8.0Amps Glass Passivated Single Phase Silicon Bridge Machamical Dimensions 4.2 + 0.2 21.9 + 0.5 2 3.85 + 0.25 Descriptions GBU800~812 4.4 + 0.2 1.95 + 0.25 18.6 + 0.3 20.4 + 0.3 _ 1.9 R. TYP. (2PLACES) ~ ~ + 10.8 + 0.5 3.4 + 0.2 16.0 + 0.4 1.3 + 0.2 5.1 + 0.5 GBU Dimensions in millimeters(1mm =0.0394＂） Features Mechanical Data Ideal for P.C. Board mounting High surge current capability This series is UL listed under the Recognized Component Index, file number E142814 The plastic material used carries Underwriters Laboratory flammability recognition 94V-0 High temperature soldering guaranteed 265 C /10 seconds at 5 lbs (2.3kg) tension Case: Molded plastic body Terminals: Plated leads solderable per MIL-STD-202, Method 208 Mounting Position:: Any Weight: 3.8 grams (approx) Maximum Ratings & Thermal Characteristics Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz. For Capacitive load derate current by 20%. GBU GBU GBU GBU GBU GBU GBU unit Parameter Symbol GBU 800 801 802 804 806 808 810 812 VRRM 100 200 400 600 800 1000 1200 V 50 Maximum repetitive peak reverse voltage Maximum RMS bridge input voltage Maximum DC blocking voltage VRMS 35 70 140 280 VDC 50 100 200 400 420 600 560 800 700 840 V 1000 1200 V Maximum average forward rectified output current at TA=100 C IF(AV) 8.0 A Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method) IFSM 200 A I t 2 166 A sec Typical thermal resistance per element (1) ReJA 2.2 Operating junction and storage temperature range TJ, TSTG -55 to + 150 Max. instantaneous forward voltage drop per leg at 6.0A VF 1.1 V Max. DC reverse current at rated Ta=25C IR 5.0 uA Max. DC reverse current at rated Ta=125C IR 500 uA Rating for fusing ( t<8.3ms) Notes: Thermal resistance from Junction to Ambient on PC board mounting 2 C/W 8.0Amps Glass Passivated Single Phase Silicon Bridge o Rating and Characteristic Curves ( TA=25 C Unless otherwise noted ) GBU800 thru GBU810 Fig. 2 Maximum Non-repetitive Peak Forward Surge Current Fig. 1 Derating Curve for Output Rectified Current Peak Forward Surge Current, Amperes Average Forward Output Current, Amperes 8.0 Heat Sink mounting, Tc 6.0 4.0 60Hz Resistive of Inductive Load Mounted on 4X4 inch copper PC board, TA 1.27 mm lead length 2.0 0 0 300 8.3ms Single half-sine-Wave [JEDEC Method] 250 200 150 100 50 10 1 100 Number of Cycles at 60HZ 50 100 150 o Fig. 4 Typical Reverse Characteristics Case Temperature, C 10 Instantaneous Reverse Current ,Amperes Fig. 3 Typical Instantaneous Forward Characteristics 40 20 10 Tc=100 C 1.0 0.1 TA=25 C 4.0 .01 1.0 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage, % 0.1 Tj=25 C Pulse Width=300us 2% duty cycle .01 0.6 0.7 0.8 0.9 1.0 1.1 Instantaneous Forward Voltage, Volts Fig. 5 Typical Junction Capacitance 1.2 400 1.3 Capacitance, pF Instantaneous Forward Current, Amperes 100 100 50 Tj=25 C f=1.0MHz Ving =50mV p.p. 10 1 1.5 2 10 100 Reverse Voltage, Volts 2003 SEP ELECTRONIC CORP. www.sep.net.cn M099