HD74LS367A Hex Bus Drivers (non-inverted data outputs with three-state outputs) REJ03D0480–0200 Rev.2.00 Feb.18.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS367AP DILP-16 pin PRDP0016AE-B (DP-16FV) P — HD74LS367AFPEL SOP-16 pin (JEITA) PRSP0016DH-B (FP-16DAV) FP EL (2,000 pcs/reel) PRSP0016DG-A RP EL (2,500 pcs/reel) (FP-16DNV) Notes: 1. Please consult the sales office for the above package availability. 2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of the package code. HD74LS367ARPEL SOP-16 pin (JEDEC) Pin Arrangement Output Control G1 1 16 VCC 1A 2 15 Output Control G2 1Y 3 14 6A 2A 4 13 6Y 2Y 5 12 5A 3A 6 11 5Y 3Y 7 10 4A GND 8 9 4Y (Top view) Function Table G A H X L L L H Note: H; high level, L; low level, X; irrelevant, Z; off (high-impedance) state of a 3-state output Rev.2.00, Feb.18.2005, page 1 of 5 Y Z L H HD74LS367A Absolute Maximum Ratings Item Symbol Ratings Unit VCC 7 V Supply voltage Input voltage Output voltage (off-state) VIN 7 V VO (off) 5.5 V Power dissipation PT 400 mW Operating temperature Topr –20 to +75 °C Storage temperature Tstg –65 to +150 °C Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Symbol Min Typ Max Unit VCC 4.75 5.00 5.25 V IOH — — –2.6 mA IOL — — 24 mA Topr –20 25 75 °C Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Symbol VIH VIL min. 2.0 — typ.* — — max. — 0.8 Unit V V VOH 2.4 — — V IIL — — — — — — — — — — — — — — 0.5 0.4 20 –20 20 –20 –0.4 µA µA mA II — — — — –0.4 0.1 mA mA VO = 2.4 V VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V VO = 0.4 V VCC = 5.25 V, VI = 2.7 V VI = 0.5 V, G inputs 2 V A inputs VCC = 5.25 V VI = 0.4 V, G inputs 0.4 V G inputs VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V IOS –40 — –225 mA VCC = 5.25 V ICC** — 14 24 mA VCC = 5.25 V VIK — — –1.5 V Output voltage VOL Output current IOZ IIH Input current Short-circuit output current Supply current Input clamp voltage V µA Condition VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = –2.6 mA IOL = 24 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IOL = 12 mA VCC = 4.75 V, IIN = –18 mA Notes: * VCC = 5 V, Ta = 25°C ** ICC is measured with data inputs grounded and output control inputs at 4.5 V. Rev.2.00, Feb.18.2005, page 2 of 5 HD74LS367A Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Output enable time Output disable time Symbol tPLH tPHL tZH tZL tHZ tLZ min. — — — — — — typ. 10 9 19 24 — — max. 16 22 35 40 30 35 Unit Condition ns CL = 45 pF, RL = 667 Ω ns ns CL = 5 pF, RL = 667 Ω Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.2.00, Feb.18.2005, page 3 of 5 HD74LS367A Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B MASS[Typ.] 1.05g Previous Code DP-16FV D 9 E 16 1 8 b3 0.89 Z A1 A Reference Symbol L e Nom θ c e1 D 19.2 E 6.3 JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV 7.4 A1 0.51 b p 0.40 b 3 0.48 0.56 1.30 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 1.12 L 2.54 MASS[Typ.] 0.24g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D F 16 20.32 5.06 Z ( Ni/Pd/Au plating ) Max 7.62 1 A bp e Dimension in Millimeters Min 9 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 bp Nom D 10.06 E 5.50 Max 10.5 A2 8 e Dimension in Millimeters Min x A1 M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 0.80 Z L L Rev.2.00, Feb.18.2005, page 4 of 5 8° 0.50 1 0.70 1.15 0.90 HD74LS367A JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A *1 Previous Code FP-16DNV MASS[Typ.] 0.15g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 16 9 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 9.90 10.30 E 3.95 A2 8 1 Z e *3 bp x A1 0.10 0.14 0.25 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 1.75 A M L1 bp b1 c A c A1 θ L y Detail F 1 θ 0° HE 5.80 1.27 e x 0.25 y 0.15 0.635 Z 0.40 L L Rev.2.00, Feb.18.2005, page 5 of 5 8° 1 0.60 1.08 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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