LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts LURFUYH9553/TR1 DATA SHEET DOC. NO : QW0905-LURFUYH9553/TR1 REV. : A DATE : 15 -Apr - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFUYH9553/TR1 Page 1/8 Package Dimensions 3.5 3.2 1.95 4 3 0.7±0.05 2.6 0.7±0.05 2.8 1 2 0.7±0.05 2.2 0.7±0.05 0.6 1.95 1.05 - 4 +1 UYH 1.5 0.9 URF 3 + 2 - 0.9 Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0 2.0 0.23 1.55 1.75 5.5 12.0±0.3 4.06 9.3 4.0 3.12 Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm. 2.24 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFUYH9553/TR1 Page 2/8 Reel Dimensions 16.0±1.0 ψ178±2.0 14.2±1.0 74.0±1.5 Part No. Description Quantity/Reel LURFUYH9553/TR1 12.0mm tape,7"reel 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LURFUYH9553/TR1 Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Symbol Parameter UNIT URF UYH Forward Current IF 50 50 mA Peak Forward Current Duty 1/10@10KHz IFP 130 100 mA Power Dissipation PD 120 130 mW Reverse Current @5V Ir 10 10 μA Electrostatic Discharge ESD 2000 2000 V Operating Temperature Topr -40 ~ +85 -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 -40 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP Spectral halfwidth △λ nm Lens Red LURFUYH9553/TR1 Dominant wave length λDnm Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Min. Max. Min. Typ. Viewing angle 2θ 1/2 (deg) 630 20 1.5 2.4 125 320 120 590 20 1.7 2.6 200 500 120 Water Clear AlGaInP/GaP Yellow Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFUYH9553/TR1 Page 4/8 Typical Electro-Optical Characteristics Curve URF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 1000 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 Forward Voltage@20mA Normalize @25 ℃ 100 10 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature(℃) Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 0° 1.0 -30° 30° -60° 60° 0.5 100% 75% 50% 0 550 600 650 Wavelength (nm) 700 25% 0 25% 50% 75% 100% 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFUYH9553/TR1 Page 5/8 Typical Electro-Optical Characteristics Curve UY(H) CHIP Fig.1 Forward Current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 4.0 5.0 1.0 10 1000 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Relative Intensity@20mA Normalize @25 ℃ 1.2 Forward Voltage@20mA Normalize @25 ℃ 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 0° -30° 1.0 30° -60° 60° 0.5 100% 75% 50% 0.0 500 550 600 Wavelength (nm) 650 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFUYH9553/TR1 Page 6/8 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280 ℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3. LEAD Reflow Solder Temp. (℃ ) 240 Rising +5 ℃/sec Cooling -5 ℃/sec Preheat 150 120 60 ~ 120 sec Time 5sec 4. PB-Free Reflow Solder 1~5° C/sec Preheat 180~200° C 1~5° C/sec 260° C MaX. 10sec.Max Above 220° C 60 sec.Max. 120 sec.Max. Note: 1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFUYH9553/TR1 Page 7/8 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURFUYH9553/TR1 Page 8/8 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta=65 ℃±5 ℃ 3.RH=90 %~95% 4.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling Solderability Test 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃±5℃ & -40 ℃±5℃ (10min) (10min) 3.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Immersion rate 25 ±2.5mm/sec 4.Immersion rate 25 ±2.5mm/sec 5.Coverage ≧ 95% of the dipped surface MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 1.105 ℃ 25℃ 55℃ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Ramp-up rate(183 ℃ to Peak) +3 ℃ second max Temp. maintain at 125( ±25)℃ 120 seconds max Temp. maintain above 183 ℃ 60-150 seconds Peak temperature range 235 ℃+5-0 ℃ Time within 5 ℃ of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate +6 ℃/second max MIL-STD-750D:2031.2 J-STD-020