XBP06V1E4MR-G ETR2901-004 Transient Voltage Suppressor (TVS) ■GENERAL DESCRIPTION Four elements in SOT-25 package (Anode Common) ■APPLICATIONS ESD protection High ESD ■ABSOLUTE MAXIMUM RATINGS ■PACKAGING INFORMATION Ta=25℃ PARAMETER SYMBOL RATINGS UNITS Ppk 200 W Pd 250 750(*2) mW Peak Pulse Power (*1) Power Dissipation Junction Temperature Storage Temperature Range ESD Durability (*3)(*4) Contact Discharge Tj 150 ℃ Tstg -55～+150 ℃ Vpp 30 kV (*1): tp=8/20μs (*2): This is a reference data taken by using the test board. (*3): Test Condition IEC61000-4-2 Standard (*4): Criterion： No damage to device elements ■MARKING RULE ①②③：BP3(Product Number) ④⑤：Lot Number ■PIN CONFIGURATION 5 PRODUCT NAME 4 * XBP06V1E4MR-G 1. Cathode 2. Anode 3. Cathode 4. Cathode 5. Cathode PACKAGE ORDER UNIT SOT-25 3,000/Reel * 1 2 The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. 3 TOP VIEW ■ ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL TEST CONDITION Ta=25℃ MIN. LIMITS TYP. MAX. 6.1 6.65 7.2 V UNITS Breakdown Voltage VBR IR =1mA Leakage Current IRM VRM=5.25V - - 2.5 μA Forward Voltage VF IF=200mA - - 1.25 V Inter-Terminal Capacity Ct VR=0V, f=1MHz - 170 - pF 1/4 XBP06V1E4MR-G ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Reverse Current vs. Breakdown Voltage (2) Reverse Current vs. Reverse Voltage 100 10 Reverse Current IR (uA) Reverse Current IR (mA) 10 75℃ 1 25℃ Ta=125℃ -25℃ 0.1 0.01 0.001 1 Ta=125℃ 0.1 0.01 -25℃ 0.001 5.5 6.0 6.5 7.0 7.5 8.0 0 1 Breakdown Voltage VBR (V) 3 4 5 6 (4) Reverse Current vs. Operating Temperature 8.0 10 7.5 7.0 Reverse Current IR (uA) Breakdown Voltage VBR (V) 2 Reverse Voltage VR (V) (3) Breakdown Voltage vs. Operating Temperature IR=1mA 6.5 6.0 1 VR=5.25V 5V 0.1 0.01 5.5 5.0 -50 0 50 100 150 0.001 -50 (5) Inter-Terminal Capacity vs. Reverse Voltage 400 0 50 100 150 Operating Temperature Ta (℃) Operating Temperature Ta (℃) (6) Forward Current vs. Forward Voltage 1000 f=1MHz 350 Forward Current IF (mA) Inter-Terminal Capacity Ct (pF) 25℃ 0.0001 5.0 300 250 200 150 Ta=25℃ 100 100 Ta=125℃ 10 75℃ 1 25℃ -25℃ 0.1 50 0 0.01 0 1 2 3 4 Reverse Voltage VR (V) 2/4 75℃ 5 6 0 0.2 0.4 0.6 0.8 Forward Voltage VF (V) 1 1.2 XBP06V1E4MR-G ■PACKAGING INFORMATION ● SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) 2 Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 評価基板レイアウト（単位：mm） 2. Power Dissipation vs. Operating temperature Board Mount (Tj max = 150℃) Ambient Temperature（℃） Power Dissipation Pd（mW） 25 750 105 270 Thermal Resistance (℃/W) 166.67 許容損失Pd（mW） Power Dissipation: Pd (mW) Pd vs. Ta Pd-Ta特性グラフ 800 700 600 500 400 300 200 100 0 25 50 75 100 125 周囲温度Ta（℃） Ambient Temperature: Ta (℃) 150 3/4 XBP06V1E4MR-G 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 4/4