HTSC429.xxx - 1812 High Temperature Silicon Capacitor Rev 2.0 Key features Key applications High stability up to 200°C: All applications up to 200°C, such as military, aerospace and automotive industries Voltage <0.1 %/V High reliability applications Negligible capacitance loss through aging Replacement of X7R and C0G dielectrics Decoupling / Filtering / Charge pump (i.e.: motor management, temperature sensors) Downsizing Temperature <±1% (-55 °C to +200 °C) Unique high capacitance in EIA/1812 package size, up to 3,3µF High reliability (FIT <0.017 parts / billion hours) Low leakage current < 3nA Low ESL and Low ESR Suitable for lead free reflow-soldering Thanks to the unique IPDiA Silicon capacitor The IPDiA technology offers industry leading technology, most of the problems encountered in performances relative to Failure rate with a demanding applications can be solved. FIT<0.017. High Temperature Silicon Capacitors are This technology also offers high reliability, up to dedicated to applications where reliability up to 10 200°C is the main parameter. technologies, such as Tantalum or MLCC, and This technology features a capacitor integration capability (up to ² 250nF/mm ) which times better than alternative capacitor eliminates cracking phenomena. offers This Silicon based technology is RoHS compliant capacitance value similar to X7R dielectric, but and compatible with lead free reflow soldering with better electrical performances than C0G/NP0 process. dielectrics, up to 200°C. HTSC provides the highest capacitor stability over the full -55°C/+200°C temperature range in the market with a Temperature coefficient Lower than ±1%. HTSC429.xxx Electrical specification Capacitance value 10 22 27 33 Parameters Capacitance range Capacitance tolerances Operating temperature range Storage temperatures Temperature coefficient Breakdown voltage (BV) Capacitance variation versus RVDC Equivalent Serial Inductor (ESL) Equivalent Serial Resistor (ESR) 47 Contact IPDIA Sales 1µF 0,1 µF 935.xxx.xxx.xxx Contact Contact IPDIA Sales IPDIA Sales 2.2µF 2.7µF 935.xxx.xxx.xxx 935.xxx.xxx.xxx Contact IPDIA Sales 3.3µF 935.132.429.733 1 µF (*) Thinner thickness (as low as 100 µm thick) available, see Low Profile Silicon Capacitor product: LPSC <±1 %, from -55 °C to +200 °C 11 VDC(**) 0.1 % /V (from 0 V to RVDC) Max 1nH Max 800m (**) 1G min @ 3V,25°C 100M min @ 3V,200°C Negligible, < 0.001 % / 1000 h FIT<0.017 parts / billion hours, Max 400 µm (*) Insulation resistance (**) Other values on request. Ageing Reliability Capacitor height DC Voltage stability MLCC capacitors vs. PICS ESL (nH) @25°C 0402 C0G(NPO) vs. PICS 10 1,1 PICS 0 1 -10 C0G 0,9 C0G 0,8 -20 Capacitance change (%) 0,7 -30 X7R ESL(nH) Unit 1 nF 10 nF Value 1µF to 3.3µF(**) ±15 %(**) -55 °C to 200 °C - 70 °C to 215 °C -40 -50 0,6 0,5 0,4 -60 0,3 -70 0,2 -80 Y5V PICS 0,1 -90 0 -100 0 0 1 2 3 4 5 6 50 100 150 200 250 Fig.1 Capacitance change versus temperature variation compared with alternative dielectrics 300 350 400 450 500 550 600 650 700 750 800 7 Capacitance (pF) Bias voltage (V) Fig.2 Capacitance change versus voltage variation compared with alternative dielectrics Fig.3 ESL versus capacitance value compared with alternative dielectrics Part Number 935.132. B.2 i.e.: 3.3 µF/1812 case (HTSC type) 935.132.429.733 S. Breakdown Voltage 4 = 11V U xx Unit 0 = 10f 1 = 0.1p 2 = 1p 3 = 10p 4 = 0.1n Size 9 = 1812 Value (E6) 5 = 1n 6 = 10n 7 = 0.1u 8 = 1u 9 = 10u Termination and Outline Termination Lead-free nickel/solder coating compatible with automatic soldering technologies: reflow and manual Package outline Typ. L 1812 L 4.66 ± 0.05 W 3.56 ± 0.05 X 0.9 Y 3.4 Comp. size Typical dimensions, all dimensions in mm IPD Land patterns size Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. W Land pattern IPD component For more information, please visit: http://www.ipdia.com To contact us, email to: [email protected] Date of release: xxxxxxxxxxxxxxxx Document identifier: xxxxxxxxxxxxx Solder Resist 850 900 950 1000