MAAM02350 Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz Features • • • • Rev. V4 Pad Layout High Gain: 19 dB Typical Output Power: +14 dBm Typical Noise Figure: 3.7 dB Typical RoHS* Compliant Description M/A-COM’s MAAM02350 is a wide band, MMIC amplifier. It includes two integrated gain stages and employs resistive feedback to obtain flat gain and a good, 50 ohm input, and output impedance match over a very wide bandwidth. The MAAM02350 operates from a single +6 V supply. It is fully monolithic. The MAAM02350 functions well as a generic IF, driver or buffer amplifier where high gain, low noise figure, excellent linearity and low power consumption are important. Because of its wide bandwidth, the MAAM02350 can be used in numerous commercial and government system applications, such as wireless communications, EW and radar. Die Size—Inches (mm) 0.044 x 0.032 x 0.004 (1.140 x 0.820 x 0.102) Outline Drawing The MAAM02350 is manufactured in-house using a reliable, 0.5-micron, GaAs MESFET process. This product is 100% RF tested to ensure compliance to performance specifications. Absolute Maximum Ratings 1,2 Parameter Absolute Maximum VDD +7 V Input Power Channel Temperature +20 dBm 3 +150°C Operating Temperature -55°C to +100°C Storage Temperature -65°C to +150°C 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM does not recommend sustained operation near these survivability limits. 3. Typical thermal resistance (θjc) = +80°C/W. Ordering Information 4,5 Part Number Package MAAM02350 DIE 4. Reference Application Note M538 for lead-free solder reflow recommendations. 5. Die quantity varies. * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MAAM02350 Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz Rev. V4 Electrical Specifications: TA = 25°C, VDD = +6 V, Z0 = 50 Ω Parameter Test Conditions Units Min. Typ. Max. Gain 0.2 - 3.0 GHz, PIN = -30 dBm dB 17 19 — Gain Flatness 0.2 - 3.0 GHz, PIN = -30 dBm dB — ± 0.5 — Noise Figure 0.2 - 3.0 GHz dB — 3.7 4.1 Input VSWR 0.2 - 3.0 GHz, PIN = -30 dBm Ratio — 1.8:1 — Output VSWR 0.2 - 3.0 GHz, PIN = -30 dBm Ratio — 1.5:1 — Output 1 dB Compression 0.2 - 3.0 GHz dBm — +14 — OIP3 0.2 - 3.0 GHz, PIN = -30 dBm dBm — 24 — Reverse Isolation 0.2 - 3.0 GHz, PIN = -30 dBm dB — 35 — Bias Current — mA — 65 100 Schematic Typical Bias Configuration Handling Procedures Please observe the following precautions to avoid damage: 6. Self-bias operation is obtained by connecting +6 volts to both VDD and VDD’ pads, grounding pad S1, and connecting pads GND1 and GND2 to separate bypass 500 pF MOS capacitors. Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MAAM02350 Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz Rev. V4 Typical Performance @ +25°C VSWR Gain 3.5 25 3.0 Input VSWR Output VSWR 20 2.5 15 2.0 10 1.5 1.0 5 0 1 2 3 4 5 Frequency (GHz) 0 1 2 3 4 5 Frequency (GHz) Noise Figure 5 4 3 2 1 0 1 2 3 4 5 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MAAM02350 Wide Band GaAs MMIC Amplifier 0.2 - 3.0 GHz Rev. V4 Handling Bonding Permanent damage to the MAAM02350 may occur if the following precautions are not adhered to: A. Cleanliness - The MAAM02350 should be handled in a clean environment. Do not attempt to clean assembly after the MAAM02350 is installed. B. Static Sensitivity - All die handling equipment and personnel should comply with DOD-STD1686 Class 1. C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAM02350. Use shielded signal and bias cables to minimize inductive pick-up. D. General Handling - DO NOT touch the surface of the die. It is recommended that the MAAM02350 die be handled along the long side with a sharp pair of tweezers. A. Ball or wedge bond with 1.0 mil diameter gold wire or 3.0 mil x 0.5 mil ribbon. Thermosonic bonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable bonds. B. Bonds should be started on the die and terminated on the package. RF bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended. C. Bonding pads are 4.0 x 4.0 mils. Mounting The MAAM02350 is back-metallized with Pd/Ni/Au (100/1,000/30,000Å) metallization. It can be diemounted using Au/Sn eutectic performs or a thermally and electrically conductive epoxy. The attachment surface should be clean and flat. Eutectic Die Attach: A. An 80/20 Au/Sn perform is recommended with a work surface temperature of approximately 225°C and a tool temperature of 265°C. When hot 95/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290°C. B. DO NOT expose the MAAM02350 to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MAAM02350 into position. A thin epoxy fillet should be visible around the perimeter of the die. B. Cure epoxy per manufacturer’s recommended schedule. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.