LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT OVAL TYPE LED LAMPS Pb Lead-Free Parts LURF32840/P1-PF DATA SHEET DOC. NO : QW0905-LURF32840/P1-PF REV. : A DATE : 01 - Apr. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/5 PART NO. LURF32840/P1-PF Package Dimensions 3.9 3.1 6.3 9.8±0.5 1.5 MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Vertcal Axis 48° Horizontal Axis 84° 0° -30 ° 30° -60 ° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% Radiation Angle(0.5):H 84 Degree/V 48 Degree LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LURF32840/P1-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT URF Forward Current IF 50 mA Peak Forward Current Duty 1/10@10KHz IFP 130 mA Power Dissipation PD 120 mW Ir 10 μA Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic *glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted Forward Dominant Spectral voltage wave halfwidth length △λnm @20mA(V) λDnm Lens Luminous intensity @20mA(mcd) Min. Max. Min. Viewing angle 2θ 1/2 (deg) Typ. Vertical Axis 48 ° LURF32840/P1-PF AlGaInP Red Red Diffused 630 20 1.5 2.4 300 450 Horizontal Axis 84 ° Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 PART NO. LURF32840/P1-PF Typical Electro-Optical Characteristics Curve URF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 550 600 650 Wavelength (nm) 100 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature(℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 10 700 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURF32840/P1-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURF32840/P1-PF Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260℃±5℃ 2.Dwell time= 10±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11