Packaged PIN Diodes RoHS Compliant Rev V.9 Maximum Power Dissipation Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ High Power Fast Speed Voltage Ratings to 1500 Volts Wide Selection of Carrier Lifetimes Wide Selection of Capacitances Assortment of Packages Styles Available Screened for Military Applications Description and Applications M/A-COM's broad line of packaged PIN diodes encompasses a comprehensive range of electrical characteristics and package outlines. This diverse union of semiconductor technology and chip packaging gives considerable flexibility to the circuit designer. The fast switching series of packaged PIN diodes utilize a thin I-region and silicon oxide or glass passivated chips which provide for low leakage currents and low insertion loss. Using in process control monitors to regulate wafer fabrication parameters these devices achieve consistent performance in control circuit applications. The high voltage product line of packaged PIN diodes employs M/A-COM's unique CERMACHIP® passivation process which provides for a hard glass encapsulation that hermetically seals the active area of the chip. These ® packaged CERMACHIP PIN diodes are ideally suited for use in high power applications where high RF voltages are present. The diode chips are bonded into sealed ceramic packages that are designed for the most stringent electrical and environmental conditions. A wide choice of packages are available which can be mounted into a variety of microwave and RF circuit media. The Packaged PIN Diodes series are designed to have a high inherent reliability and may be ordered screened to meet many MIL-STD reliability levels. Cathode Heatsink Packages 30,31,32,36,43,94,111,120, 150,255 258,296,1072,1079 Pdiss = T (max Operating)-25°C Thermal Resistance Leaded Packages @+25°C Pdiss = 250mW 144, 186, 276,1088 Surface Mount Package +25°C 1056 Pdiss = 300mW Co-Axial Packages 36 31,32,94 30, 296 120,255 Leaded/Surface Mount Packages Thru Hole 1088 276 1072,1079 1056 186 144 Threaded Packages 1 Absolute Maximum Ratings Parameter Absolution Max. Voltage As Specified in Table Operating Temperature - 65°C to +175°C Storage Temperature Operating and Storage (Case Style 1088) - 65°C to +200°C - 65°C to +125°C 150 111 43 258 Unpackaged Die 1. Operation beyond any one of the above conditions may cause permanent damage to the device. Specifications subject to change without prior notification. 131,132.134 , 212 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macomtech.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make volume is not guaranteed. changes to the product(s) or information contained herein without notice. Packaged PIN Diodes RoHS Compliant Rev V.9 35V to 250V Fast Switching PIN Diodes Specifications (TAMB = +25°C) Minimum Reverse Voltage1 Part Number ( Unless otherwise specified ) Maximum Capacitance ( Unless otherwise specified ) Maximum Series Res. Nominal Characteristics Maximum Thermal Resistance Carrier Lifetime4 TRR5 I-Region Width Microns RS @ 10mA f = 500MHz Ω 2.50 °C/W 60 nS 60 nS 5 µM 12 MA4P202-120 Volts 100 CT @ -10V f = 1MHz pF 0.25 MA4P203-30 100 0.35 1.50 30 100 20 12 MA4P303-32 200 0.35 1.50 30 200 60 20 20 1000 100 30 @ IR <10μA MA4P404-30 3 2 250 0.60 0.40 Notes: 1. 2. 3. 4. 5. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA At VR = -50V Rs measured at IF = +50mA, f = 100MHz. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA Nominal TRR (reverse recovery time) specified with diode biased at IF = +20mA , IREV = -200mA. Package Options Chip 30 31,32, 94 111 120, 255 186 276 1088 1072 1056 131,132 Package dimensions can be found on the M/A-COM website at http://www.macom.com/TechApps/OutlineDrawings.asp 35V to 500V MELF General Purpose Switching Diodes Specifications (TAMB = +25°C) (Unless otherwise specified) Minimum Reverse Voltage2 Maximum Capacitance Maximum Series Res. MA4PH235-1072T IR <10μA Volts 35 CT @10V f = 1MHz pF 1.2 RS @10mA f = 100MHz Ω 0.5 MA4PH236-1072T 200 0.5 3.0 1 Part Number CW Power Dissipation Rating Nominal Characteristics Carrier Lifetime3 I-Region Width Watts 1.0 Typical IF When RS = 75Ω mA — μS 0.3 mils 0.4 1.0 — 1.5 2.0 2.0 — 3.0 3.0 6.0 1.0 0.30-0.60 2.0 4.0 0.8 25.0 2.0 1.20-2.40 6.0 14.0 1.54 0.25@100mA 5.0 — 3.0 2.0 MA4PH237-1079T 200 1.5 MA4PH238-1072T 200 0.5 MA4PH239-1079T 200 MADP-000234-10720T 500 0.6@50mA Notes: 1. Only available in case styles indicated. 2. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA. 3. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA 4. Ct tested at 100V Case Styles 1072, 1079 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macomtech.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make volume is not guaranteed. changes to the product(s) or information contained herein without notice. Packaged PIN Diodes RoHS Compliant Rev V.9 500V PIN Diodes Specifications (TAMB = +25°C) Part Number MA4P504-30 MADP000015-000030 3 MA4P506-30 Minimum Reverse Voltage1 Maximum Capacitance Maximum Series Resistance IR <10μA Volts CT @100V f = 1 MHz pF RS @100mA f = 100 MHz Ω 500 0.40 0.60 500 0.55 500 0.90 CW Power Dissipation Rating Nominal Characteristics Watts Carrier Lifetime2 μS I-Region Width mils 10 1.0 2 0.45 15 2.0 2 0.30 15 3.0 2 Notes: 1. The minimum specified VR (Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA. 2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA 3. To order this part in a package other than 30, use the prefix MA4P505 followed by a dash and the desired package style. Package Options Consult the Package Availability Table in the “Ordering Information” section (pg. 7) for part number choices. Thru 30 31 111 36 120,255 Hole 144 186 258 131, 212 Package dimensions can be found on the M/A-COM website at http://www.macomtech.com/TechApps/OutlineDrawings.asp 500V MELF PIN Diode Specifications (TAMB = +25°C) Minimum Reverse Voltage1 Maximum Capacitance Maximum Series Resistance IR <10μA Volts CT @100V f = 1 MHz pF RS @100mA f = 100 MHz Ω MA4P504-1072T 500 0.5 0.60 MA4P505-1072T 500 0.65 MA4P506-1072T 500 1.0 Part Number CW Power Dissipation Rating Nominal Characteristics Carrier Lifetime2 I-Region Width Watts μS mils 10 1.0 2 0.45 15 2.0 2 0.30 15 3.0 2 Notes: 1. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA. 2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA 1072 Package Specifications subject to change without prior notification. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macomtech.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make volume is not guaranteed. changes to the product(s) or information contained herein without notice. Packaged PIN Diodes RoHS Compliant Rev V.9 1000V CERMACHIP PIN Diodes Specification (TAMB = +25°C) Minimum Reverse Voltage1 Maximum Capacitance Maximum Series Resistance IR <10μA Volts CT @100V f = 1MHz pF Rs @100mA f = 100MHz Ω MA4P604-30 1000 0.50 MA4P606-30 1000 MA4P607-43 1000 Part Number CW Power Dissipation Rating Nominal Characteristics Watts Carrier Lifetime2 μS I-Region Width Mils 1.00 15 3.0 4 0.80 0.70 20 4.0 4 2.00 0.40 25 5.0 4 Notes: 1. The maximum specified VR (reverse voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA 2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA Package Options Consult table in “Ordering Information” section (pg. 7) for availability 30, 296 36 43 131, 212 111 255 258 Package dimensions can be found on the M/A-COM website at http://www.macomtech.com/TechApps/OutlineDrawings.asp 1500V CERMACHIP PIN Diode Specifications (TAMB = +25°C) Part Number MA4P709-150 Minimum Reverse Voltage1 Maximum Capacitance Maximum Series Resistance Maximum Thermal Resistance IR <10μA Volts Ct @100V f = 1MHz pF Rs @200mA f = 100MHz Ω 1500 3.30 0.25 Nominal Characteristics Carrier Lifetime2 I-Region Width °C/W μS mils 2 10.0 7 Notes: 1. The minimum specified VR (reverse voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10μA 2. Nominal carrier life time specified with diode biased at IF = +10mA , IREV = -6mA Specifications subject to change without prior notification. 150 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macomtech.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make volume is not guaranteed. changes to the product(s) or information contained herein without notice. Packaged PIN Diodes RoHS Compliant Rev V.9 Forward Current vs. Series Resistance MA4P504, MA4P505 and MA4P506 100MHz Series Resistance Rs (Ω) Series Resistance Rs (Ω) Forward Current vs. Series Resistance MA4P202, MA4P203, MA4P303 and MA4P404 100MHz Forward Current (IF) Forward Current (IF) Forward Current vs. Series Resistance MA4P709 100MHz Series Resistance Rs (Ω) Series Resistance Rs (Ω) Forward Current vs. Series Resistance MA4P604, MA4P606 and MA4P607 100MHz Forward Current (IF) Forward Current (IF) ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macomtech.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make volume is not guaranteed. changes to the product(s) or information contained herein without notice. Packaged PIN Diodes RoHS Compliant Rev V.9 Recommended Groups B&C Testing Per MIL-STD 750 Recommended methods and conditions for Groups B and C, TX and TXV level screening. Recommended Screening Per MIL-STD 750 Recommended methods and conditions for TX and TXV level screening. Inspection Method Condition Inspection Method Condition Storage Temperature 1031 See Maximum Ratings Internal Visual and / or X-Ray 2072, 2076 See Note Operating Temperature —— See Maximum Ratings High Temp. Storage 1032 48 hours min. @ max. storage temp. Temperature Cycling 1051 5 cycles - 65°C to +150°C Thermal Shock 1051 10 Cycles Shock 2016 500g’s Constant Acceleration 2006 20,000 g's, Y1 Vibration 2056 15g’s Fine Leak 1071 H Constant Acceleration 2006 20,000g’s Gross Leak 1071 C or E Humidity 1021 10 Days Electrical —— See Note Burn-In 1038 See Note Notes: 1. Conditions and details of test depend on specific model number. Information available upon request. 2. Case styles 1056 and 1088 are not military, MIL-STD-750, rated packages. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macomtech.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make volume is not guaranteed. changes to the product(s) or information contained herein without notice. Packaged PIN Diodes RoHS Compliant Rev V.9 Maximum Soldering Temperature For hand soldering operation: Case Style: 144,150*,186, 258*, 1088, 1072, 1079 ♦ 265°C maximum for 5 seconds Case Style: 120, 255, 276 ♦ 265°C maximum for 5 seconds. Case Style: 30*, 31, 32, 36*, 43*, 94, 111* , 296* ♦ 225°C maximum for 5 seconds. *Note: Package styles that are threaded or have pronged ends rely on a pressure connection and do not require solder attachment but can be soldered if desired. For solder reflow profiles: Refer to application note M-538 on the M/A-COM website using the following link: http://www.macomtech.com/Application%20Notes/pdf/M538.pdf Ordering Information The Packaged PIN Diode specifications shown in the tables on pages 2, 3, & 4 are for the standard style package. The standard package style is indicated by the number following the dash after the base part number. Note that the specification tables lists the total diode capacitance for the standard case style. The total capacitance for the base part in an alternative package will differ and is computed by adding the junction capacitance of the chip and the parasitic capacitance of the alternative package as defined in the Package Parasitic Capacitance table below. To compute the chip junction capacitance, subtract the total capacitance shown in the specifications tables on pages 2, 3, & 4 from the appropriate standard style package capacitance below The various base part numbers are only available in the case styles shown in the Package Availability Table below. To order, indicate the base part number followed by a dash and the desired package style. For example: The MA4P506-258 is the MA4P506 chip in the 258 style package. Package Availability Table Base Part Number MA4P202 MA4P203 MA4P303 MA4P404 MA4P504 MA4P505 MA4P506 MA4P604 MA4P606 MA4P607 MA4P709 MADP000015-000030 MA4PH235 MA4PH236 MA4PH237 MA4PH238 MA4PH239 MADP-000234 Available ODS Package Styles 120, 134, 276, 1056 30, 32, 94, 111, 134, 1056 32, 36, 94, 120, 186, 255, 1088 30, 31, 36, 111, 132, 258,1072T* 30, 120, 132, 144, 186, 255,1072T* 36, 131, 255, 1072T* 30, 31, 36, 131, 255, 258, 1072T* 30, 43, 131, 255, 258 30, 36, 131, 258 43, 212, 296 150 30 1072T* 1072T* 1079T* 1072T* 1079T* 10720T* (1072 package style) *Note: “T” after the package style number indicates tape and reel. Package Parasitic Capacitance Package Style 30 31 32 36 43 94 111 120 131 132 134 144 186 212 255 258 276 296 1056 1072 1079 1088 Cap. (pF) 0.18 0.18 0.30 0.18 0.75 0.15 0.27 0.13 N/A (chip) N/A (chip) N/A (chip) 0.42 0.15 N/A (chip) 0.30 0.18 0.13 0.35 0.20 0.16 0.13 0.12 Tape and reel information can be found on the M/A-COM website at http://www.macomtech.com/Application%20Notes/pdf/M513.pdf Package dimensions can be found on the M/A-COM website at http://www.macomtech.com/TechApps/OutlineDrawings.asp ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macomtech.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make volume is not guaranteed. changes to the product(s) or information contained herein without notice.