TPC6K01 TOSHIBA Compound Device Silicon-Diffused Type TPC6K01 ○ General-Purpose Rectifier Applications Unit: mm 0.3±0.1 Symbol Rating Unit Repetitive peak reverse voltage VRRM 400 V Average forward current IF (AV) Non-repetitive peak surge current Junction temperature Storage temperature range 0.3 (Note 1) 0.05±0.05 Absolute Maximum Ratings (Ta = 25°C) Characteristics 3 2.9±0.2 0.05 A IFSM 3 (50 Hz) A Tj −55~150 °C Tstg −55~150 °C 1. ANODE 1 2. N.C. 3. ANODE 2 Note 1: Ta = 75°C (single-device operation) Device mounted on a glass-epoxy board Board size: 25.4 mm × 25.4 mm Board thickness: 0.8 t 0.16±0.05 0.95 0.95 1 0.7±0.05 +0.2 1.6 -0.1 4 +0.2 2.8 -0.3 6 z Forward voltage: VFM = 1.1 V (max) z Average forward current: IF (AV) = 0.3 A z Two diodes are housed in a small, thin package suitable for high-density mounting: VS-6 (Toshiba package name) z Each of the two diodes supports identical absolute maximum ratings and electrical characteristics. +0.25 0.25 -0.15 4. CATHODE 2 5. N.C. 6. CATHODE 1 JEDEC ⎯ JEITA ⎯ TOSHIBA 2-3T1B Note 2: Using continuously under heavy loads (e.g. the application of Weight: 0.011 g (typ.) high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Peak forward voltage VFM IF = 0.3 A ― 1.1 V Peak repetitive reverse current IRRM VRRM = 400 V ― 10 μA Circuit Configuration 6 5 Marking Lot code (month) 4 Part No. (or abbreviation code) Pin #1 1 2 3 Lot No. R2A Product-specific code Lot code (year) A line indicates lead (Pb)-free package or lead (Pb)-free finish. The round black marking “●” located on the lower left of the parts number marking “R2A” indicates terminal No. 1. 1 2006-11-06 TPC6K01 Thermal Characteristics Characteristics Single-device operation Thermal resistance (Note 2a) (junction to ambient) (Note 1a) (Note 1b) Note 1: (Note 2a) (Note 2a) (junction to ambient) 195 Rth (j-a) (2) 273 Rth (j-a) (1) 517 Rth (j-a) (2) (Note 2a) 793 (b) Device mounted on a glass-epoxy board (b) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (b) (a) Note 2: Rth (j-a) (1) Unit °C/W Single-device value at dual operation (a) Device mounted on a glass-epoxy board (a) Max °C/W Single-device value at dual operation Single-device operation Thermal resistance Symbol a) The power dissipation and thermal resistance values shown are for a single device. (During single-device operation, power is applied only to one device.) b) The power dissipation and thermal resistance values shown are for a single device. (During dual operation, power is evenly applied to both devices.) Standard Soldering Pad (Unit: mm) 2 2006-11-06 TPC6K01 Handling Precautions The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for when designing a circuit incorporating this device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit and no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account when designing a device for operation at low temperatures. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV). Carry out adequate heat design. If it is not possible to design a circuit with excellent heat radiation, set the margin by using an allowable Tamax-IF (AV) curve. This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180°. Therefore this applies only to abnormal operation, which seldom occurs during the lifespan of the device. We recommend that a device be used at a Tj of below 120°C under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the databook on Rectifiers for further information. 3 2006-11-06 TPC6K01 iF – vF 10 Pulse test iF (A) Halfsine waveform One cell Average forward power dissipation PF (AV) (W) Instantaneous forward current PF (AV) – IF (AV) 0.4 Tj = 150°C 1 75°C 25°C 0.1 0.01 0 0.4 0.8 1.2 1.6 Instantaneous forward voltage vF 0.3 0° 180° Conduction angle 180° One cell 0.2 0.1 0 0 2.0 0.1 (V) Ta max – IF (AV) (A) 4 One cell IFSM Ta = 25°C 80 Halfsine waveform (2) 40 0° 20 180° Conduction angle 180° 0 0 0.1 0.2 Average forward current f = 50 Hz 3 Peak surge forward current (1) 0.3 2 1 0 1 0.4 3 5 IF (AV) (A) 10 30 50 100 Number of cycles Rth (j-a) – t 1000 (4) Transient thermal impedance rth (j-a) (°C/W) Maximum allowable temperature Ta max (°C) 120 60 (A) (non-repetitive) (2) Single-device value at dual operation 100 IF (AV) 0.4 Surge forward current (1) Single-device operation 140 0.3 Average forward current Device mounted on a glass-epoxy board (a) (Board size 25.4 mm2, soldering land 25.4 mm2) 160 0.2 (3) (1) 100 (2) 10 1 0.001 Device mounted on a glass-epoxy board (a) (1) Single-device operation (2) Single-device value at dual operation Device mounted on a glass-epoxy board (b) (3) Single-device operation (4) Single-device value at dual operation 0.01 0.1 1 Time 4 10 t 100 1000 (s) 2006-11-06 TPC6K01 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2006-11-06