LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT OVAL TYPE LED LAMPS LUE33631PIC DATA SHEET DOC. NO : QW0905- LUE33631PIC REV. : A DATE : 16 - Dec. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/4 PART NO. LUE33631PIC Package Dimensions 6.7 7.5 7.2 6.4 9.9 13.2±0.5 1.5MAX 1.3 25.0MIN 0.5TYP 1.0MIN 2.54TYP + Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Vertical Axis 50 ° Horizontal Axis 40 ° 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% Radiation Angle(0.5):H 40 Degree/V 50 Degree LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/4 PART NO.LUE33631PIC Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT UE Forward Current IF 50 mA Peak Forward Current Duty 1/10@10KHz IFP 90 mA Power Dissipation PD 120 mW Ir 10 μA Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Reverse Current @5V Max 260 ℃ for 5 sec Max (2mm from body) Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LUE33631PIC AlGaInP Dominant Spectral Forward voltage wave halfwidth length △λ nm @ 20mA(V) λDnm Viewing angle 2θ 1/2 (deg) Min. Max. Min. Typ. Lens Orange Orange Transparent Luminous intensity @20mA(mcd) 620 17 1.7 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 1100 1800 Horizontal Axis 40 ° Vertical Axis 50 ° LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/4 PART NO. LUE33631PIC Typical Electro-Optical Characteristics Curve UE CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0 1.0 2.0 3.0 4.0 1.0 5.0 10 Forward Current(mA) Forward Voltage(V) Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity @20mA Normalize @25℃ Forward Voltage@20mA Normaliz @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength Relative Intensity @20mA 1.0 0.5 0 600 650 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) 550 1000 100 700 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/4 PART NO.LUE33631PIC Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11