MICREL MIC2250YML

MIC2250
High-Efficiency Low EMI
Boost Regulator
General Description
Features
The MIC2250 is a general purpose DC/DC boost switching
regulator that features low noise, EMI reduction circuitry,
and high efficiency across a wide output current range.
The MIC2250 is optimized for noise-sensitive hand held
battery powered applications. A proprietary control method
allows low ripple across the output voltage and current
ranges. The MIC2250 incorporates a pseudo-random
dithering function to reduce EMI levels up to 10dB enabled
by the DITH pin.
The MIC2250 is designed for use with inductor values from
4.7µH to 22µH, and is stable with ceramic capacitors from
1µF to 22µF.
The MIC2250 attains a high peak efficiency up to 90% at
100mA and excellent light load efficiency of 80% at 1mA.
High power density is achieved with the MIC2250’s
internal 34V/2A rated switch, allowing it to power large
loads in a tiny footprint.
®
The MIC2250 is available in a 8-pin 2mm x 2mm MLF
leadless package option with an operating junction
temperature range of –40°C to +125°C.
Data sheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
• Over 80% efficient for a 300:1 load range
• 2.5V to 5.5V input voltage range
• Output voltage adjustable to 32V
• 2A switch current
• 52µA (typ) quiescent current
• Constant peak current control reduces output ripple
• EMI reduction circuitry
• Stable with small ceramic capacitors
• <1µA shutdown current
• UVLO and thermal shutdown
• 8-pin 2mm x 2mm leadless MLF® package
• –40°C to +125°C junction temperature range
Applications
• LCD/OLED display bias supply
• CCD bias supply
• Mobile Phones, PDA, Media Players, GPS PND
• Haptic displays
• Local 5V, 15V, 24V rail
___________________________________________________________________________________________________________
Typical Application
MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
May 2010
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Micrel, Inc.
MIC2250
Ordering Information
Part Number
Marking(1)
Junction Temp. Range
Package(3)
Lead Finish
MIC2250YML
ZAA(2)
–40° to +125°C
8-Pin 2mm x 2mm MLF®
Pb-Free
Note:
1.
Pin 1 identifier = “•”.
2.
Overbar (
3.
MLF® is GREEN RoHs compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free.
) may not be to scale.
Pin Configuration
8-Pin 2mm x 2mm MLF® (ML)
(Top View)
Pin Description
Pin Number
May 2010
Pin Name
Pin Function
1
FB
2
AGND
Analog Ground. Connect to power ground.
3
PGND
Power Ground.
4
SW
Switch Node (Input): Internal power NMOS drain.
5
NC
Not Internally Connected.
6
VIN
7
DITH
8
EN
EPAD
GND
Feedback (Input): 1.24V output voltage sense node. VOUT = 1.24V (1 + R1/R2)
Supply (Input): 2.5V to 5.5V input voltage.
Frequency Dithering (Input): Connect this pin high to enable pseudo-random ontime dithering to reduce EMI. Connect this pin-to-ground to disable this function.
Enable (Input): Logic high enables the regulator. Logic low shuts down the
regulator. Do not leave floating.
Ground (Return): Exposed backside pad. Connect to power ground.
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MIC2250
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VIN) .........................................................6V
Switch Voltage (VSW)....................................... –0.3V to 34V
Enable Voltage (VEN)......................................... –0.3V to VIN
FB Voltage (VFB)...............................................................6V
Switch Current (ISW) ......................................................3.5A
Ambient Storage Temperature (Ts) ..........–65°C to +150°C
ESD Rating(4) ................................................. ESD Sensitive
Supply Voltage (VIN)......................................... 2.5V to 5.5V
Enable Voltage (VEN).............................................. 0V to VIN
Junction Temperature (TJ)(3) ..................... –40°C to +125°C
Junction Thermal Resistance
2mm x 2mm MLF®-8 (θJA)..................................90°C/W
Electrical Characteristics(5)
VIN = VEN = 3.6V; VDITH = 0V; VOUT = 15V; IOUT = 40mA; TA = 25°C, unless otherwise noted. Bold values indicate
–40°C ≤ TJ ≤ +125°C.
Symbol
Parameter
VIN
Input Voltage Range
Condition
Min
VULVO
Under-voltage Lockout
VIN rising
IQ
Quiescent Current
VFB = 1.5V (not switching)
ISD
Shutdown Current
VEN = 0V, Note 6
VFB
Feedback Voltage
IFB
Feedback Input Current
Typ
2.5
1.8
1.20
–40°C ≤ TJ ≤ +125°C
Max
Units
5.5
V
2
2.4
V
52
80
µA
0.1
1
µA
1.24
1.277
V
1.19
1.29
V
VFB = 1.24V
10
nA
1
ms
VIN = 3.6V
1.6
µs
87
%
±20
%
PFM Operation
Tss
Soft Start time
tSW
Switch Off-time
DMAX
Maximum Duty Cycle
tDITH
Off-time Dithering
VDITH = 3.6V. Percentage from nominal.
Line Regulation
3V ≤ VIN ≤ 5V
0.3
2
%
Load Regulation
1mA ≤ IOUT ≤ 40mA
0.1
2
%
ISW
Switch Current Limit
Note 7
RON
Switch ON-resistance
ISW = 200mA
0.5
1
Ω
ISW
Switch Leakage Current
VEN = 0V, VSW = 10V
0.01
5
µA
VEN,
VDITH
Logic Input Thresholds
Turn ON
IEN
Enable Pin Current
T
Thermal Shutdown Threshold
75
0.9
2
A
V
1.5
Turn OFF
VEN = VIN = 5.0V
0.1
Hysteresis
0.4
V
2
µA
170
°C
10
°C
Notes:
1. Absolute maximum ratings indicate limits beyond which damage to the component may occur.
2. The device is not guaranteed to function outside its operating rating.
3. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(Max), the junction-to-ambient thermal resistance, θ JA,
and the ambient temperature, TA. The maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into
thermal shutdown.
4. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5kΩ in series with 100pF.
5. Specification for packaged product only.
6. ISD = IVIN.
7. Guaranteed by design.
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MIC2250
Typical Characteristics
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MIC2250
Functional Characteristics
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Functional Characteristics (continued)
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Functional Diagram
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MIC2250
PGND
The power ground pin is the high current path to ground.
The current loop for the power ground should be as
small as possible and separate from the analog ground
(AGND). Refer to the layout recommendations for more
details.
Functional Description
VIN
The input supply (VIN) provides power to the internal
MOSFETs and control circuitry for the switch mode
regulator. The operating input voltage range is from 2.5V
to 5.5V. An input capacitor with a minimum voltage
rating of 6.3V is recommended. Refer to the layout
recommendations for details.
AGND
Analog ground (AGND) is the ground path for the biasing
and control circuitry. The current loop for the signal
ground should be separate from the power ground
(PGND) loop. Refer to the layout recommendations for
more details.
EN
A logic level input of 1.5V or higher enables the
regulator. A logic input of 0.4V or less places the
regulator in shutdown mode which reduces the supply
current to less than 1µA. The MIC2250 features built-in
soft start circuitry that reduces in-rush current and
prevents the output voltage from overshooting during
startup. Do not leave the Enable pin floating.
DITH
The DITH function is a frequency dithering technique
that reduces EMI noise by spreading the boost
regulators’ noise spectrum. This technique reduces the
EMI peaks by distributing the switching frequency across
a wider spectrum. Connect this pin high to enable the
pseudo-random on-time dithering. Connect this pin to
ground to disable this function.
SW
The MIC2250 has an internal MOSFET switch that
connects directly to one end of the inductor (SW pin) and
provides a current path to ground during switching
cycles. The source of the internal MOSFET connects
through a current sense resistor to ground.
FB
The feedback pin (FB) allows the regulated output
voltage to be set by applying an external resistor divider
network. The internal reference voltage is 1.24V. The
output voltage is calculated from the following equation:
⎛ R1 ⎞
VOUT = 1.24V⎜1+
⎟
⎝ R2 ⎠
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MIC2250
signal (output voltage is high) will conversely, increase
off time to reduce energy transfer to the output.
Application Information
Overview
The MIC2250 Boost Regulator utilizes a combination of
PFM & Current Mode Control to achieve very high
efficiency over a wide range of output load. This
innovative design is the basis for the regulator’s high
efficiency, excellent stability, and self compensation
technique. The boost regulator performs a power
conversion that results in an output voltage that is
greater than the input. Operation starts with activating an
internal MOSFET switch which draws current through
the inductor (L1). While one end of the inductor is fixed
at VIN, the other end is switched up and down. While the
switch is on, the current through the inductor increases.
When the switch is off the inductor current continues to
flow through the output diode.
The current flow imposes a voltage across the inductor,
which is added to VIN to produce a higher voltage VOUT.
At low power levels (typically less than 1W), the period
varies between switching cycles, indicative of Pulse
Frequency Modulation (PFM). As the output power
increases beyond approximately 1W, the period between
switching cycles continues to decrease and the power
(switch current) delivered with each cycle increases
indicative of Current Mode control.
Component Selection
Resistors
An external resistive divider network (R1 and R2) with its
center tap connected to the feedback pin sets the output
voltage. The appropriate R1 and R2 values for the
desired output voltage are calculated by:
R2 =
⎛ VOUT
⎞
⎜⎜
− 1⎟⎟
1.24V
⎝
⎠
Large resistor values are recommended to reduce light
load operating current, and improve efficiency. The table
below gives a good compromise between quiescent
current and accuracy. Additionally, a feedforward
capacitor (CFF) (placed in parallel with R1) may be added
to improve transient performance. Recommended values
are suggested below:
PFM Regulation
The error amplifier compares the regulator’s reference
voltage with the feedback voltage obtained from the
output resistor voltage divider network. The resulting
error voltage acts as a correction input signal to the
control block. The control block generates two signals
that turn on and off the output MOSFET switch. An
increase in load current causes VOUT and VFB to
decrease in value. The control loop then changes the
switching frequency to increase the energy transferred to
the output capacitor to regulate the output voltage. A
reduction in load causes VOUT and VFB to increase. Now
the control loop compensates by reducing the effective
switching frequency, thus reducing the amount of energy
delivered to the output capacitor in order to keep the
output voltage within regulation.
VOUT
Suggested R1
CFF
5V to 10V
100k
4.7nF
10V to 15V
240k
2.2nF
15V to 32V
1M
470pF
Figure 1. Typical Application Circuit
Inductor
Inductor selection is a balance between efficiency,
stability, cost, size, and rated current. For most
applications, inductors in the range 4.7uH to 22uH are
recommended. Larger inductance values reduce the
peak-to-peak ripple current, thereby reducing both the
DC losses and the transition losses for better efficiency.
The inductor’s DC resistance (DCR) also plays an
important role. Since the majority of the input current
(minus the MIC2250 operating current) is passed
through the inductor, higher DCR inductors will reduce
efficiency at higher load currents. Figure 2 shows the
comparison of efficiency between a 140mΩ DCR, 4.7uH
inductor and a 190mΩ DCR, 10uH inductor. The switch
current limit for the MIC2250 is typically 2A. The
Current Mode Regulation
The control block’s oscillator starts the cycle by setting
the MOSFET switch control flip flop. The switch then
turns on. This flip flop is reset when the switch current
ramp reaches the threshold set by the error amplifier. If
the error amplifier indicates that VFB is either too high or
too low, then the threshold for the comparator measuring
the switch current is appropriately adjusted to bring VOUT
back to within regulation limits. The level of the error
signal also sets the off time of the switch. A higher error
signal (output voltage is low) will reduce off time to
increase energy transfer to the output. A lower error
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MIC2250
saturation current rating of the selected inductor should
be 20-30% higher than the 2A specification for proper
operation.
performance.
Output Capacitor
Output capacitor selection is also a trade-off between
performance, size, and cost. Increasing COUT will lead to
an improved transient response however the size and
cost also increase. X5R and X7R ceramic capacitors are
recommended. For most applications, 2.2uF to 22uF
should be sufficient.
Diode
The MIC2250 requires an external diode for operation.
The diode must be rated for the peak inductor current,
and its reverse voltage rating must be greater than the
output voltage. A Schottky diode is recommended for
lower output voltages due to its lower forward voltage
drop and reverse recovery time. However, at higher
output voltages (>10V), a high speed diode such as
LS4148 can be more efficient as it has the advantage of
considerably lower leakage currents, especially at higher
temperatures. This will greatly improve light load
efficiency when compared to a Schottky diode.
o
For example: At 70 C ambient temperature, VIN = 2.5V,
VOUT= 24V at no load.
Input current (Vishay SL04 Schottky) = 2.1mA
Input current (Generic LS4148) = 0.37mA
Figure 2. Efficiency Comparison between Lower
and Higher Inductor Values
Input Capacitor
The boost converter exhibits a triangular current
waveform at its input, so an input capacitor is required to
decouple this waveform and thereby reduce the input
voltage ripple. A 10uF to 22uF ceramic capacitor should
be sufficient for most applications. A minimum input
capacitance of 1uF is recommended. The input capacitor
should be as close as possible to the inductor and the
MIC2250, with short PCB traces for good noise
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MIC2250
MIC2250 Schematic
Bill of Materials
Item
Part Number
C2012X5R0J106K
C1
Manufacturer
TDK
VJ0805G106KXYAT
Vishay Vitramon(2)
08056D106KAT
AVX(3)
Murata
C2012X5R1E225K
TDK(1)
08053C225MAT
AVX(3)
GRM21R61E225KE36D
Murata(4)
LS4148
Vishay(2)
D1
LS04
VLF5012ST-100M1R0
L1
LPS4018-100
Qty.
Capacitor, 10µF, 6.3V, X5R
1
Capacitor, 2.2µF, 25V, X5R
1
(4)
GRM21BR60J106M
C3
Description
(1)
High Speed Diode, 75V, 300mA
(2)
Vishay
TDK(1)
Coilcraft
1
Schottky Diode, 40V, 1A
10µH
(5)
1
10µH, 10%
CDRH4D28NP-100NC
Sumida(6)
R1
CRCW06031004FKEYE3
Vishay Dale(2)
Resistor, 1M, 1%. 1/16W, Size 0603
1
R2
CRCW06039012FKEYE3
Vishay Dale(2)
Resistor, 90.1k, 1%. 1/16W, Size 0603
1
High-Efficiency Low EMI Boost Regulator
1
U1
MIC2250YML
Micrel, Inc.
10µH, 1.26A
(7)
Notes:
1. TDK: www.tdk.com.
2. Vishay: www.vishay.com.
3. AVX: www.avx.com.
4. Murata: www.murata.com.
5. Coilcraft: www.coilcraft.com.
6. Sumida: www.sumida.com.
7. Micrel, Inc.: www.micrel.com.
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MIC2250
PCB Layout Recommendations
Top Layer
Bottom Layer
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MIC2250
Package Information
8-Pin 2mm x 2mm MLF® (ML)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2008 Micrel, Incorporated.
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