NCN8026A Compact Low Power Smart Card Interface IC The NCN8026A is a compact and cost−effective single SIM & smart card interface IC. It can be used with 1.8 V, 3 V and 5 V IC cards. The card VCC supply is provided by a built−in very low drop out and low noise Regulator. The NCN8026A offers enhanced performances with low VCC output ripple under load−transient conditions, very low shutdown current and 1.8 V−to−5 V logic compatibility. This device is fully compatible with the ISO 7816−3, EMV 4.2, UICC and related standards including NDS and other STB standards (Nagravision, Irdeto, Conax ..). It satisfies the requirements specifying conditional access into Set−Top−Boxes (STB) or Conditional Access Modules (CAM). This smart card interface IC is available in a QFN−24 package providing all the industry−standard features usually required for STB smart card interface. Features • Single IC Card Interface • Fully Compatible with ISO 7816−3, EMV4.2, UICC and Related • • • • • • • • • • http://onsemi.com MARKING DIAGRAMS QFN24 MN SUFFIX CASE 485L NCN 8026A ALYWG G A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (*Note: Microdot may be in either location) ORDERING INFORMATION Standards Including NDS and Other STB Standards (Nagravision, See detailed ordering and shipping information in the package Irdeto, Conax...) dimensions section on page 13 of this data sheet. Three Bidirectional Buffered I/O Level Shifters (C4, C7 and C8) 1.8 V, 3.0 V or 5.0 V $ 5 % Regulated Card Power Supply Such as ICC ≤ 70 mA with Low VCC Ripple Regulator Power Supply: VDDP = 2.7 V to 5.5 V (@ 1.8 V), 3.0 V to 5.5 V (@ 3.0 V) and 4.85 V to 5.5 V (@ 5.0 V) Independent Power Supply range on Controller • Interrupt Signal INT for Card Presence and Faults Interface such as VDD = 1.6 V to 5.5 V • Chip Select Pin (CS) for Dual Card Operating Handles Class A, B and C Smart Cards • External Under−Voltage Lockout Threshold Short Circuit Protection on all Card Pins Adjustment on VDD (PORADJ Pin) Support up to 27 MHz input Clock with Internal • Available in One Package Formats: QFN−24 Division Ratio 1/1, 1/2, 1/4 and 1/8 through CLKDIV1 • These are Pb−Free Devices and CLKDIV2 Typical Application HBM ESD Protection on Card Pins up to +8 kV • Pay TV, Set Top Box Decoder with Conditional Access (Human Body Model) and Pay−per−View Activation / Deactivation Sequences (ISO7816 • Conditional Access Module (CAM / CAS) Sequencer) • SIM card interface applications (UICC / USIM) Fault Protection Mechanisms Enabling Automatic • Point Of Sales and Transaction Terminals Device Deactivation in Case of Overload, Overheating, Card Take−off or Power Supply Drop−out (OCP, OTP, • Electronic Payment and Identification UVP) © Semiconductor Components Industries, LLC, 2013 January, 2013 − Rev. 2 1 Publication Order Number: NCN8026A/D NCN8026A VDDP 10 uF VDD 100 nF VDDP 100 nF VDD INT VDD R1 PRES PORADJ R2 GND CVCC NCN8026A CONTROL GND 100 nF220 nF VSEL0 VSEL1 CS CLKDIV1 3 CCLK 4 CAUX1 CAUX2 CI/O CLKIN RSTIN I/Ouc GND AUX1uc AUX2uc GND GND GND VSEL1 CLKDIV2 CLKDIV1 AUX2uc AUX1uc I/Ouc Figure 1. Typical Smart Card Interface Application 24 23 22 21 20 19 VSEL0 1 CS 2 NCN8026A VDDP 3 25 16 GND PRES 4 Exposed Pad 15 VDD PRES 5 GND CI/O 6 18 CLKIN 17 INT 14 RSTIN 10 11 12 CRST CVCC PORADJ CAUX1 9 CCLK 8 CAUX2 13 CMDVCC 7 Figure 2. NCN8026A − QFN−24 Pinout (Top View) http://onsemi.com 2 1 2 CRST CLKDIV2 DATA PORT Host Controller CMDVCC NO SMART CARD PRES DET DET VCC GND RST VPP CLK I/O C4 C8 5 6 7 8 GND NCN8026A VDD 15 GND 16 VDDP 3 PORADJ 12 VSEL0 1 VSEL1 24 Supply Voltage Monitoring 1.8 V / 3 V / 5 V LDO 13 INT 17 CS 2 CLKDIV1 22 CLKDIV2 23 CLKIN 18 RSTIN 14 I/Ouc 19 AUX1uc 20 AUX2uc 21 Control Logic and Fault Detection Clock Divider ISO7816 Sequencer Card Detection Card Pin Level Shifters & Drivers CMDVCC 11 CVCC 4 PRES 5 PRES 9 CCLK 10 CRST 6 CIO 8 CAUX1 7 CAUX2 25 GND Figure 3. NCN8026A Block Diagram (QFN−24 Pin Numbering) PIN FUNCTION AND DESCRIPTION Pin (QFN24) Name Type 1 VSEL0 Input Allows selecting card VCC power supply voltage mode (5V/3V or 1.8V/3V) VSEL0 = Low; CVCC = 5 V when VSEL1 = High or 3 V when VSEL1 = Low VSEL0 = High; CVCC = 1.8 V when VSEL1 = High or 3 V when VSEL1 = Low 2 CS Input When CS is Low, the corresponding chip is selected and the control and signal pins are configured normally. When CS is set High, CMDVCC, VSEL0, VSEL1, CLKDIV1, CLKDIV2 and RSTIN are latched. IOuc, AUX1uc, and AUX2uc are set to high−impedance pull−up mode and data transmission to or from the smart card is no longer allowed. VCC card power supply and card clock are maintained active if the part is active. 3 VDDP Power 4 PRES Input Card presence pin active (card present) when PRES = Low. A built−in debounce timer of about 8 ms is activated when a card is inserted. Convenient for Normally Open (NO) Smart card connector. 5 PRES Input Card presence pin active (card present) when PRES = High. A built−in debounce timer of about 8 ms is activated when a card is inserted. Convenient for Normally Closed (NC) smart card connector. 6 CI/O Input/ Output This pin handles the connection to the serial I/O (C7) of the card connector. A bi−directional level translator adapts the serial I/O signal between the card and the micro controller. A 11 kW (typical) pull up resistor to CVCC provides a High impedance state for the smart card I/O link. Description Regulator power supply. When VDDP is below 2.5 V typical the card pins are disabled. http://onsemi.com 3 NCN8026A PIN FUNCTION AND DESCRIPTION Pin (QFN24) Name Type Description 7 CAUX2 Input/ Output This pin handles the connection to the chip card’s serial auxiliary AUX2 I/O pin (C8). A bi−directional level translator adapts the serial I/O signal between the card and the micro controller. A 11 kW (typical) pull up resistor to CVCC provides a High impedance state for the smart card C8 pin. 8 CAUX1 Input/ Output This pin handles the connection to the chip card’s serial auxiliary AUX1 I/O pin (C4). A bi−directional level translator adapts the serial I/O signal between the card and the micro controller. A 11 kW (typical) pull up resistor to CVCC provides a High impedance state for the smart card C4 pin. 9 CCLK Output This pin is connected to the CLOCK card connector’s pin (Chip card’s pin C3). The Clock signal comes from the CLKIN input through clock dividers and level shifter. 10 CRST Output This pin is connected to the chip card’s RESET pin (C2) through the card connector. A level translator adapts the external Reset (RSTIN) signal to the smart card. 11 CVCC Power Output This pin is connected to the smart card power supply pin (C1). An internal low dropout regulator is programmable using the pins VSEL0 and VSEL1 to supply either 5 V or 3 V or 1.8 V output voltage. An external distributed ceramic capacitor ranging from 80 nF to 1.2 mF recommended must be connected across CVCC and CGND. This set of capacitor (if distributed) must be low ESR (< 100 mW). 12 PORADJ Input Power−on reset threshold adjustment input pin for changing the reset threshold (VDD UVLO threshold) thanks to an external resistor power divider. Needs to be connected to ground when unused. 13 CMDVCC Input Command VCC pin. Activation sequence Enable/Disable pin (active Low). The activation sequence is enabled by toggling CMDVCC High to Low and when a card is present. 14 RSTIN Input This Reset input connected to the host and referred to VDD (microcontroller side), is connected to the smart card Reset pin through the internal level shifter which translates the level according to the CVCC programmed value. 15 VDD Power input This pin is connected to the system controller power supply. It configures the level shifter input stage to accept the signals coming from the controller. A 0.1 mF decoupling capacitor shall be used. When VDD is below 1.45 V typical the card pins are disabled. 16 GND Ground Ground 17 INT Output The interrupt request is activated LOW on this pin. This is enabled when a card is present and the card presence is detected by PRES or PRES pins. Similarly an interrupt is generated when CVCC is overloaded. Inverter output (An open−drain output configuration with 50 kW pull−up resistor is available under request (metal change)). 18 CLKIN Input 19 I/Ouc Input / Output This pin is connected to an external micro−controller. A bi−directional level translator adapts the serial I/O signal between the smart card and the external controller. A built−in constant 11 kW (typical) resistor provides a high impedance state. 20 AUX1uc Input / Output This pin is connected to an external micro−controller. A bi−directional level translator adapts the serial C4 signal between the smart card and the external controller. A built−in constant 11 kW (typical) resistor provides a high impedance state. 21 AUX2uc Input / Output This pin is connected to an external micro−controller. A bi−directional level translator adapts the serial C8 signal between the smart card and the external controller. A built−in constant 11 kW (typical) resistor provides a high impedance state. 22 CLKDIV1 Input This pin coupled with CLKDIV2 is used to program the clock frequency division ratio (Table 2). 23 CLKDIV2 Input This pin coupled with CLKDIV1 is used to program the clock frequency division ratio (Table 2). 24 VSEL1 Input Allows selecting card VCC power supply voltage. VSEL0 = Low: CVCC = 5 V when VSEL1 = High or 3 V when VSEL1 = Low. VSEL0 = High: CVCC = 1.8 V when VSEL1 = High or 3 V when VSEL1 = Low. 25 GND Ground Clock Input for External Clock Regulator Power Supply Ground http://onsemi.com 4 NCN8026A ATTRIBUTES Characteristics Values ESD protection Human Body Model (HBM) (Note 1) Card Pins (card interface pins 4−11) All Other Pins Machine Model (MM) Card Pins (card interface pins 4−11) All Other Pins 8 kV 2 kV 400 V 150 V Moisture sensitivity (Note 2) QFN−24 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test 1. Human Body Model (HBM), R = 1500 W, C = 100 pF. 2. For additional information, see Application Note AND8003/D. MAXIMUM RATINGS (Note 3) Rating Symbol Value Unit Regulator Power Supply Voltage VDDP −0.3 ≤ VDDP ≤ 5.5 V Power Supply from Microcontroller Side VDD −0.3 ≤ VDD ≤ 5.5 V CVCC −0.3 ≤ CVCC ≤ 5.5 V External Card Power Supply Digital Input Pins Vin −0.3 ≤ Vin ≤ VDD V Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT) Vout −0.3 ≤ Vout ≤ VDD V Smart card Output Pins Vout −0.3 ≤ Vout ≤ CVCC V RqJA 90 °C/W Operating Ambient Temperature Range TA −40 to +85 °C Operating Junction Temperature Range TJ −40 to +125 °C TJmax +125 °C Tstg −65 to + 150 °C Thermal Resistance Junction−to−Air QFN−24 Maximum Junction Temperature Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C. http://onsemi.com 5 NCN8026A POWER SUPPLY SECTION (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 5 MHz) Symbol Rating Min Typ Max 4.75 3.0 2.7 5.0 3.3/5.0 3.3/5.0 5.5 5.5 5.5 Inactive mode (CMDVCC = High, CS = Low) − 2.0 3.0 mA Active Mode, FCLKIN = 0 MHz, CoutCCLK = 33 pF, |ICVCC| = 0 (CMDVCC = Low, CS = Low) − − 4.0 mA IDDP DC Operating supply current, FCLKIN = 5 MHz, CoutCCLK = 33 pF, |ICVCC| = 0 (CMDVCC = Low, CS = Low) − − 5.0 mA IDDP DC Operating supply current with FCLKIN = 5 MHz, ICVCC = 70 mA − − 76 mA VDDP Regulator Power Supply, 5.0 V Mode, |ICC| ≤ 70 mA 3.0 V Mode, |ICC| ≤ 70 mA 1.8 V Mode, |ICC| ≤ 70 mA IDDP IDDP Unit V VDD Operating Voltage 1.6 − 5.5 V IVDD Inactive mode − standby current (CMDVCC = High) − − 1.0 mA IVDD Operating Current − FCLKIN = 0 MHz , CoutCCLK = 33 pF |ICVCC| = 0 (CMDVCC = Low) − − 1.0 mA IVDD Operating Current − FCLKIN = 5 MHz , CoutCCLK = 33 pF |ICVCC| = 0 (CMDVCC = Low) − − 100 mA 1.35 1.45 1.55 V UVLOVDD Under Voltage Lock−Out (UVLO), no external resistor at pin PORADJ (connected to GND), falling VDD level UVLOHys UVLO Hysteresis, no external resistor at pin PORADJ (Connected to GND) (Note 4) 50 100 150 mV Under Voltage LockOut (UVLO) falling VDDP level 2.4 2.5 2.6 V VDDP UVLO Hysteresis (Note 4) 50 100 150 mV UVLOVDDP UVLOHys PORADJ pin VPORth+ External Rising threshold voltage on VDD for Power On Reset − pin PORADJ 1.19 1.24 1.26 V VPORth− External Falling threshold voltage on VDD for Power On Reset − pin PORADJ 1.17 1.19 1.22 V VPORHys Hysteresis on VPORth (pin PORADJ) (Note 4) 30 80 100 mV Width of Power−On Reset pulse (Note 4) No external resistor on PORADJ External resistor on PORADJ 4.0 4.0 8.0 8.0 12 12 ms ms tPOR IIL Low level input leakage current, VIL < 0.5 V (Pull−down source current) 0.2 mA Low Dropout Regulator CCVCC Output Capacitance on card power supply CVCC (Note 5) 0.08 0.32 1.2 mF CVCC Output Card Supply Voltage (including ripple) 1.8 V CVCC mode @ ICC ≤ 70 mA 3.0 V CVCC mode @ ICC ≤ 70 mA 5.0 V CVCC mode @ ICC ≤ 70 mA with 4.75 V ≤ VDDP ≤ 5.5 V 1.68 2.85 4.65 1.80 3.00 5.00 1.90 3.15 5.25 V V V CVCC Current pulses 7 nAs (t < 400 ns & |ICC| < 40 mA peak) (Note 4) 1.8 V mode / Ripple ≤ 150 mV (2.7 V ≤ VDDP ≤ 5.5 V) Current pulses 40 nAs (t < 400 ns & |ICC| < 200 mA peak) (Note 4) 3.0 V mode / Ripple ≤ 150 mV (2.9 V ≤ VDDP ≤ 5.5 V) Current pulses 40 nAs (t < 400 ns & |ICC| < 200 mA peak) (Note 4) 5.0 V mode / Ripple ≤ 150 mV (4.85 V ≤ VDDP ≤ 5.5 V) 1.66 1.80 1.90 V 2.70 3.00 3.30 V 4.60 5.00 5.30 V ICVCC Card Supply Current @ 1.8 V Mode @ 3.0 V Mode @ 5.0 V Mode 70 70 70 mA ICVCC_SC Short −Circuit Current − CVCC shorted to ground − 120 150 mA DVCVCC Output Card Supply Voltage Ripple peak−to−peak − fripple = 100 Hz to 200 MHz (load transient frequency with 65 mA peak current and 50% Duty Cycle) (Note 4) − − 150 mV CVCCSR Slew Rate on CVCC turn−on / turn−off (Note 4) − − 0.22 V/ms 4. Guaranteed by design and characterization. 5. These values take into account the tolerance of the cms capacitor used. CMS capacitor very low ESR (< 100 mW, X5R / X7R). http://onsemi.com 6 NCN8026A HOST INTERFACE SECTION CLKIN, RSTIN, I/Ouc, AUX1uc, AUX2uc, CLKDIV1, CLKDIV2, CMDVCC, VSEL0, VSEL1, CS (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 5 MHz) Symbol FCLKIN Rating Clock frequency on pin CLKIN (Note 6) Min Typ Max Unit − − 27 MHz VIL Input Voltage level Low: CLKIN, RSTIN, CLKDIV1, CLKDIV2, CMDVCC, VSEL0, VSEL1, CS −0.3 − 0.3 x VDD V VIH Input Voltage level High: CLKIN, RSTIN, CLKDIV1, CLKDIV2, CMDVCC, VSEL0, VSEL1, CS 0.7 x VDD − VDD + 0.3 V |IIL| CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, VSEL0, VSEL1, CS Low Level Input Leakage Current, VIL = 0 V − − 1.0 mA |IIH| CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, VSEL0, VSEL1, CS Low Level Input Leakage Current, VIH = VDD − − 1.0 mA VIL Input Voltage level Low: I/Ouc, AUX1uc, AUX2uc −0.3 − 0.5 V VIH Input Voltage level High: I/Ouc, AUX1uc, AUX2uc 0.7 x VDD − VDD + 0.3 V |IIL | I/Ouc, AUX1uc, AUX2uc Low level input leakage current, VIL = 0 V − − 600 mA |IIH| I/Ouc, AUX1uc, AUX2uc High level input leakage current, VIH = VDD − − 10 mA I/Ouc, AUX1uc, AUX2uc data channels, @ Cs v 30 pF High Level Output Voltage (CRD_I/O = CAUX1 = CAUX2 = CVCC) IOH = 0 IOH = −40 mA for VDD > 2 V (IOH = −20 mA for VDD v 2 V) 0.9 x VDD 0.75 x VDD − VDD + 0.1 VDD + 0.1 V V 0.3 V 1.2 ms 0.1 ms kW VOH VOL tRi/Fi tRo/Fo Low Level Output Voltage (CRD_I/O = CAUX1 = CAUX2 = 0 V) IOL= + 1 mA 0 Input Rising/Falling times (Note 6) − Output Rising/Falling times (Note 6) − Rpu I/0uc, AUX1uc, AUX2uc Pull Up Resistor VOH Output High Voltage INT @ IOH = −15 mA (source) VOL RINT − − − 8.0 11 16 0.75 x VDD − − Output Low Voltage INT @ IOL = 2 mA (sink) 0 − 0.30 INT Pull Up Resistor − 20 − 6. Guaranteed by design and characterization. http://onsemi.com 7 V V kW NCN8026A SMART CARD INTERFACE SECTION CI/O, CAUX1, CAUX2, CCLK, CRST, PRES, PRES (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 5 MHz) Symbol Min Typ Max Unit CRST @ CVCC = 1.8 V, 3.0 V, 5.0 V Output RESET VOH @ Irst = −200 mA Output RESET VOL @ Irst = 200 mA 0.9 x CVCC 0 − − CVCC 0.20 V V tR tF Output RESET VOH @ Irst = −20 mA Output RESET VOL @ Irst = 20 mA 0 CVCC − 0.4 0.4 CVCC V V td Output RESET Rise time @ Cout = 100 pF (Note 7) Output RESET Fall time @ Cout = 100 pF (Note 7) Output Rise/Fall times @ CVCC = 1.8 V & Cout = 100 pF (Note 7) VOH VOL tR/F Rating RSTIN to CRST delay − Reset enabled (Note 7) − − − − − − 100 100 200 ns ns ns − − 2 ms − − 27 MHz − − CVCC +0.2 V V 0.4 CVCC V V CCLK @ CVCC = 1.8 V, 3.0 V or 5.0 V FCRDCLK Output Frequency (Note 7) VOH VOL Output CCLK VOH @ Iclk = −200 mA Output CCLK VOL @ Iclk = 200 mA 0.9 x CVCC 0 FDC Output CCLK VOH @ Iclk = −70 mA Output CCLK VOL @ Iclk = 70 mA 0 CVCC − 0.4 trills tulsa SR Output Duty Cycle (Note 7) Rise & Fall time Output CCLK Rise time @ Cout = 33 pF (Note 7) Output CCLK Fall time @ Cout = 33 pF (Note 7) Slew Rate @ Cout = 33 pF (CVCC = 3.0 V or 5.0 V) (Note 7) 45 − 55 % − − − − 16 16 ns ns 0.2 − − V/ns 0.7xVCC 1.6 1.8 − − − CVCC + 0.3 CVCC+ 0.3 CVCC + 0.3 V V V −0.30 −0.30 − − 0.50 0.80 V V 600 10 mA mA CAUX1, CAUX2, CI/O @ CVCC = 1.8 V, 3.0 V, 5.0 V VIH Input Voltage High Level 1.8 V Mode 3.0 V Mode 5.0 V Mode VIL Input Voltage Low Level 1.8 V mode 3.0 V and 5.0 V modes |IIL| |IIH| Low Level Input current VIL = 0 V High Level Input current VIH = CVCC VOH Output VOH @ IOH = no DC load @ IOH = −40 mA for CVCC = 3.0 V and 5.0 V @ IOH = −20 mA for CVCC = 1.8 V @ IOH ≥ −15 mA VOL tRi / Fi tRo / Fo − − 0.9xCVCC 0.75xCVCC 0.75xCVCC 0 − − − CVCC + 0.1 CVCC + 0.1 CVCC + 0.1 0.4 V V 0 VCC − 0.4 − − 0.30 VCC ms Input Rising/Falling times (Note 7) − − 1.2 Output Rising/Falling times / Cout = 80 pF (Note 7) − − 0.1 Output VOL @ IOL = 1 mA, VIL = 0 V @ IOL ≥ +15 mA V ms Fbidi Maximum data rate through bidirectional I/O, AUX1 & AUX2 channels (Note 7) − − 1 MHz RPU CAUX1, CAUX2, CI/O Pull− Up Resistor 8 11 16 kW tIO Propagation delay IOuc −> CI/O and CI/O −> IOuc (falling edge) (Note 7) − − 200 ns tpu Active pull−up pulse width buffers I/O, AUX1 and AUX2 (Note 7) − − 200 ns Cin Input Capacitance on data channels (Note 7) − − 10 pF VIH VIL PRES, PRES Card Presence Voltage High Level Card Presence Voltage Low Level 0.7 x VDD −0.3 − − VDD + 0.3 0.3 x VDD http://onsemi.com 8 V NCN8026A SMART CARD INTERFACE SECTION CI/O, CAUX1, CAUX2, CCLK, CRST, PRES, PRES (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 5 MHz) Symbol |IIH| |IIL| Tdebounce Rating Min PRES, PRES Low level input leakage current, VIH = VDD PRES PRES High level input leakage current, VIL = 0 V PRES PRES Typ Max Unit mA 0.2 2.0 1.0 0.2 1.0 2.0 Debounce time PRES and PRES (Note 7) 5 8 12 ms ICI/O CI/O, CAUX1, CAUX2 current limitation − − 15 mA ICCLK CCLK current limitation − − 70 mA ICRST CRST current limitation − − 20 mA Tact Activation Time (Note 7) 30 − 100 ms T5 RSTIN time control (Figure 5) (Note 7) 200 240 280 ms Deactivation Time (Note 7) 30 − 250 ms Tdeact 7. Guaranteed by design and characterization. POWER SUPPLY VSEL1 are usually programmed before activating the smart card interface that is when CMDVCC is High. There’s no specific sequence for applying VDD or VDDP. They can be applied to the interface in any sequence. After powering the device INT pin remains Low until a card is inserted. The NCN8026A smart card interface has two power supplies: VDD and VDDP. VDD is common to the system controller and the interface. The applied VDD range can go from 1.6 V up to 5.5 V. If VDD goes below 1.45 V typical (UVLOVDD) a power−down sequence is automatically performed. In that case the interrupt (INT) pin is set Low. A Low Drop−Out (LDO) and low noise regulator is used to provide the 1.8 V, 3 V or 5 V power supply voltage (CVCC) to the card. VDDP is the LDO’s input voltage. CVCC is the LDO output. The typical distributed reservoir output capacitor connected to CVCC is 100 nF + 220 nF. The capacitor of 100 nF is connected as close as possible to the CVCC’s pin and the 220 nF one as close as possible to the card connector C1 pin. Both feature very low ESR values (lower than 50 mW). The decoupling capacitors on VDD and VDDP respectively 100 nF and 10 mF + 100 nF have also to be connected close to the respective IC pins. The CVCC pin can source up to 70 mA at 1.8 V, 3 V and 5 V continuously over the VDDP range (see corresponding specification table), the absolute maximum current being internally limited below 150 mA (Typical at 120 mA). The card VCC voltage (CVCC) can be programmed with the pins VSEL0 and VSEL1 and according to the below table: SUPPLY VOLTAGE MONITORING The supply voltage monitoring block includes the Power−On Reset (POR) circuitry and the under−voltage lockout (UVLO) detection (VDD voltage dropout detection). PORADJ pin allows the user, according to the considered application, to adjust the VDD UVLO threshold. If not used PORADJ pin is connected to Ground (recommended even if it may be left unconnected). The input supply voltage is continuously monitored to prevent under voltage operation. At power up, the system initializes the internal logic during POR timing and no further signal can be provided or supported during this period. The system is ready to operate when the input voltage has reached the minimum VDD. Considering this, the NCN8026A will detect an Under−Voltage situation when the input supply voltage will drop below 1.45 V typical. When VDD goes down below the UVLO falling threshold a deactivation sequence is performed. The device is inactive during power−on and power−off of the VDD supply (8 ms reset pulse). PORADJ pin is used to modify the UVLO threshold according to the below relationship considering an external resistor divider R1 / R2 (see block diagram Figure 1): Table 1. CVCC PROGRAMMING VSEL0 VSEL1 CVCC 0 0 3.0 V 0 1 5.0 V 1 0 3.0 V 1 1 1.8 V UVLO + R1 ) R2 V POR R2 (eq. 1) If PORADJ is connected to Ground the VDD UVLO threshold (VDD falling) is typically 1.45 V. In some cases it can be interesting to adjust this threshold at a higher value and by the way increase the VDD supply dropout detection VSEL0 can be used to select the CVCC programming mode which can be 5V/3V (VSEL0 connected to Ground) or 1.8V/3V (VSEL0 connected to VDD). VSEL0 and http://onsemi.com 9 NCN8026A level which enables a deactivation sequence if the VDD voltage is too low. For example, there are microcontrollers for which the minimum supply voltage insuring a correct operating is higher than 1.45 V; increasing UVLOVDD (VDD falling) is consequently necessary. Considering for instance a resistor bridge with R1 = 56 kW, R2 = 42 kW and VPOR− = 1.22 V typical the VDD dropout detection level can be increased up to: UVLO + 56k ) 42k 42k V POR− + 2.85 V The current to and from the card I/O lines is limited internally to 15 mA and the maximum guaranteed frequency on these lines is 1 MHz. STANDBY MODE After a Power−on reset, the circuit enters the standby mode. A minimum number of circuits are active while waiting for the microcontroller to start a session: − All card contacts are inactive − Pins I/Ouc, AUX1uc and AUX2uc are in the high−impedance state (11 kW pull−up resistor to VDD) − Card pins are inactive and pulled Low − Supply Voltage monitoring is active (eq. 2) CLOCK DIVIDER: The input clock can be divided by 1/1, 1/2, 1/4, or 1/8, depending upon the specific application, prior to be applied to the smart card driver. These division ratios are programmed using pins CLKDIV1 and CLKDIV2 (see Table 2). The input clock is provided externally to pin CLKIN. POWER−UP In the standby mode the microcontroller can check the presence of a card using the signals INT and CMDVCC as shown in Table 3: Table 3. CARD PRESENCE STATE Table 2. CLOCK FREQUENCY PROGRAMMING INT CMDVCC State CLKDIV1 CLKDIV2 FCCLK HIGH HIGH Card present 0 0 CLKIN / 8 LOW HIGH Card not present 0 1 CKLKIN / 4 1 0 CLKIN 1 1 CLKIN / 2 If a card is detected present (PRES or PRES active) the controller can start a card session by pulling CMDVCC Low. Card activation is run (t0, Figure 5). This Power−Up Sequence makes sure all the card related signals are LOW during the CVCC positive going slope. These lines are validated when CVCC is stable and above the minimum voltage specified. When the CVCC voltage reaches the programmed value (1.8 V, 3.0 V or 5.0 V), the circuit activates the card signals according to the following sequence (Figure 5): − CVCC is powered−up at its nominal value (t1) − I/O, AUX1 and AUX2 lines are activated (t2 ~ 10 ms) − Then Clock is activated and the clock signal is applied to the card (typically 2 ms after I/Os lines) (t3) − Finally the Reset level shifter is enabled (typically 2 ms after clock channel) (t4) The clock can also be applied to the card using a RSTIN mode allowing controlling the clock starting by setting RSTIN Low (Figure 4). Before running the activation sequence, that is before setting Low CMDVCC RSTIN is set High. The following sequence is applied: − The Smart Card Interface is enable by setting CMDVCC LOW (RSTIN is High). − Between t2 (Figure 4) and t5 = 240 ms, RSTIN is reset to LOW and CCLK will start precisely at this moment allowing a precise count of clock cycles before toggling CRST Low to High for ATR (Answer To Reset) request. − CRST remains LOW until 240 ms; after t5 = 240 ms CRST is enabled and is the copy of RSTIN which has no more control on the clock. The clock input stage (CLKIN) can handle a 27 MHz maximum frequency signal. Of course, the ratio must be defined by the user to cope with Smart Card considered in a given application In order to avoid any duty cycle out of the 45% / 55% range specification, the divider is synchronized by the last flip flop, thus yielding a constant 50% duty cycle, whatever be the divider ratio 1/2, 1/4 or 1/8. On the other hand, the output signal Duty Cycle cannot be guaranteed 50% if the division ratio is 1 and if the input Duty Cycle signal is not within the 46% − 56% range at the CLKIN input. When the signal applied to CLKIN is coming from the external controller, the clock will be applied to the card under the control of the microcontroller or similar device after the activation sequence has been completed. DATA I/O, AUX1 and AUX2 LEVEL SHIFTERS The three bidirectional level shifters I/O, AUX1 and AUX2 adapt the voltage difference that might exist between the micro−controller and the smart card. These three channels are identical. The first side of the bidirectional level shifter dropping Low (falling edge) becomes the driver side until the level shifter enters again in the idle state pulling High CI/O and I/Ouc. Passive 11 kW pull−up resistors have been internally integrated on each terminal of the bidirectional channel. In addition with these pull−up resistors, an active pull−up circuit provides a fast charge of the stray capacitance. http://onsemi.com 10 NCN8026A If controlling the clock with RSTIN is not necessary (Normal Mode), then CMDVCC can be set LOW with RSTIN LOW. In that case, CLK will start minimum 2 ms after the transition on I/O (Figure 5), and to obtain an ATR, CRST can be set High by RSTIN also about 2 ms after the clock channel activation (Tact). The internal activation sequence activates the different channels according to a specific hardware built−in sequencing internally defined but at the end the actual activation sequencing is the responsibility of the application software and can be redefined by the micro−controller to comply with the different standards and the different ways the standards manage this activation (for example light differences exist between the EMV and the ISO7816 standards). CMDVCC CVCC ATR CIO CCLK RSTIN CRST t0 t1 t2 t4 t5 ~240 ms Figure 4. Activation Sequence − RSTIN Mode (RSTIN Starting High) CMDVCC CVCC CIO ATR CCLK RSTIN CRST t0 t1 t2 t3 t4 Tact Figure 5. Activation Sequence − Normal Mode http://onsemi.com 11 NCN8026A POWER−DOWN − − − − When the communication session is completed the NCN8026A runs a deactivation sequence by setting High CMDVCC. The below power down sequence is executed: CRST is forced to Low CCLK is set Low 12 ms after CRST. CI/O, CAUX1 and CAUX2 are pulled Low Finally CVCC supply can be shut−off. CMDVCC CRST CCLK CIO CVCC Tdeact Figure 6. Deactivation Sequence FAULT DETECTION − DC/DC operation: the internal circuit continuously senses the CVCC voltage (in the case of either over or under voltage situation). − DC/DC operation: under−voltage detection on VDDP − Overheating − Card pin current limitation: in the case of a short circuit to ground. No feedback is provided to the external MPU. In order to protect both the interface and the external smart card, the NCN8026A provides security features to prevent failures or damages as depicted here after. − Card extraction detection − VDD under voltage detection − Short−circuit or overload on CVCC PRES /INT CMDVCC debounce debounce CVCC Powerdown resulting of card extraction Powerdown caused by short−circuit Figure 7. Fault Detection and Interrupt Management Interrupt Pin Management: During a card session, CMDVCC is Low and INT pin goes Low when a fault is detected. In that case a deactivation is immediately and automatically performed (see Figure 6). When the microcontroller resets CMDVCC to High it can sense the INT level again after having got completed the deactivation. As illustrated by Figure 7 the device has a debounce timer of 8 ms typical duration. When a card is inserted, output INT goes High only at the end of the debounce time. When the card is removed a deactivation sequence is automatically and immediately performed and INT goes Low. A card session is opened by toggling CMDVCC High to Low. Before a card session, CMDVCC is supposed to be in a High position. INT is Low if no card is present in the card connector (Normally open or normally closed type). INT is High if a card is present. If a card is inserted (INT = High) and if VDD drops below the UVLO threshold then INT pin drops Low immediately. It switches High when VDD increases again over the UVLO limit (including hysteresis), a card being still present. http://onsemi.com 12 NCN8026A ESD PROTECTION CRST, CCLK, CI/O, CAUX1, CAUX2, PRES and PRES pins can sustain 8 kV. The CVCC pin has the same ESD protection and can source up to 70 mA continuously, the absolute maximum current being internally limited with a max at 150 mA. The CVCC current limit depends on VDDP and CVCC. The NCN8026A includes devices to protect the pins against the ESD spike voltages. To cope with the different ESD voltages developed across these pins, the built in structures have been designed to handle either 2 kV, when related to the micro controller side, or 8 kV when connected with the external contacts (HBM model). Practically, the APPLICATION SCHEMATIC VDD +3.3 V 100 nF 24 PRES PRES CI/O AUX1uc AUX2uc I/Ouc 19 1 CLKIN 18 2 INT 17 Exposed Pad 3 GND 4 14 6 13 100 kW 8 9 10 VDD 15 5 7 GND 16 25 CAUX2 VDD +3.3 V 20 11 CVCC 10 mF 3.3 V Microcontroller 100 nF RSTIN PORADJ R1 Optional R1/R2 resistor divider − if not used it is recommended to connect PORADJ to Ground 12 CMDVCC + 100 nF 21 CRST VDDP 22 CCLK CS VDDP +5 V 23 CAUX1 VSEL0 CLKDIV1 VSEL1 CLKDIV2 XTAL1 XTAL2 R2 220 nF 1 2 3 4 VCC GND RST VPP CLK I/O C4 C8 5 6 7 8 100 nF DET SMART CARD Figure 8. Application Schematic ORDERING INFORMATION Device NCN8026AMNTXG Package Shipping† QFN24 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 13 NCN8026A PACKAGE DIMENSIONS QFN24, 4x4, 0.5P CASE 485L ISSUE B D PIN 1 REFEENCE 2X 0.15 C 2X ÉÉ ÉÉ ÉÉ 0.15 C L A B DETAIL A E ALTERNATE CONSTRUCTIONS ÉÉÉ ÉÉÉ ÇÇÇ ÉÉÉ ÉÉÉ ÇÇÇ EXPOSED Cu DETAIL B A3 MOLD CMPD DETAIL B A A3 ALTERNATE TERMINAL CONSTRUCTIONS C A1 SIDE VIEW SEATING PLANE L 24X 7 4.30 E2 1 1 19 e e/2 BOTTOM VIEW 24X 0.55 2.90 13 24 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 4.00 BSC 2.70 2.90 4.00 BSC 2.70 2.90 0.50 BSC 0.30 0.50 0.05 0.15 RECOMMENDED SOLDERING FOOTPRINT D2 DETAIL A DIM A A1 A3 b D D2 E E2 e L L1 A1 0.10 C NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 TOP VIEW 0.08 C L 24X b 0.10 C A B 0.05 C 4.30 2.90 NOTE 3 0.50 PITCH 24X 0.32 DIMENSIONS: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 14 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCN8026A/D