SITI ST1112S

ST1112S
Version
: A.007
Issue Date : 2009/08/27
File Name : SP-ST1112S-A.007.doc
Total Pages : 8
Single Coil Brushless
DC Motor Drivers Built-in Hall Sensor
( 2 to 7.5 Volts )
新竹市科學園區展業一路 9 號 7 樓之 1
SILICON TOUCH TECHNOLOGY INC.
9-7F-1, Prosperity Road I, Science Based Industrial Park,
Hsin-Chu, Taiwan 300, R.O.C.
Tel:886-3-5645656
Fax:886-3-5645626
ST1112S
ST1112S
Single Coil Brushless DC
Motor Drivers Built-in Hall Sensor ( 2 to 7.5 Volts)
General Specifications
The device is designed specifically for electronic commutation of single coil DC motor
applications. Each device includes a HALL sensor, a frequency generator output, a lock
detection circuit to shut down the drivers for overheat prevention, and complementary
bi-directional drivers for driving and sinking large load on a single silicon chip.
If the motor rotation is stalled by external force or obstacles, overdrive current ( or lock current )
may incur coil overheat/burning. To prevent coil overheat/burning, these devices incorporate
lock detection circuit to shut down the drivers. After the motor locking is released, the drivers
can be powered up using an automatic self-restart circuit. The drivers are shut down roughly
1 to 3 seconds after the motor is locked. After the drivers are shut down, the automatic
self-restart circuit will try to power up the drivers every 1 to 3 seconds.
SP-ST1112S-A.007
Version:A.007
Page:1
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ST1112S
Pin Description
(LFCSP8)
FG
O2
NC
NC
VDD
NC
PIN NO.
PIN NAME
DESCRIPTION
GND
O1
PIN NO.
PIN NAME
DESCRIPTION
1
NC
No connection
5
O1
Output driving/sinking pin 1
2
NC
No connection
6
GND
Ground pin
3
VDD
Power supply pin
7
O2
Output driving/sinking pin 2
4
NC
No connection
8
FG
Frequency generator output
(SOT-25)
PIN NO. PIN NAME
O2
VDD
DESCRIPTION
1
O2
Output driving/sinking pin 2
O1
2
VDD
Power supply pin
GND
3
FG
Frequency generator output
4
GND
Ground pin
5
O1
Output driving/sinking pin 1
FG
Features and Benefits
z
Optimized for single coil Brushless DC Motor applications
Built-in Hall effect sensor
Built-in Reverse Protection
Frequency generator output
Lock detection and automatic self-restart without external capacitor
High output sinking and driving capability
z
Ultra-thin, small and highly reliable package (LFCSP8,SOT-25)
z
z
z
z
z
SP-ST1112S-A.007
Version:A.007
Page:2
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ST1112S
Absolute Maximum Ratings ( Unless otherwise noted, TA = 25 °C )
Characteristic
Symbol
VDD
VIN
IOUT
PD1,max
Rating
7.5
VDD+0.4
350
400
Unit
V
V
mA
mW
Thermal Resistance (Junction to Ambient)LFCSP8*
θJA1
156.6
°C/ W
Thermal Resistance (Junction to Case)LFCSP8*
Maximum Power Dissipation of SOT25
θJC1
21.4
PD2,max
350
°C/ W
mW
Thermal Resistance (Junction to Ambient)SOT25*
θJA2
215
°C/ W
Thermal Resistance (Junction to Case)SOT25*
Operating Temperature Range
θJC2
50
°C/ W
TOPR
-40 ~ 85
°C
Storage Temperature Range
TSTG
-65 ~ 150
°C
Supply Voltage
Input Voltage from a Hall Effect Latch Output
Output Current
Maximum Power Dissipation of LFCSP8
*Single Layers、76.2x114.3x1.6mm, refer to the JEDEC JESD51-7
Electrical Characteristics ( TA= 25°C , VDD= 5V )
Characteristic
Sym.
Supply Voltage
VDD
Supply Current
IDD
Limit
Condition
Operating
Unit
Min.
Typ.
Max.
2
5
7.5
V
5
10
mA
-
1.0
10
mT
Auto-restart operating
Magnetic Specifications ( TJ = 25℃)
Operating Point
BOP
Release Point
BRP
-
-1.0
-10
mT
Hysteresis
BHYS
-
2.0
20
mT
O1/O2 Output Terminal ( TJ = 25℃)
Output Voltage High
VOH
IOUT = 300 mA
4.7
-
-
V
Output Voltage Low
VOL
IOUT = 300 mA
-
-
0.3
V
Output Current
IOUT
RL = 30Ω
-
148
-
mA
5
μA
0.4
V
ms
FG Open-Drain Terminal ( TJ = 25℃)
Output Leakage Current
IFGLEK
VFG = 5 V
Output Voltage Low
VFGOL
IFG= 10 mA
Automatic Self-Restart Circuit
On Time
TON
Duty Ratio
RDR
SP-ST1112S-A.007
TOFF / TON
Version:A.007
-
152
-
6
7
8
Page:3
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ST1112S
Block Diagram & Application Circuit
POWER
VDD
Power
FG
TACHO
GENERATOR
HALL
+
DRIVERS
-
LOGIC
BLOCK
IC
FG
O1
O2
LOCK DETECTION
GND
Application Notes
…
…
There is no requirement of the bypass capacitor or Zener Diode between VDD and GND in
normal applications. The connection of this capacitor or Zener Diode will increase stability of
operation, if required.
The power dissipated by the IC varies widely with the supply voltage, the output current, and
loading. It is important to ensure the application does not exceed the allowable power
dissipation of the IC package. The recommended motor driver power dissipation versus
temperature of SOT25 and LFCSP8 are depicted as follows:
SP-ST1112S-A.007
Version:A.007
Page:4
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ST1112S
Electrical Characteristic (TA= 25°C)
◎The BOP versus supply voltage curve.
◎The BRP versus supply voltage curve.
BOP versus Supply Voltage
BRP versus Supply Voltage
20.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
15.0
-5.0
Flu x Den sity ( G)
Flu x D en sity (G )
0.0
10.0
5.0
-10.0
-15.0
0.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
-20.0
Su p p ly Vo ltage (V)
Su p p l y Vo l t ag e (V)
◎The Hysteresis versus supply voltage curve.
◎The saturation voltage of output.
Saturation Voltage versus Output Current
BHYS versus Supply Voltage
6.0
30.0
4.0
20.0
Voltage ( V)
Delta Flu x D en si t y (G )
5.0
25.0
15.0
VO1
VO2
10.0
2.0
5.0
1.0
0.0
2.0
3.0
4.0
5.0
6.0
Su p p l y Vo l t ag e (V)
SP-ST1112S-A.007
7.0
8.0
VDD
3.0
0.0
50.00
100.00
150.00
200.00
Ou tp u t C u r r en t ( m A)
Version:A.007
Page:5
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ST1112S
Package Specifications
( LFCSP8 )
Symbol
MIN
A
A1
A3
b
D
D1
E
E1
e
e1
L
y
SP-ST1112S-A.007
Dimensions(mm)
TYP
0.000
0.150
1.900
1.900
0.250
-
Version:A.007
0.020
0.127REF
0.200
2.000
1.600
2.000
0.900
0.50BSC
1.50BSC
0.350
-
MAX
0.450
0.050
0.250
2.100
2.100
0.450
0.080
Page:6
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ST1112S
( SOT-25 )
Symbol
A
A1
A2
b
c
D
E
e
e1
E1
L
L1
L2
θ°
θ1°
θ2°
SP-ST1112S-A.007
MIN
1
0
0.7
0.3
0.08
2.7
2.6
1.5
0.3
0
3
6
Dimensions(mm)
TYP
1.175
0.075
0.95
0.4
0.165
2.9
2.8
0.950 BSC
1.900 BSC
1.6
0.45
0.600 REF
0.250 BSC
5
5
8
Version:A.007
MAX
1.35
0.15
1.2
0.5
0.25
3.1
3
1.8
0.55
10
7
10
Page:7
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ST1112S
The products listed herein are designed for ordinary electronic applications, such as
electrical appliances, audio-visual equipment, communications devices and so on.
Hence, it is advisable that the devices should not be used in medical instruments,
surgical implants, aerospace machinery, nuclear power control systems,
disaster/crime-prevention equipment and the like. Misusing those products may
directly or indirectly endanger human life, or cause injury and property loss.
Silicon Touch Technology, Inc. will not take any responsibilities regarding the
misusage of the products mentioned above. Anyone who purchases any products
described herein with the above-mentioned intention or with such misused applications
should accept full responsibility and indemnify. Silicon Touch Technology, Inc. and its
distributors and all their officers and employees shall defend jointly and severally
against any and all claims and litigation and all damages, cost and expenses associated
with such intention and manipulation.
SP-ST1112S-A.007
Version:A.007
Page:8
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