MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN52 8x8, 0.5P CASE 485M−01 ISSUE C 1 52 D SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ PIN ONE REFERENCE DATE 16 FEB 2010 B DIM A A1 A2 A3 b D D2 E E2 e K L E 2X 0.15 C 2X 0.15 C A2 0.10 C GENERIC MARKING DIAGRAM A 0.08 C SEATING PLANE A3 A1 1 REF C XXXXXXXXX XXXXXXXXX AWLYYWWG D2 14 52 X L 26 27 13 XXXXXXXXX A WL YY WW G E2 39 1 52 X K MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.60 0.80 0.20 REF 0.18 0.30 8.00 BSC 6.50 6.80 8.00 BSC 6.50 6.80 0.50 BSC 0.20 --0.30 0.50 52 40 e 52 X b = Device Code = Assembly Site = Wafer Lot = Year = Work Week = Pb−Free Package RECOMMENDED SOLDERING FOOTPRINT NOTE 3 0.10 C A B 8.30 0.05 C 52X 0.62 6.75 6.75 PKG OUTLINE DOCUMENT NUMBER: 98AON12057D 0.50 PITCH 8.30 52X 0.30 DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STANDARD STATUS: © Semiconductor Components Industries,ON LLC,SEMICONDUCTOR 2002 1 Outline Number: versions are uncontrolled exceptCase when stamped October, 2002 − Rev. 01O 485M “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: 2002 − Rev. 0 PAGE 1 OFXXX 2 52 PIN QFN, 8X8, 0.5P 1 DOCUMENT NUMBER: 98AON12057D PAGE 2 OF 2 ISSUE REVISION DATE A CHANGED DIMENSIONS B AND L. REQ. BY P. CELAYA. 30 JUN 2005 B CORRECTED DIMENSION L LABEL REFERENCE ON BOTTOM VIEW. REQ. BY P. CELAYA 14 OCT 2008 C ADDED SOLDERING FOOTPRINT. REQ. BY E. RUPNOW. 16 FEB 2010 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2010 February, 2010 − Rev. 01C Case Outline Number: 485M