19-1897 Rev 0; 1/01 NUAL KIT MA ATION EET H S A EVALU T WS DA O L L O F Low-Power Cellular Upconverter-Driver The MAX2307 is an integrated RF upconverter-driver optimized for the Japanese cellular frequency band. It can also be used for applications in the US cellular and ISM bands. Its low current consumption (15mA at -15dBm output) extends the average talk time. The image rejection is done using only two external inductors at the upconverter output because the image frequency in Japanese cellular phones is typically 330MHz away. This realizes the image rejection with no current consumption penalty and only two inexpensive off-chip components, saving cost and valuable board space. The MAX2307 has a separate shutdown control for the LO buffer to minimize VCO pulling. It comes in an ultrasmall 3✕4 ultra-chipscale package (UCSP). Features ♦ Ultra-Small Implementation Size ♦ Low Off-Chip Component Count ♦ 15mA at -15dBm POUT ♦ 34mA at +6.5dBm POUT and -53dBc ACPR ♦ <1µA Shutdown Mode ♦ Separate Shutdown for LO Buffer ♦ No External Logic Interface Circuitry Required Ordering Information Applications Cellular Handsets cdmaOne™ Handsets PART TEMP. RANGE PIN-PACKAGE MAX2307EBC -40°C to +85°C 3×4 UCSP ISM Band Pin Configuration Block Diagram VCC TOP VIEW (BUMPS ON BOTTOM) VCC A B VCC VCC MIXP VCC MIXM GND VCCMIXP A2 A3 VCCMIXM IFINM C3 C2 IFINP B4 LOIN/ SHDNLO GC RFOUT RFOUT B3 GC C GND IFINP IFINM SHDN C4 BIAS CTRL SHDN 1 2 3 4 BIAS CTRL2 B1 LOIN/SHDNLO SHDNLO LOIN cdmaOne is a trademark of CDMA Development Group. ________________________________________________________________ Maxim Integrated Products 1 For price, delivery, and to place orders, please contact Maxim Distribution at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX2307 General Description MAX2307 Low-Power Cellular Upconverter-Driver ABSOLUTE MAXIMUM RATINGS VCC, RFOUT to GND .............................................-0.3V to +5.5V SHDN to GND.............................................-0.3V to (VCC + 0.3V) RF, IF Input Power ..............................................................0dBm Continuous Power Dissipation (TA = +70°C) 3✕4 UCSP (derate 80mW/°C above +70°C) .................628mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +160°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (VCC = +2.8V to +4.2V, TA = -40°C to +85°C, no RF/IF signals applied, V SHDN = V SHDNLO = +1.8V. Typical values are at VCC = +3.0V, TA = +25°C, unless otherwise noted). PARAMETER Supply Voltage SYMBOL CONDITIONS VCC MIN TYP 2.8 MAX UNITS 4.2 V Shutdown Supply Current ICC SHDN = SHDNLO = 0.6V 0.1 20 µA Standby Supply Current ICC SHDN = 0.6V, SHDNLO = 1.8V 2.5 4 mA VGC = 2.2V, POUT = +6.5dBm 33.5 42 Supply Current (Note 1) ICC VGC = 2.2V, POUT = +2dBm 29.5 38 Supply Current with No RF Drive ICC Gain Control Voltage VGC VGC = 0.5V 14 20 VGC = 2.2V 28 36.5 mA 3.0 V 0.6 V 1 µA 0 SHDN, SHDNLO Logic High 1.8 SHDN, SHDNLO Logic Low 0 SHDN, SHDNLO Logic Current High SHDN, SHDNLO Logic Current Low 2 mA 1 _______________________________________________________________________________________ V µA Low-Power Cellular Upconverter-Driver (MAX2307 Evaluation Kit, VCC = +2.8V to +4.2V, TA = -40°C to +85°C, fRF = 887MHz to 925MHz, fLO = 722MHz to 760MHz, fIF = 165MHz, PIFIN = -20dBm, PLOIN = -15dBm, V SHDN = V SHDNLO = +1.8V, 50Ω system. Typical values are at VCC = 3.0V, V SHDN = V SHDNLO = 1.8V, fRF = 906MHz, TA = +25°C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS TYP MAX UNITS 925 MHz 21.5 24.5 27.5 VGC = 2.2V, VCC = 2.8V to 4.2V, TA = TMIN to TMAX 17 24.5 32.5 VGC = 2.2V, ACPR ≤ -53dBc, ALT ≤ -65dBc 4.5 6.5 -15 -12 18 23 RF Frequency Range (Note 2) 887 VGC = 2.2V, VCC = 3.0V, TA = +25°C Power Gain G Output Power MIN POUT LO Input Power Level Gain Control Range VGC = 0.5V to 2.2V, PIFIN = -30dBm Gain Control Slope (Note 3) VGC = 0.5V to 2.2V, PIFIN = -30dBm Adjacent Channel Power Ratio ACPR1 Offset = ±885kHz in 30kHz BW Alternate Channel Power Ratio ACPR2 Offset = ± 1.98MHz in 30kHz BW 32 dB dBm -5 dBm 36 dB/V -53 dBc -65 dBc dB POUT = 6.5dBm -134 PIFIN = -50dBm, VGC = 0.5V -147 LO Leakage POUT from +6.5dBm to -8dBm -43 -30 dBc Image Leakage (Note 1) POUT from 6.5dBm to -8dBm, fRF = 887MHz to 925MHz, fIMAGE = 557MHz to 595MHz -40 -25 dBc RX Band Noise Power (Note 4) Note 1: Note 2: Note 3: Note 4: PNOISE -131 dBm/Hz Minimum and maximum limits are guaranteed by design and characterization. See Typical Operating Characteristics for operation outside this frequency range. Slope measured with VGC = +0.5V and VGC = +0.8V. fRF = 925MHz, noise measured at 870MHz. _______________________________________________________________________________________ 3 MAX2307 AC ELECTRICAL CHARACTERISTICS Typical Operating Characteristics (MAX2307 Evaluation Kit, VCC = +2.8V, VGC = 2.2V, V SHDN = V SHDNLO = VCC, fRF = 906MHz, fIF = 165MHz, fLO = 741MHz, TA = +25°C, unless otherwise noted.) TA = +25°C 0.6 0.5 VGC = 2.2V 33 32 TA = +85°C 31 TA = +25°C 30 29 28 27 26 0.4 TA = -40°C TA = -40°C 25 0.3 3 4 5 6 28 TA = +85°C 25 TA = +25°C 22 TA = -40°C 19 16 13 NO RF SIGNALS APPLIED 10 24 2 -10 -8 -6 -4 -2 2 0 4 0 6 0.5 1.0 1.5 2.0 2.5 VCC (V) POUT (dBm) VGC (V) CONVERSION GAIN vs. RF FREQUENCY CONVERSION GAIN vs. RF FREQUENCY CONVERSION GAIN vs. GAIN CONTROL VOLTAGE 25 CONVERSION GAIN (dB) TA = +25°C 25 20 TA = +85°C 24 23 22 VCC = +2.8V 21 20 VCC = +3.3V TA = -40°C TA = +25°C 30 CONVERSION GAIN (dB) VCC = +4.2V 40 3.0 MAX2307 toc06 26 MAX2307 toc05 TA = -40°C 30 27 MAX2307 toc04 35 20 10 TA = +85°C 0 -10 19 15 -20 18 PIFIN = -30dBm 10 PIFIN = -30dBm PIFIN = -30dBm -30 17 860 880 900 920 940 960 840 860 RF FREQUENCY (MHz) 880 900 920 940 0.5 1.0 1.5 2.0 VGC (V) CONVERSION GAIN vs. LO INPUT POWER OUTPUT POWER vs. RF FREQUENCY 7.1 MAX2307 toc07 33 TA = -40°C ACPR ≤ -53dBc ALT1 ≤ -65dBc 7.0 30 6.9 POUT (dBm) CONVERSION GAIN (dB) 0 960 RF FREQUENCY (MHz) MAX2307 toc08 840 TA = +25°C 27 24 TA = +85°C 21 6.8 6.7 6.6 6.5 18 PIFIN = -30dBm 6.4 15 -17 -15 -13 -11 PLOIN (dBm) 4 31 TOTAL SUPPLY CURRENT (mA) TA = +85°C 0.7 34 MAX2307 toc02 NO RF SIGNALS APPLIED VGC = 0 TOTAL SUPPLY CURRENT (mA) MAX2307 toc01 SHUTDOWN SUPPLY CURRENT (µA) 0.9 0.8 TOTAL SUPPLY CURRENT vs. GAIN CONTROL VOLTAGE TOTAL SUPPLY CURRENT vs. OUTPUT POWER MAX2307 toc03 SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE CONVERSION GAIN (dB) MAX2307 Low-Power Cellular Upconverter-Driver -9 -7 -5 885 895 905 915 RF FREQUENCY (MHz) _______________________________________________________________________________________ 925 2.5 3.0 Low-Power Cellular Upconverter-Driver RX BAND NOISE POWER vs. RF FREQUENCY F -80 E D -90 -8 -5 -2 1 4 MAX2307 toc12 TA = +85°C TA = +25°C -135.5 TA = -40°C -136.0 -136.5 VARYING PIFIN, VGC = +2.2V -100 -135.0 7 LO LEAKAGE vs. OUTPUT POWER 900 910 920 -60 -50 -30 -30 -20 TA = +85°C A = PLOIN = -17dBm B = PLOIN = -11dBm C = PLOIN = -5dBm -20 -40 C -50 B 6.5 -30 -40 C -50 B A -70 -80 -10 POUT (dBm) -4.5 1.0 -10 6.5 -4.5 POUT (dBm) -40 C B -50 6.5 IMAGE LEAKAGE vs. RF FREQUENCY MAX2307 toc17 TA = -40°C A = PLOIN = -17dBm B = PLOIN = -11dBm C = PLOIN = -5dBm 1.0 POUT (dBm) LO LEAKAGE vs. OUTPUT POWER -10 10 -60 -80 1.0 0 LO LEAKAGE vs. OUTPUT POWER -70 -80 -10 -10 A fRF = 887MHz -30 -40 POUT (dBm) -60 -20 -150 930 TA = +25°C A = PLOIN = -17dBm B = PLOIN = -11dBm C = PLOIN = -5dBm -20 LO LEAKAGE (dBc) fRF = 925MHz -4.5 -145 -155 890 -10 MAX2307 toc14 fRF = 906MHz -10 TA = +85°C LO LEAKAGE vs. OUTPUT POWER -30 LO LEAKAGE (dBc) LO LEAKAGE (dBc) -20 -70 -140 fRF (MHz) -10 -50 TA = -40°C TA = +25°C -137.0 880 POUT (dBm) -40 -135 A -60 -40 -41 TA = +85°C -42 -43 -44 -45 -46 TA = +25°C -47 -48 -70 MAX2307 toc18 -70 -134.5 MAX2307 toc16 A RX BAND NOISE POWER (dBm/Hz) C -60 -134.0 LO LEAKAGE (dBc) -50 B -130 MAX2307 toc15 -40 -133.5 IMAGE SUPPRESSION (dBc) ACPR AND ALT1 (dBc) -30 ALT1: D. TA = +85°C E. TA = +25°C F. TA = -40°C RX BAND NOISE POWER (dBm/Hz) ACPR: A. TA = +85°C B. TA = +25°C C. TA = -40°C MAX2307 toc10 -20 RX BAND NOISE POWER vs. OUTPUT POWER MAX2307 toc13 ACPR AND ALT vs. OUTPUT POWER TA = -40°C -49 -50 -80 -10 -4.5 1.0 POUT (dBm) 6.5 885 895 905 915 925 RF FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX2307 Typical Operating Characteristics (continued) (MAX2307 Evaluation Kit, VCC = +2.8V, VGC = 2.2V, V SHDN = V SHDNLO = VCC, fRF = 906MHz, fIF = 165MHz, fLO = 741MHz, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX2307 Evaluation Kit, VCC = +2.8V, VGC = 2.2V, V SHDN = V SHDNLO = VCC, fRF = 906MHz, fIF = 165MHz, fLO = 741MHz, TA = +25°C, unless otherwise noted.) S11 OF LO INPUT -35 ACPR > -53dBc ALT1 > -65dBc R 30 H -50 -55 25 10 -17.0 -17.5 ACPR ≤ -53dBc ALT1 ≤ -65dBc -18.0 -18.5 -60 600 650 700 750 800 850 900 950 1000 fLO (MHz) SHDN = SHDNLO = VCC SHDN = VCC, SHDNLO = GND A = REAL, B = IMAGINARY E = REAL, F = IMAGINARY SHDN = SHDNLO = GND SHDN = GND, SHDNLO = VCC C = REAL, D = IMAGINARY G = REAL, H = IMAGINARY 5 0 ACPR ≤ 53dBc ALT1 ≤ -65dBc -5 -10 -19.0 -15 -19.5 20 15 POUT (dBm) D, F A ACPR > -53dBc ALT1 > -65dBc -16.5 PIN (dBm) -45 35 IMAGINARY IMPEDANCE (Ω) C, E, G -16.0 MAX2307 toc20 20 MAX2307 toc09 -15.0 -15.5 -40 40 MAXIMUM OUTPUT POWER MAXIMUM INPUT POWER MAX2307 toc19 45 REAL IMPEDANCE (Ω) MAX2307 Low-Power Cellular Upconverter-Driver -20 -20.0 0.5 1.0 1.5 2.0 2.5 3.0 0.5 1.0 1.5 2.0 2.5 3.0 VGC (V) VGC (V) Pin Description 6 PIN NAME A1 VCC FUNCTION A2, A3 VCCMIXP, VCCMIXM Mixer Supply Pins. Require pullup inductors, which are used as part of the image rejection filter network. Supply to inductors should be locally bypassed with 100pF and 0.01µF capacitors. B1 LOIN/ SHDNLO LO Input and LO Buffer Shutdown. Apply both LO input signal and LO buffer shutdown control to this pin. The LO path requires a DC-blocking capacitor. A logic high on SHDNLO turns on the LO buffer, and a logic low turns off the LO buffer, independently of SHDN. The shutdown control requires a 10kΩ isolation resistor in order not to load the LO signal. B3 GC B4 RFOUT A4, C1 GND GND Connection. Solder directly to the PCB ground plane, with three ground vias around the corner of the UCSP, as close to bump as possible. It is imperative that GND sees a low inductance to the system ground plane. See the MAX2307 EV Kit as an example. C2, C3 IFINP, IFINM Upconverter IF Inputs. AC-couple IF signals to these pins. C4 SHDN Shutdown Control. HIGH turns on the device except the LO buffer, LOW turns off the device except the LO buffer. Supply Pin. Bypass with 100pF and 0.01µF capacitors as close to the pin as possible. Gain Control Pin. Apply a voltage between 0 to 3V to vary the gain of the IC. PA Driver Output. Requires an inductor pullup and a DC-blocking capacitor. These components are also the matching elements. _______________________________________________________________________________________ Low-Power Cellular Upconverter-Driver VCC L1 5.6nH L2 5.6nH C7 0.01µF C6 100pF VGC VCC C3 4.7µF VCCMIXP VCC C2 0.01µF VCC PA Driver GC C1 100pF MAX2307 GND C12 0.01µF R1 10kΩ L4 6.2nH C13 100pF C14 0.01µF RFOUT RFOUT LOIN/SHDNLO SHDNLO C4 100pF LOIN R2 10kΩ VCC VCCMIXM C16 3.0pF VCC GND IFINP SHDN using on-chip inductors to ensure sufficient selectivity for image rejection. The Q of the off-chip tank inductor directly determines the image suppression level and usable bandwidth. The MAX2307 also provides a continuous variable gain function, enabling at least 20dB of gain control using an external control voltage input. SHDN IFINM IF INPUT Applications Information Local Oscillator LOIN/SHDNLO Input The LO input is a single-ended broadband port. The LO signal is mixed with the input IF signal and the resulting upconverted output appears on the RFOUT pin. AC-couple the LO pin with a capacitor having less than 3Ω reactance at the LO frequency. This device also contains an internal LO buffer and supports an LO signal ranging from -15dBm to -5dBm. SHDNLO turns the LO buffer on and off independent of the rest of the IC and shares the same pin as LOIN. To avoid loading of the LO, connect a 10kΩ isolation resistor between the LOIN/SHDNLO pin and the SHDNLO logic output. The SHDNLO control can help reduce VCO pulling in gated-transmission mode by providing a means to keep the LO buffer on while the upconverter and driver turn on and off. IF Input The MAX2307 has a differential IF input port for interfacing to differential IF filters. AC-couple the IF pins with a capacitor. The typical IF input frequency is 165MHz, but device can operate from 130MHz to 230MHz. The differential impedance between the two IF inputs is approximately 400Ω in parallel with 0.5pF. Mixer The MAX2307 uses a double-balanced differential upconverting mixer. Two inductors connecting the mixer output pins (A2 and A3) to VCC in conjunction with an on-chip capacitor achieve image suppression. This method allows image rejection with no current consumption penalty, and permits much higher Q than The MAX2307 utilizes a class AB driver stage. Unlike class A or B, class AB action offers both good linearity and low current consumption. Current consumption of class AB is proportional to the output power at high drive levels. RFOUT is an open-collector output that requires an external inductor to VCC for proper biasing. For optimum performance, implement an impedance-matching network. The configuration and values for the matching network depend on the transmit frequency, performance, and desired output impedance. For simultaneous optimum linearity and return loss, the real part of the load impedance should be about 100Ω. The device’s internal 0.5pF shunt parasitic needs to be absorbed by the matching network. For matching network values for the Japanese cellular transmit band, see the MAX2307 EV kit data sheet. Layout Issues For best performance, pay close attention to powersupply issues, as well as to the layout of the RFOUT matching network. The EV kit can be used as a layout example. Ground connections and supply bypassing are the most important. Power Supply and SHDN_ Bypassing Bypass VCC with a 100pF capacitor in parallel with a 0.01µF RF capacitor. Use separate vias to the ground plane for each of the bypass capacitors and minimize trace length to reduce inductance. Use three separate vias to the ground plane for each ground pin. Power-Supply Layout To minimize coupling between different sections of the IC, the ideal power-supply layout is a star configuration with a large decoupling capacitor at a central V CC node. The V CC traces branch out from this central node, each going to a separate VCC node in the PC board. At the end of each trace is a bypass capacitor with low ESR at the RF frequency of operation. This arrangement provides local decoupling at each VCC pin. At high frequencies, any signal leaking out of one supply pin sees a relatively high impedance (formed by the VCC trace inductance) to the central VCC node, and an even higher impedance to any other supply pin, as _______________________________________________________________________________________ 7 MAX2307 Typical Operating Circuit well as a low impedance to ground through the bypass capacitor. Impedance-Matching Network Layout The RFOUT matching network is very sensitive to layout-related parasitics. To minimize parasitic inductance, keep all traces short and place components as close as possible to the chip. To minimize parasitic capacitance, minimize the area of the plane. ____________________Chip Information TRANSISTOR COUNT: 693 PROCESS TECHNOLOGY: Silicon Bipolar Package Information 12L, UCSP 4x3.EPS MAX2307 Low-Power Cellular Upconverter-Driver 8 _______________________________________________________________________________________