NCP4629 Product Preview 500 mA, Wide Input Range, LDO Linear Voltage Regulator The NCP4629 is a CMOS 500 mA LDO linear voltage regulator which features a high input voltage range while maintaining a low quiescent current. Several protection features like current limiting and thermal shutdown are fully integrated to create a versatile and robust device. A high maximum input voltage (36 V) and wide temperature range (−40°C to 105°C) makes the NCP4629 an ideal choice for high power industrial applications. http://onsemi.com MARKING DIAGRAMS XXXXXXXX XX MM Features • • • • • • • • • Operating Input Voltage Range: 4 V to 24 V Output Voltage Range: 3.0 to 12.0 V (available in 0.1 V steps) ±2% Output Voltage Accuracy Output Current: min. 500 mA (VIN = VOUT + 1 V) Line Regulation: 0.05%/V Current Limit Circuit Thermal Shutdown Circuit Available in SOT−89−5 and DPACK5 Package These are Pb−Free Devices Typical Applications • • • • • Home appliances, industrial equipment Cable boxes, satellite receivers, entertainment systems Car audio equipment, navigation systems Notebook adaptors, LCD TVs, cordless phones and private LAN systems Office equipment: copiers, printers, facsimiles, scanners, projectors, monitors NCP4629x VIN VIN C1 470 n CE GND 1 1 XXX XMM SOT−89 5 CASE 528AB XX, XXX= Specific Device Code M, MM = Date Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION VOUT VOUT DPAK−5 CASE 369AE See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. C2 10m Figure 1. Typical Application Schematic This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2010 December, 2010 − Rev. P1 1 Publication Order Number: NCP4629/D NCP4629 VIN VOUT Vref Current Limit Short Protection Thermal Shutdown CE GND Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. SOT89 Pin No. DPACK Pin Name 1 1 VIN Input pin 2 2 GND Ground pin, all ground pins must be connected together when it is mounted on board 3 3 GND Ground pin, all ground pins must be connected together when it is mounted on board 4 4 CE 5 5 VOUT Description Chip enable pin (“H” active) Output pin ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 to 36 V Output Voltage VOUT −0.3 to VIN ≤ 36 V Chip Enable Input VCE −0.3 to VIN ≤ 36 V Power Dissipation SOT−89 PD 900 mW Input Voltage Power Dissipation DPACK 1900 Junction Temperature TJ −40 to 150 °C Storage Temperature TSTG −55 to 125 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Duration time = 200 ms 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latch−up Current Maximum Rating tested per JEDEC standard: JESD78. http://onsemi.com 2 NCP4629 THERMAL CHARACTERISTICS Rating Symbol Value Thermal Characteristics, SOT−89 Thermal Resistance, Junction−to−Air RqJA 111 Thermal Characteristics, DPACK Thermal Resistance, Junction−to−Air RqJA 53 Unit °C/W °C/W ELECTRICAL CHARACTERISTICS TA = 25°C Parameter Test Conditions Operating Input Voltage Output Voltage Output Voltage Temp. Coefficient VIN = VOUT + 1 V, IOUT = 100 mA Symbol Min Max Unit VIN 4 Typ 24 V VOUT x0.98 x1.02 V ppm/°C ±100 VIN = VOUT + 2 V, IOUT = 100 mA, TA = −40 to 105°C Line Regulation VIN = VOUT + 1 V to 24 V, IOUT = 10 mA LineReg 0.05 0.10 %/V Load Regulation VIN = VOUT + 2 V, IOUT = 0.1 mA to 200 mA LoadReg 25 60 mV VDO 0.135 0.225 V 5.0 V ≤ VOUT < 9.0 V 0.115 0.180 8.0 V ≤ VOUT ≤ 12.0 V 0.095 0.155 Dropout Voltage Output Current IOUT = 200 mA 3.0 V ≤ VOUT < 5.0 V VIN = VOUT + 1 V IOUT Short Current Limit VOUT = 0 V ISC 500 65 mA Quiescent Current VIN = VOUT + 1 V, VIN = VCE IQ 70 130 mA Standby Current VIN = 24 V, VCE = 0 V ISTB 0.1 1 mA CE Pin Threshold Voltage CE Input Voltage “H” VCEH 2.0 VIN V CE Input Voltage “L” VCEL 0 0.4 mA Thermal Shutdown Temperature TSD 160 °C Thermal Shutdown Release Temperature TSR 135 °C PSRR 60 dB Power Supply Rejection Ratio Output Noise Voltage VIN = VOUT + 2.0 V, ΔVIN_PK−PK = 0.5 V, IOUT = 100 mA, f = 1 kHz VOUT ≤ 6.0 V VOUT > 6.0 V VOUT = TBD V, IOUT = TBD mA, f = 10 Hz to 100 kHz http://onsemi.com 3 50 VN TBD mVrms NCP4629 APPLICATION INFORMATION Output Decoupling Capacitor (C2) A typical application circuit for NCP4629 series is shown in Figure 3. NCP4629x VIN VIN C1 470 n A 10 mF ceramic output decoupling capacitor is sufficient to achieve stable operation of the IC. If tantalum capacitor is used, and its ESR is high, the loop oscillation may result. The capacitor should be connected as close as possible to the output and ground pin. Larger values and lower ESR improves dynamic parameters. VOUT VOUT C2 10 m CE GND Enable Operation The enable pin CE may be used for turning the regulator on and off. The IC is switched on when a high level voltage is applied to the CE pin. The enable pin has an internal pull down current source. If the enable function is not needed connect CE pin to VIN. Figure 3. Typical Application Schematic When VOUT voltage could be higher than VIN voltage it is necessary to use protective diode D1. If there is possibility that VOUT voltage could be negative then it is necessary to use schottky diode D2. See Figure 4 for details. Do not force the voltage to the VOUT pin. Thermal As a power across the IC increase, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature increase for the part. When the device has good thermal conductivity through the PCB the junction temperature will be relatively low in high power dissipation applications. The IC includes internal thermal shutdown circuit that stops operation of regulator, if junction temperature is higher than 160°C. After that, when junction temperature decreases below 135°C, the operation of voltage regulator would restart. While high power dissipation condition is, the regulator starts and stops repeatedly and protects itself against overheating. D1 NCP4629x VIN VIN C1 470 n CE VOUT VOUT C2 10 m GND D2 Figure 4. Typical Application Schematic with Protective Diodes PCB layout Pins number 2 and 3 must be wired to the GND plane while it is mounted on board. Make VIN and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. Input Decoupling Capacitor (C1) A 470 nF ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP4629. Higher values and lower ESR improves line transient response. ORDERING INFORMATION Nominal Output Voltage Description Marking Package Shipping† NCP4629HDT050T5G 5.0 V Enable High C1J050B DPACK−5 (Pb−Free) 3000 / Tape & Reel NCP4629HDT060T5G 6.0 V Enable High C1J060B DPACK−5 (Pb−Free) 3000 / Tape & Reel NCP4629HDT120T5G 12.0 V Enable High C1J120B DPACK−5 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *To order other package and voltage variants, please contact your ON Semiconductor sales representative. http://onsemi.com 4 NCP4629 PACKAGE DIMENSIONS DPAK−5 (TO−252, 5 LEAD) CASE 369AE−01 ISSUE O C A E b2 A B c2 L3 Z D H DETAIL A 1 2 3 4 E2 5 c e SIDE VIEW C A B b TOP VIEW 0.12 M BOTTOM VIEW H C L2 GUAGE PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. THERMAL PAD CONTOUR OPTIONAL, WITHIN DIMENSIONS b3, E2, L3 AND Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THESE DIMENSIONS TO BE MEASURED AT DATUM H. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. DIM A A1 b b2 c c2 D E E2 e H L L1 L2 L3 Z 0.10 C L A1 L1 DETAIL A RECOMMENDED SOLDERING FOOTPRINT* 5.70 6.00 10.50 5X 2.10 5X 1.27 PITCH 0.80 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 2.10 2.50 0.00 0.13 0.40 0.60 5.14 5.54 0.40 0.60 0.40 0.60 5.90 6.30 6.40 6.80 5.04 REF 1.27 BSC 9.60 10.20 1.39 1.78 2.50 2.90 0.51 BSC 0.90 1.30 2.74 REF NCP4629 PACKAGE DIMENSIONS SOT−89, 5 LEAD CASE 528AB−01 ISSUE O D E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS INCLUDES LEAD FINISH. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE MEASURED AT DATUM PLANE C. H DIM A b b1 c D D2 E e H L L2 L3 L4 L5 1 TOP VIEW c A 0.10 C C SIDE VIEW e b1 L 1 e b 2 L3 L4 RECOMMENDED MOUNTING FOOTPRINT* L2 4X 3 0.57 1.75 L5 5 MILLIMETERS MIN MAX 1.40 1.60 0.32 0.52 0.37 0.57 0.30 0.50 4.40 4.60 1.40 1.80 2.40 2.60 1.40 1.60 4.25 4.45 1.10 1.50 0.80 1.20 0.95 1.35 0.65 1.05 0.20 0.60 4 2.79 1.50 0.45 4.65 D2 BOTTOM VIEW 1.30 1.65 1 2X 2X 0.62 1.50 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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