TOREX XBP1001-G

XBP1001
ETR29005-001
Low Capacitance TVS Diode Array
■FEATURES
■APPLICATIONS
Terminal Capacitance
ESD Protection
Environmentally Friendly
●USB2.0, Firewire
●HDMI Ver.1.3
●DVI
: 1.2pF (Line-to-GND)
: 8kV Contact (IEC61000-4-2)
: EU RoHS Compliant, Pb Free
■PIN CONFIGURATION
■ PACKAGING INFORMATION
●SOT-563
I/O Data line +
1
6
Ground
2
5
I/O Data line +
3
4
Unit : inch (mm)
■PRODUCT NAME
PRODUCT NAME
PACKAGE
ORDER UNIT
XBP1001-G *
SOT-563
4,000/Reel
* The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Peak Pulse Power (8/20μs Waveform)
Ppk
75
W
Peak Pulse Current (8/20μs Waveform)
Ipp
5
A
Junction Temperature
Tj
-55 to 125
℃
Storage Temperature
Tstg
-55 to 150
℃
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XBP1001
■ELECTRICAL CHARACTERISTICS
Ta=25℃
PARAMETER
Stand-Off Voltage
Breakdown Voltage
SYMBOL
LIMITS
TEST CONDITIONS
VRWM
UNITS
MIN.
TYP.
MAX.
-
-
5
V
VBR
IR=1mA
6.2
-
-
V
Leakage Current
IR
VR=5V
-
-
1.0
μA
Clamping Voltage (8/20μs)
VC
IPP=1A
-
-
10
V
Clamping Voltage (8/20μs)
VC
IPP=2A
-
-
12
V
Clamping Voltage (8/20μs)
VC
IPP=5A
-
-
15
V
VR=0V, f=1MHz
Between I/O pins and GND pin
-
-
1.2
pF
VR=0V, f=1MHz
Between I/O pins
-
-
0.6
pF
Terminal Capacitance
Ct
■NOTES ON USE
1. Please use this IC within the absolute maximum ratings.
Even within the ratings, in case of high load use continuously such as high temperature, high voltage, high current and thermal stress may
cause reliability degradation of the IC.
2. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
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XBP1001
■REFERENCE PATTERN LAYOUT
●SOT-563
Unit : inch (mm)
■MARKING
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XBP1001
■TAPING SPECIFICATIONS
●SOT-563
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SYMBOL
mm
D0
1.50 ± 0.10
D1
1.00 ± 0.25
E
1.75 ± 0.10
F
3.50 ± 0.05
P0
4.00 ± 0.10
P1
4.00 ± 0.10
P2
2.00 ± 0.05
W
8.00
+ 0.3
-0.1
XBP1001
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
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