MC14503B Hex Non-Inverting 3-State Buffer The MC14503B is a hex non−inverting buffer with 3−state outputs, and a high current source and sink capability. The 3−state outputs make it useful in common bussing applications. Two disable controls are provided. A high level on the Disable A input causes the outputs of buffers 1 through 4 to go into a high impedance state and a high level on the Disable B input causes the outputs of buffers 5 and 6 to go into a high impedance state. http://onsemi.com MARKING DIAGRAMS Features PDIP−16 P SUFFIX CASE 648 • 3−State Outputs • TTL Compatible — Will Drive One TTL Load Over Full • • • • Temperature Range Supply Voltage Range = 3.0 Vdc to 18 Vdc Two Disable Controls for Added Versatility Pin for Pin Replacement for MM80C97 and 340097 These Devices are Pb−Free and are RoHS Compliant 1 Symbol Value Unit VDD −0.5 to +18.0 V Vin, Vout −0.5 to VDD + 0.5 V Input Current (DC or Transient) per Pin Iin ± 10 mA Output Current (DC or Transient) per Pin Iout ± 25 mA Power Dissipation, per Package (Note 2) PD 500 mW Ambient Temperature Range TA −55 to +125 °C −65 to +150 °C 260 °C DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Storage Temperature Range Lead Temperature (8−Second Soldering) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Maximum Ratings are those values beyond which damage to the device may occur. 2. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. © Semiconductor Components Industries, LLC, 2011 June, 2011 − Rev. 8 MC14503BCP AWLYYWWG 1 1 SOIC−16 D SUFFIX CASE 751B MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1) Parameter 16 1 SOEIAJ−16 F SUFFIX CASE 966 1 A WL, L YY, Y WW, W G 16 14503BG AWLYWW 1 16 MC14503B ALYWG 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Publication Order Number: MC14503B/D MC14503B PIN ASSIGNMENT TRUTH TABLE DIS A 1 16 VDD IN 1 2 15 DIS B OUT 1 3 14 IN 6 IN 2 4 13 OUT 6 OUT 2 5 12 IN 5 IN 3 6 11 OUT 5 OUT 3 7 10 IN 4 VSS 8 9 Inn Appropriate Disable Input Outn 0 0 0 1 0 1 X 1 High Impedance X = Don’t Care OUT 4 LOGIC DIAGRAM DISABLE B IN 5 IN 6 IN 1 IN 2 IN 3 IN 4 DISABLE A CIRCUIT DIAGRAM 15 ONE OF TWO/FOUR BUFFERS 12 11 14 13 2 3 4 5 6 7 10 9 1 VDD OUT 5 OUT 6 OUT 1 *INn OUTn OUT 2 OUT 3 OUT 4 *DISABLE *INPUT VSS TO OTHER BUFFERS VDD = PIN 16 VSS = PIN 8 *Diode protection on all inputs (not shown) ORDERING INFORMATION Package Shipping† MC14503BCPG PDIP−16 (Pb−Free) 500 / Rail MC14503BDG SOIC−16 (Pb−Free) 48 / Rail MC14503BDR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel Device MC14503BFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MC14503B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) − 55_C 25_C VDD 125_C Symbol Vdc Min Max Min Typ (Note 3) VOL 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc VOH 5.0 10 15 4.95 9.95 14.95 − − − 4.95 9.95 14.95 5.0 10 15 − − − 4.95 9.95 14.95 − − − Vdc 5.0 10 15 − − − 1.5 3.0 4.0 − − − 2.25 4.50 6.75 1.5 3.0 4.0 − − − 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 − − − 3.5 7.0 11 2.75 5.50 8.25 − − − 3.5 7.0 11 − − − 4.5 5.0 5.0 10 15 – 4.3 – 5.8 – 1.2 – 3.1 – 8.2 − − − − − – 3.6 – 4.8 – 1.02 – 2.6 – 6.8 – 5.0 – 6.1 – 1.4 – 3.7 – 14.1 − − − − − – 2.5 – 3.0 – 0.7 – 1.8 – 4.8 − − − − − IOL 4.5 5.0 10 15 2.2 2.6 6.5 19.2 − − − − 1.8 2.1 5.5 16.1 2.1 2.3 6.2 25 − − − − 1.2 1.3 3.8 11.2 − − − − mAdc Input Current Iin 15 − ± 0.1 − ± 0.00001 ± 0.1 − ± 1.0 mAdc Input Capacitance, (Vin = 0) Cin − − − − 5.0 7.5 − − pF Quiescent Current, (Per Package) IQ 5.0 10 15 − − − 1.0 2.0 4.0 − − − 0.002 0.004 0.006 1.0 2.0 4.0 − − − 30 60 120 mAdc Total Supply Current (Note 4, 5) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs) (All outputs switching, 50% Duty Cycle) IT 5.0 10 15 3−State Output Leakage Current ITL 15 Characteristic Output Voltage Vin = 0 Vin = VDD Input Voltage (VO = 3.6 or 1.4 Vdc) (VO = 7.2 or 2.8 Vdc) (VO = 11.5 or 3.5 Vdc) (VO = 1.4 or 3.6 Vdc) (VO = 2.8 or 7.2 Vdc) (VO = 3.5 or 11.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) “0” Level “1” Level “0” Level VIL “1” Level VIH Source (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Sink IOH Max Min Max Unit IT = (2.5 mA/kHz) f + IDD IT = (6.0 mA/kHz) f + IDD IT = (10 mA/kHz) f + IDD − ± 0.1 − ± 0.0001 ± 0.1 Vdc Vdc mAdc mAdc − ± 3.0 mAdc 3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 4. The formulas given are for the typical characteristics only at 25_C. 5. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.006. http://onsemi.com 3 MC14503B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS (Note 6) (CL = 50 pF, TA = 25_C) All Types Characteristic Symbol VDD VCC Typ (Note 7) Max 5.0 10 15 45 23 18 90 45 35 5.0 10 15 45 23 18 90 45 35 5.0 10 15 75 35 25 150 70 50 5.0 10 15 75 35 25 150 70 50 Unit Output Rise Time tTLH = (0.5 ns/pF) CL + 20 ns tTLH = (0.3 ns/pF) CL + 8.0 ns tTLH = (0.2 ns/pF) CL + 8.0 ns tTLH ns Output Fall Time tTHL = (0.5 ns/pF) CL + 20 ns tTHL = (0.3 ns/pF) CL + 8.0 ns tTHL = (0.2 ns/pF) CL + 8.0 ns tTHL Turn−Off Delay Time, all Outputs tPLH = (0.3 ns/pF) CL + 60 ns tPLH = (0.15 ns/pF) CL + 27 ns tPLH = (0.1 ns/pF) CL + 20 ns tPLH Turn−On Delay Time, all Outputs tPHL = (0.3 ns/pF) CL + 60 ns tPHL = (0.15 ns/pF) CL + 27 ns tPHL = (0.1 ns/pF) CL + 20 ns tPHL 3−State Propagation Delay Time Output “1” to High Impedance tPHZ 5.0 10 15 75 40 35 150 80 70 ns Output “0” to High Impedance tPLZ 5.0 10 15 80 40 35 160 80 70 ns High Impedance to “1” Level tPZH 5.0 10 15 65 25 20 130 50 40 ns High Impedance to “0” Level tPZL 5.0 10 15 100 35 25 200 70 50 ns ns ns ns 6. The formulas given are for the typical characteristics only at 25_C. 7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. DISABLE INPUT 20 ns 20 ns VDD 90% VDD 16 50% INPUT INPUT OUTPUT VSS 90% OUTPUT CL tTLH tPLH Figure 1. Switching Time Test Circuit and Waveforms (tTLH, tTHL, tPHL, and tPLH) http://onsemi.com 4 VSS tPHL tPLH PULSE GENERATOR 10% VOH 50% 10% VOL tTHL tPHL MC14503B DISABLE INPUT DISABLE INPUT PULSE GENERATOR VDD tPHZ, tPZH CIRCUIT tPLZ, tPZL CIRCUIT PULSE GENERATOR VDD 16 16 INPUT OUTPUT 1k 8 VSS INPUT CL OUTPUT 8 20 ns VSS 20 ns VDD 90% 50% DISABLE INPUT 1k 10% tPZL tPLZ VOH 90% 10% OUTPUT FOR tPZH, tPZL CIRCUIT VSS ≈ VOL + 0.05 V tPHZ tPZH OUTPUT FOR tPHZ, tPLZ CIRCUIT ≈ VOH - 0.15 V 90% 10% Figure 2. 3−State AC Test Circuit and Waveforms (tPLZ, tPHZ, tPZH, tPZL) http://onsemi.com 5 VOL CL MC14503B PACKAGE DIMENSIONS PDIP−16 CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L DIM A B C D F G H J K L M S S −T− SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SOEIAJ−16 CASE 966−01 ISSUE A 16 LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 6 MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.031 MC14503B PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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