Technical Data Sheet 0603 Package Chip LED (0.6mm Height) 19-213/B7C-AQ2S1B2/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS complaint version Descriptions ․The 19-213 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. 19-213/B7C-AQ2S1B2/3T Chip Material Emitted Color Resin Color Blue Water Clear InGaN Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 1 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Package Outline Dimensions Note: The tolerances unless mentioned are ±0.1mm, unit = mm. Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 2 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 30 mA IFP 100 mA Power Dissipation Pd 110 mW Electrostatic Discharge(HBM) ESD 1000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Peak Forward Current (Duty 1/10 @1KHz) Reflow Soldering:260 ℃ for 10 sec Hand Soldering:350℃ for 3 sec Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Luminous Intensity Iv 90.0 ----- 225 mcd Viewing Angle 2θ1/2 ----- 120 ----- deg Peak Wavelength Dominant Wavelength λp ----- 468 ----- nm λd 464.5 ----- 476.5 nm Spectrum Radiation Bandwidth △λ ----- 25 ----- nm Forward Voltage VF 2.90 ----- 3.60 V Reverse Current IR ----- ----- 50 μA Condition IF =20mA VR =5V Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.05 V Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 3 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Bin Range Of Dom. Wavelength Group A Bin Min Max A9 464.5 467.5 A10 467.5 470.5 A11 470.5 473.5 A12 473.5 476.5 Unit Condition nm IF =20mA Unit Condition mcd IF =20mA Unit Condition V IF =20mA Bin Range Of Luminous Intensity Bin Min Max Q2 90.0 112 R1 112 140 R2 140 180 S1 180 225 Bin Range Of Forward Voltage Group B2 Bin Min Max 36 2.90 3.00 37 3.00 3.10 38 3.10 3.20 39 3.20 3.30 40 3.30 3.40 41 3.40 3.50 42 3.50 3.60 Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.05 V Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 4 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Forward Current vs. Forward Voltage Ta=25°C Spectrum Distribution Ta=25°C 100 Forward Current FI (mA) Relative luminous intensity (% ) Typical Electro-Optical Characteristics Curves 75 50 25 50 40 30 20 10 0 0 Forward Voltage (VF)-volts Wavelength λ (nm) Luminous Intensity vs Luminous Intensity vs. Ambient Temperature Relative luminous intensity Ta=25°C Forward Current 1000 100 10 1 -60 -40 -20 0 20 40 60 80 100 Forward Current Ambient Temperature Ta (°C) Radiation Diagram Forward Current Derating Curve 0° 50 10° Ta=25°C 20° 30° Forward Current 40 40° 30 1.0 20 0.9 50° 0.8 60° 10 70° 0.7 0 0 20 40 60 85 100 Ambient Temperature Ta (°C) Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 80° 90° 0.5 0.3 0.1 0.2 Rev.1 0.4 0.6 Page: 5 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Label explanation EVERLIGHT Pb CAT: Luminous Intensity Rank CPN : P N : XXXXXXXXXXXXX HUE: Dom. Wavelength Rank RoHS XXXXXXXXXXXXX REF: Forward Voltage Rank CAT : XXX HUE : XXX REF : XXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned are ±0.1mm, unit = mm. Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 6 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned are ±0.1mm, unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Desiccant Rev.1 Label Page: 7 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% Test Sample Hours/Cycles Size No. Items Test Condition 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5sec. 6 Min. 22 PCS. 0/1 Temperature Cycle H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1 Thermal Shock H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1 Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1 Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 2 3 High Temperature Storage Low Temperature Storage 4 5 Ac/Re 6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1 Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 8 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 9 of 10 Prepared by: Chen Zheng 19-213/B7C-AQ2S1B2/3T 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com Everlight Electronics Co., Ltd. http://www.everlight.com Device No: Prepared date:1-Jul-2011 Rev.1 Page: 10 of 10 Prepared by: Chen Zheng