoding and data routing applications. 1 1 Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 µA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A • Chip Complexity: 192 FETs or 48 Equivalent Gates CHIP SELECT INPUTS 18 CS1 CS2 19 A0 A1 A2 A3 23 22 21 20 1 ORDERING INFORMATION MC54HCXXXJ MC74HCXXXN MC74HCXXXDW Ceramic Plastic SOIC PIN ASSIGNMENT Y0 1 24 VCC Y0 Y1 2 23 A0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y2 3 22 A1 Y3 4 21 A2 Y4 5 20 A3 Y5 6 19 CS2 Y6 7 18 CS1 Y7 8 17 Y15 Y8 9 16 Y14 Y9 10 15 Y13 Y10 11 14 Y12 GND 12 13 Y11 ACTIVE–LOW OUTPUTS Y14 Y15 PIN 24 = VCC PIN 12 = GND 10/95 Motorola, Inc. 1995 DW SUFFIX SOIC PACKAGE CASE 751E–04 24 LOGIC DIAGRAM BINARY ADDRESS INPUTS N SUFFIX PLASTIC PACKAGE CASE 724–03 24 • • • • • • 1 2 3 4 5 6 7 8 9 10 11 13 14 15 16 17 J SUFFIX CERAMIC PACKAGE CASE 758–02 24 1 REV 6 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MC54/74HC154 MAXIMUM RATINGS* Symbol VCC Parameter DC Supply Voltage (Referenced to GND) Value Unit – 0.5 to + 7.0 V Vin DC Input Voltage (Referenced to GND) – 1.5 to VCC + 1.5 V Vout DC Output Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V DC Input Current, per Pin ± 20 mA Iout DC Output Current, per Pin ± 25 mA ICC DC Supply Current, VCC and GND Pins ± 50 mA PD Power Dissipation in Still Air, Plastic or Ceramic DIP† SOIC Package† 750 500 mW Tstg Storage Temperature – 65 to + 150 _C Iin TL This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. v v _C Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP) (Ceramic DIP or SOIC Package) 260 300 * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. †Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C Ceramic DIP: – 10 mW/_C from 100_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ v ÎÎÎÎ v ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ v ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ v ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ v ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ v ÎÎÎÎ v ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ v ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ v ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ v ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter DC Supply Voltage (Referenced to GND) Min Max Unit 2.0 6.0 V 0 VCC V – 55 + 125 _C 0 0 0 1000 500 400 ns DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 2) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Test Conditions VCC V – 55 to 25_C 85_C 125_C Unit VIH Minimum High–Level Input Voltage Vout = 0.1 V or VCC – 0.1 V |Iout| 20 µA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low–Level Input Voltage Vout = 0.1 V or VCC – 0.1 V |Iout| 20 µA 2.0 4.5 6.0 0.3 0.9 1.2 0.3 0.9 1.2 0.3 0.9 1.2 V Minimum High–Level Output Voltage Vin = VIH or VIL |Iout| 20 µA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 4.5 6.0 3.98 5.48 3.84 5.34 3.70 5.20 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 4.5 6.0 0.26 0.26 0.33 0.33 0.40 0.40 6.0 ± 0.1 ± 1.0 ± 1.0 VOH Vin = VIH or VIL |Iout| |Iout| VOL Maximum Low–Level Output Voltage Vin = VIH or VIL |Iout| 20 µA Vin = VIH or VIL |Iout| |Iout| Iin Maximum Input Leakage Current 4.0 mA 5.2 mA Vin = VCC or GND 4.0 mA 5.2 mA V µA Vin = VCC or GND 6.0 8 80 160 µA Iout = 0 µA NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). ICC MOTOROLA Maximum Quiescent Supply Current (per Package) 2 High–Speed CMOS Logic Data DL129 — Rev 6 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ v v ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MC54/74HC154 AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Guaranteed Limit VCC V – 55 to 25_C 85_C 125_C tPLH, tPHL Maximum Propagation Delay, Input A to Output Y (Figures 1 and 3) 2.0 4.5 6.0 190 38 32 240 48 41 285 57 48 ns tPLH, tPHL Maximum Propagation Delay, CS to Output Y (Figures 2 and 3) 2.0 4.5 6.0 175 35 30 220 44 37 265 53 45 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 2 and 3) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns Maximum Input Capacitance — 10 10 10 pF Symbol Cin Parameter Unit NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). Typical @ 25°C, VCC = 5.0 V CPD Power Dissipation Capacitance (Per Package)* pF 80 * Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D). PIN DESCRIPTIONS INPUTS when addressed and both chip–select inputs are active. These outputs remain high when not addressed or a chip– select input is high. A0, A1, A2, A3 (Pins 23, 22, 21, 20) Address inputs. These inputs, when the 1–of–16 decoder is enabled, determine which of its sixteen active–low outputs is selected. CONTROL INPUTS CS1, CS2 (Pins 18, 19) OUTPUTS Active–low chip–select inputs. With low levels on both of these inputs, the outputs of the decoder follow the Address inputs. A high level on either input forces all outputs high. Y0 – Y15 (Pins 1 – 11, 13 – 17) Active–low outputs. These outputs assume a low level FUNCTION TABLE Inputs Outputs CS1 CS2 A3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L H H H H H H H H L L L L H H H H L L L L H H H H L L H H L L H H L L H H L L H H L H L H L H L H L H L H L H L H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L H H H H H H H H H H H H H H H H L L H H H L H X X X X X X X X X X X X H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H = High Level, L = Low Level, X = Don’t Care High–Speed CMOS Logic Data DL129 — Rev 6 3 MOTOROLA MC54/74HC154 SWITCHING WAVEFORMS VALID INPUT A VALID tf VCC 50% GND tPLH VCC 90% CS1 OR CS2 50% 10% GND tPHL tPHL OUTPUT Y 50% tr tPLH 90% 50% 10% OUTPUT Y tTHL Figure 1. tTLH Figure 2. TEST POINT OUTPUT DEVICE UNDER TEST CL* * Includes all probe and jig capacitance Figure 3. Test Circuit TYPICAL APPLICATIONS A0 A1 A2 A3 Y0 Y0 A0 A1 A2 A3 Y15 STROBE Y15 DATA INPUT CS1 CS2 1 OF 16 DEMULTIPLEXER SELECTED OUTPUT’S LOGIC LEVEL FOLLOWS LOGIC LEVEL ON DATA INPUT 1 OF 16 DECODER SELECTED OUTPUT IS LOW MOTOROLA CS1 CS2 4 High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC154 EXPANDED LOGIC DIAGRAM 1 CS1 CS2 18 19 2 Y0 Y1 3 Y2 4 5 A0 Y3 Y4 23 6 Y5 7 A1 Y6 22 8 Y7 9 A2 10 11 13 A3 Y8 21 Y9 Y10 Y11 20 14 Y12 15 Y13 16 Y14 17 High–Speed CMOS Logic Data DL129 — Rev 6 5 Y15 MOTOROLA MC54/74HC154 OUTLINE DIMENSIONS J SUFFIX CERAMIC PACKAGE CASE 758–02 ISSUE A L B 24 13 1 12 P NOTES: 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. 5. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. J –A– DIM A B C D F G J K L N P N C –T– K SEATING PLANE G INCHES MIN MAX 1.240 1.285 0.285 0.305 0.160 0.200 0.015 0.021 0.045 0.062 0.100 BSC 0.008 0.013 0.100 0.165 0.300 0.310 0.020 0.050 0.360 0.400 MILLIMETERS MIN MAX 31.50 32.64 7.24 7.75 4.07 5.08 0.38 0.53 1.14 1.57 2.54 BSC 0.20 0.33 2.54 4.19 7.62 7.87 0.51 1.27 9.14 10.16 F D 24 PL 0.25 (0.010) M T A M N SUFFIX PLASTIC PACKAGE CASE 724–03 ISSUE D –A– 24 13 1 12 NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. –B– L C –T– N E G M J F D 24 PL 0.25 (0.010) 24 PL 0.25 (0.010) MOTOROLA NOTE 1 K SEATING PLANE M T A M 6 M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 High–Speed CMOS Logic Data DL129 — Rev 6 MC54/74HC154 OUTLINE DIMENSIONS DW SUFFIX PLASTIC SOIC PACKAGE CASE 751E–04 ISSUE E –A– 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 13 –B– 12X P 0.010 (0.25) 1 M B M 12 24X D J 0.010 (0.25) M T A S B S F R C –T– SEATING PLANE M 22X K G X 45 _ DIM A B C D F G J K M P R MILLIMETERS MIN MAX 15.25 15.54 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.601 0.612 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 Motorola reserves the right to make changes without further notice to any products herein. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] –TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 High–Speed CMOS Logic Data DL129 — Rev 6 ◊ CODELINE 7 *MC54/74HC154/D* MC54/74HC154/D MOTOROLA