MC74HC365A Hex 3-State Noninverting Buffer with Common Enables High−Performance Silicon−Gate CMOS The MC74HC365A is identical in pinout to the LS365. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device is a high−speed hex buffer with 3−state outputs and two common active−low Output Enables. When either of the enables is high, the buffer outputs are placed into high−impedance states. The HC365A has noninverting outputs. http://onsemi.com MARKING DIAGRAMS 16 PDIP−16 N SUFFIX CASE 648 16 1 1 Features • • • • • • • • MC74HC365AN AWLYYWWG Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A Chip Complexity: 90 FETs or 22.5 Equivalent Gates These are Pb−Free Devices* 16 SOIC−16 D SUFFIX CASE 751B 16 1 HC365AG AWLYWW 1 16 16 1 TSSOP−16 DT SUFFIX CASE 948F HC 365A ALYWG G 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2009 December, 2009 − Rev. 2 1 Publication Order Number: MC74HC365A/D MC74HC365A OUTPUT ENABLE 1 A0 1 16 2 15 Y0 3 14 VCC OUTPUT ENABLE 2 A5 A1 4 13 Y5 Y1 5 12 A4 A2 6 11 Y4 Y2 7 10 A3 GND 8 9 Y3 A0 A1 A2 A3 A4 Figure 1. Pin Assignment A5 1 OUTPUT ENABLE 1 15 OUTPUT ENABLE 2 FUNCTION TABLE Inputs Output Enable 1 Enable 2 A Y L L H X L L X H L H X X L H Z Z 2 3 4 5 6 7 10 9 12 11 14 13 Y0 Y1 Y2 Y3 Y4 Y5 PIN 16 = VCC PIN 8 = GND Figure 2. Logic Diagram X = don’t care Z = high impedance ORDERING INFORMATION Package Shipping† MC74HC365ANG PDIP−16 (Pb−Free) 500 Units / Rail MC74HC365ADG SOIC−16 (Pb−Free) 48 Units / Rail MC74HC365ADR2G SOIC−16 (Pb−Free) 2500 Units / Reel TSSOP−16* 2500 Units / Reel Device MC74HC365ADTR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74HC365A MAXIMUM RATINGS* Symbol Parameter Value Unit – 0.5 to + 7.0 V DC Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V DC Output Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V VCC DC Supply Voltage (Referenced to GND) Vin Vout Iin DC Input Current, per Pin ± 20 mA Iout DC Output Current, per Pin ± 25 mA ICC DC Supply Current, VCC and GND Pins ± 50 mA PD Power Dissipation in Still Air, 750 500 450 mW Tstg Storage Temperature – 65 to + 150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package Plastic DIP† SOIC Package† TSSOP Package† This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. _C 260 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. †Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V Min Max Unit 2.0 6.0 V 0 VCC V – 55 + 125 _C 0 0 0 0 1000 600 500 400 ns DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Test Conditions VCC V – 55 to 25_C v 85_C v 125_C Unit VIH Minimum High−Level Input Voltage Vout = VCC – 0.1 V |Iout| v 20 μA 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 V VIL Maximum Low−Level Input Voltage Vout = 0.1 V |Iout| v 20 μA 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 V VOH Minimum High−Level Output Voltage Vin = VIH |Iout| v 20 μA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 Vin = VIH |Iout| v 3.6 mA |Iout| v 6.0 mA |Iout| v 7.8 mA http://onsemi.com 3 MC74HC365A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit Symbol VOL Parameter Test Conditions Maximum Low−Level Output Voltage Vin = VIL |Iout| v 20 μA Vin = VIL |Iout| v 3.6 mA |Iout| v 6.0 mA |Iout| v 7.8 mA VCC V – 55 to 25_C v 85_C v 125_C Unit 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ± 0.1 ± 1.0 ± 1.0 μA IOZ Maximum Three−State Leakage Current Output in High−Impedance State Vin = VIL or VIH Vout = VCC or GND 6.0 ± 0.5 ± 5.0 ± 10 μA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0 μA 6.0 4 40 160 μA AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Guaranteed Limit VCC V – 55 to 25_C v 85_C v 125_C Unit tPLH, tPHL Maximum Propagation Delay, Input A to Output Y (Figures 1 and 3) 2.0 3.0 4.5 6.0 120 60 24 20 150 75 30 26 180 90 36 31 ns tPLZ, tPHZ Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4) 2.0 3.0 4.5 6.0 220 110 44 37 275 140 55 47 330 170 66 56 ns tPZL, tPZH Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4) 2.0 3.0 4.5 6.0 220 110 44 37 275 140 55 47 330 170 66 56 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 3) 2.0 3.0 4.5 6.0 60 22 12 10 75 28 15 13 90 34 18 15 ns Cin Maximum Input Capacitance — 10 10 10 pF Cout Maximum Three−State Output Capacitance (Output in High−Impedance State) — 15 15 15 pF Symbol Parameter Typical @ 25°C, VCC = 5.0 V CPD 60 Power Dissipation Capacitance (Per Buffer)* * Used to determine the no−load dynamic power consumption: P D = CPD VCC http://onsemi.com 4 2f + ICC VCC . pF MC74HC365A SWITCHING WAVEFORMS VCC tf tr OUTPUT ENABLE VCC 90% 50% 10% INPUT A tPHL OUTPUT Y 90% 50% 10% OUTPUT Y GND tPZL GND tPLH 50% HIGH IMPEDANCE 50% tPZH OUTPUT Y tPLZ tPHZ 10% VOL 90% VOH 50% HIGH IMPEDANCE tTHL tTLH Figure 1. Figure 2. TEST CIRCUITS TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST OUTPUT DEVICE UNDER TEST CL* *Includes all probe and jig capacitance CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. 1 kΩ CL* *Includes all probe and jig capacitance Figure 3. Figure 4. LOGIC DETAIL TO OTHER FIVE BUFFERS ONE OF 6 BUFFERS VCC Y INPUT A OUTPUT ENABLE 1 OUTPUT ENABLE 2 http://onsemi.com 5 MC74HC365A PACKAGE DIMENSIONS PDIP−16 N SUFFIX CASE 648−08 ISSUE T −A− 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C L DIM A B C D F G H J K L M S S SEATING PLANE −T− K H G D M J 16 PL 0.25 (0.010) T A M M SOIC−16 D SUFFIX CASE 751B−05 ISSUE K −A− 16 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S DIM A B C D F G J K M P R SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS http://onsemi.com 6 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74HC365A PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÇÇÇ ÇÇÇ ÉÉ ÇÇÇ ÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. M N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D H G DIM A B C D F G H J J1 K K1 L M DETAIL E SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HC365A ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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